IP Library Granted Patent US 11,151,971
Granted Patent B2
US 11,151,971 · App. 16/219,336 · Granted Oct 19, 2021

Acoustic panel employing chopped fibers in septum layer and method for making same

Inventor: Amitabh Vyas (Wichita, KS)
Assignee: Spirit AeroSystems, Inc.
G10K11/002B32B3/12B32B7/12F02C7/045G10K11/162G10K11/172G10K11/175F05D2250/283F05D2300/614
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Quick Facts
Patent No.
US 11,151,971
App. No.
16/219,336
Granted
Oct 19, 2021
Kind
B2
Abstract

An acoustic panel for attenuating sound and a method of making the acoustic panel. A septum structure is created comprising a layer of chopped fibers between layers of uncured epoxy. The structure is forced onto the open ends of the cells so that the edges of the cell walls cut the structure into pieces, with each piece having the same cross-sectional size and shape as one of the cells, and the pieces are pushed further into the cells to a specific position. The epoxy layers are cured, and holes are created in the cured epoxy layers to expose the chopped fibers and create septum layers within the cells. The chopped fibers may be sufficiently long and/or strong to provide structural support across each cell but sufficiently short and/or weak to be cut by the edge of the cell wall, and may melt at a higher temperature than the epoxy cures.

Claims (38)

1. A method of making an acoustic panel having a septum layer for attenuating sound, the acoustic panel including a plurality of cells, with each cell including a cell wall having an edge at an open end of the cell, the method comprising:

creating a septum structure comprising—

a chopped fiber layer including a plurality of chopped fibers, and

at least one uncured epoxy layer;

forcing the septum structure onto the open ends of the plurality of cells so that the edges of the cell walls cut the septum structure into a plurality of individual pieces, with each individual piece having the same cross-sectional size and cross-sectional shape as one of the cells; and

curing the at least one uncured epoxy layer within the cells to form at least one cured epoxy layer.

2. The method of claim 1 , wherein the chopped fibers are non-randomly arranged in the chopped fiber layer.

3. The method of claim 1 , wherein the chopped fibers provide structural support across each cell and are cut by the edges of the cell walls.

4. The method of claim 1 , wherein the chopped fiber layer is weakened along lines which correspond to the cross-sectional shape of each cell so as to facilitate the edges of the cell walls cutting the septum structure into the plurality of individual pieces.

5. The method of claim 1 , wherein a cure temperature of the epoxy layer is lower than a melting temperature of the chopped fibers.

6. The method of claim 1 , further comprising pushing the individual pieces further into the cells to a specific position within the cells for attenuating a specific frequency or range of frequencies of sound.

7. The method of claim 1 , wherein portions of the at least one uncured epoxy layer are removed to expose the chopped fibers of the chopped fiber layer.

8. The method of claim 1 , further comprising removing portions of the at least one cured epoxy layer to expose the chopped fibers of the chopped fiber layer, thereby forming the septum layer in each cell of the acoustic panel.

9. The method of claim 1 , wherein removing portions of the at least one cured epoxy layer comprises creating a plurality of spaced apart holes in the at least one cured epoxy layer.

10. The method of claim 8 , wherein the plurality of spaced apart holes are created by at least one of lasers, rotating cutters, and electrodes.

11. The method of claim 1 , wherein the septum layer has a first uncured epoxy layer and a second uncured epoxy layer, and the chopped fiber layer is located between the first and second uncured epoxy layers.

12. The method of claim 10 , wherein removing portions of the first and second cured epoxy layers includes creating a plurality of spaced apart holes in the first and second cured epoxy layers.

13. A method of making an acoustic panel having a septum layer for attenuating sound, the acoustic panel including a plurality of cells, with each cell including a cell wall having an edge at an open end of the cell, the method comprising:

creating a septum structure comprising—

a chopped fiber layer including a plurality of chopped fibers, and

at least one uncured epoxy layer, wherein portions of the at least one uncured epoxy layer are removed to expose the chopped fibers of the chopped fiber layer;

forcing the septum structure onto the open ends of the plurality of cells so that the edges of the cell walls cut the septum structure into a plurality of individual pieces, with each individual piece having the same cross-sectional size and cross-sectional shape as one of the cells;

pushing the individual pieces further into the cells to a specific position within the cells for attenuating a specific frequency or range of frequencies of sound; and

curing the at least one uncured epoxy layer within the cells to form at least one cured epoxy layer, thereby forming the septum layer in each cell of the acoustic panel.

14. The method of claim 13 , wherein the chopped fibers are non-randomly arranged in the chopped fiber layer.

15. The method of claim 13 , wherein the chopped fibers provide structural support across each cell and are cut by the edges of the cell walls.

16. The method of claim 13 , wherein the chopped fiber layer is weakened along lines which correspond to the cross-sectional shape of each cell so as to facilitate the edges of the cell walls cutting the septum structure into the plurality of individual pieces.

17. The method of claim 13 , wherein a cure temperature of the epoxy layer is lower than a melting temperature of the chopped fibers.

18. The method of claim 13 , following curing the at least one uncured epoxy layer, the method further including reshaping the removed portions to expose the chopped fibers of the chopped fiber layer.

19. The method of claim 18 , wherein the removed portions are re-shaped by at least one of lasers, rotating cutters, and electrodes.

20. A method of making an acoustic panel having a septum layer for attenuating sound, the acoustic panel including a plurality of cells, with each cell including a cell wall having an edge at an open end of the cell, the method comprising:

creating a septum structure comprising—

a chopped fiber layer including a plurality of chopped fibers, wherein the chopped fibers provide structural support across each cell and are cut by the edges of the cell walls, and

at least one uncured epoxy layer;

forcing the septum structure onto the open ends of the plurality of cells so that the edges of the cell walls cut the septum structure into a plurality of individual pieces, with each individual piece having the same cross-sectional size and cross-sectional shape as one of the cells;

pushing the individual pieces further into the cells to a specific position within the cells for attenuating a specific frequency or range of frequencies of sound;

curing the at least one uncured epoxy layer within the cells to form at least one cured epoxy layer, wherein a cure temperature of the epoxy layer is lower than a melting temperature of the chopped fibers; and

creating a plurality of spaced apart holes in the at least one cured epoxy layer to expose the chopped fibers of the chopped fiber layer, thereby forming the septum layer in each cell of the acoustic panel.

Assignments (15)
RELEASE OF SECURITY INTEREST Recorded Dec 11, 2025
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 073932/0669 →
RELEASE OF SECURITY INTEREST Recorded Dec 10, 2025
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 073900/0356 →
RELEASE OF SECURITY INTEREST Recorded Dec 9, 2025
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 073916/0346 →
SECURITY AGREEMENT Recorded Jul 8, 2024
From: SPIRIT AEROSYSTEMS, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 068217/0456 →
RELEASE OF SECURITY INTEREST Recorded Dec 4, 2023
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
To: SPIRIT AEROSYSTEMS, INC.; SPIRIT AEROSYSTEMS HOLDINGS, INC.; SPIRIT AEROSYSTEMS NORTH CAROLINA, INC.
Reel/Frame 065772/0456 →
SECURITY AGREEMENT (SECOND LIEN NOTES) Recorded Nov 21, 2023
From: SPIRIT AEROSYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 065659/0585 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Nov 23, 2022
From: SPIRIT AEROSYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 061993/0847 →
RELEASE OF SECURITY INTEREST Recorded Nov 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 061995/0281 →
RELEASE OF SECURITY INTEREST Recorded Oct 28, 2020
From: BANK OF AMERICA, N.A.
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 054230/0578 →
SECURITY INTEREST Recorded Oct 5, 2020
From: SPIRIT AEROSYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053993/0569 →
SECURITY INTEREST Recorded Oct 5, 2020
From: SPIRIT AEROSYSTEMS, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053993/0505 →
SECURITY INTEREST Recorded Oct 5, 2020
From: SPIRIT AEROSYSTEMS, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053983/0350 →
SECURITY INTEREST Recorded Apr 17, 2020
From: SPIRIT AEROSYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 052433/0843 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Feb 24, 2020
From: SPIRIT AEROSYSTEMS, INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 052004/0929 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 13, 2018
From: VYAS, AMITABH
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 047770/0342 →