Impedance compensation along a channel of emitters

1. A vertical cavity surface emitting laser (VCSEL) array, comprising:

a plurality of VCSELs; and

a metallization layer to electrically connect the plurality of VCSELs,

wherein the metallization layer has a first end and a second end,

wherein the plurality of VCSELs includes a first VCSEL and a second VCSEL,

wherein the first VCSEL is located closer to the first end than the second VCSEL,

wherein a first structure, included in the first VCSEL, is different than a second structure, included in the second VCSEL, in accordance with a difference in a first electrical impedance of the first VCSEL and a second electrical impedance of the second VCSEL when the metallization layer is powered, and

wherein the metallization layer is not included in the first structure or the second structure.

2. The VCSEL array of claim 1 , wherein a first current confinement aperture of the first VCSEL has a smaller diameter relative to a second current confinement aperture of the second VCSEL,

wherein the first current confinement aperture is the first structure and the second current confinement aperture is the second structure.

3. The VCSEL array of claim 1 , wherein a first contact of the first VCSEL is narrower than a second contact of the second VCSEL,

wherein the first contact is the first structure and the second contact is the second structure.

4. The VCSEL array of claim 1 , wherein a first implant isolation material of the first VCSEL is wider than a second implant isolation material of the second VCSEL,

wherein the first implant isolation material is the first structure and the second implant isolation material is the second structure.

5. The VCSEL array of claim 1 , wherein a difference between a first input power of the first VCSEL and a second input power of the second VCSEL satisfies a threshold.

6. The VCSEL array of claim 1 , wherein a difference between a first resistance of the first VCSEL and a second resistance of the second VCSEL satisfies a threshold.

7. The VCSEL array of claim 1 , further comprising:

a laser driver electrically connected to the first end of the metallization layer,

wherein the laser driver is configured to power the first VCSEL and the second VCSEL.

8. An emitter array, comprising:

a plurality of emitters; and

a metallization layer to electrically connect the plurality of emitters,

wherein the metallization layer has a first end and a second end,

wherein the plurality of emitters includes a first emitter and a second emitter,

wherein the first emitter is located closer to the first end than the second emitter,

wherein the first emitter and the second emitter have differently sized structures to compensate for a first impedance of the metallization layer between the first end and the first emitter and a second impedance between the first end and the second emitter, and

wherein the metallization layer is not included in a portion of the first emitter or the second emitter that includes the differently sized structures.

9. The emitter array of claim 8 , wherein the first emitter and the second emitter have differently sized current confinement apertures relative to each other as the differently sized structures.

10. The emitter array of claim 8 , wherein the first emitter and the second emitter have differently sized P-Ohmic contacts relative to each other as the differently sized structures.

11. The emitter array of claim 8 , wherein the first emitter and the second emitter have differently sized implant isolation material relative to each other as the differently sized structures.

12. The emitter array of claim 8 , wherein the first emitter and the second emitter emit an amount of light within a threshold amount of each other based on the differently sized structures.

13. The emitter array of claim 8 , wherein a first structure of the first emitter compensates for the first impedance.

14. The emitter array of claim 13 , wherein a second structure of the second emitter compensates for the second impedance,

wherein the first emitter and the second emitter receive a same amount of power based on the first structure and the second structure,

wherein the first structure and the second structure are the differently sized structures.

15. A laser array, comprising:

a plurality of laser devices; and

a metallization layer to electrically connect the plurality of laser devices,

wherein the metallization layer has a first end and a second end,

wherein the plurality of laser devices includes a first laser device and a second laser device,

wherein the first laser device is located closer to the first end than the second laser device,

wherein the first laser device and the second laser device have different structures that are configured such that a difference between a first input power to the first laser device and a second input power to the second laser device satisfies a threshold, and

wherein the metallization layer is not included in a portion of the first laser device or the second laser device that includes the different structures.

16. The laser array of claim 15 , wherein the first laser device is associated with a first current confinement aperture and the second laser device is associated with a second current confinement aperture,

wherein the second current confinement aperture is wider than the first current confinement aperture so that the difference between the first input power and the second input power satisfies the threshold,

wherein the first current confinement aperture and the second current confinement aperture are the different structures.

17. The laser array of claim 15 , wherein the first laser device is associated with a first contact and the second laser device is associated with a second contact,

wherein the second contact is wider than the first contact so that the difference between the first input power and the second input power satisfies the threshold,

wherein the first contact and the second contact are the different structures.

18. The laser array of claim 15 , wherein the first laser device is associated with a first implant isolation material and the second laser device is associated with a second implant isolation material,

wherein the second implant isolation material is wider than the first implant isolation material so that the difference between the first input power and the second input power satisfies the threshold,

wherein the first implant isolation material and the second implant isolation material are the different structures.

19. The laser array of claim 15 , wherein the different structures cause another difference between a first resistance associated with the first laser device and a second resistance associated with the second laser device to satisfy another threshold.

20. The laser array of claim 15 , wherein the different structures cause another difference between a first output power associated with the first laser device and a second output power associated with the second laser device to satisfy another threshold.