Method and apparatus for fabricating a stretchable electronic element
According to an exemplary embodiment of the present invention, by providing an apparatus for fabricating a stretchable electronic element including a chamber, a plurality of sample portions loaded into the chamber and spaced apart from each other, while the chamber is maintained at atmospheric pressure, and a movable member moving the plurality of sample portions and compressing each of the plurality of sample portions together while the chamber is kept under vacuum, it is possible to fabricate variable stretchable electronic elements.
1. An apparatus for fabricating a stretchable electronic element, comprising:
a chamber;
an upper sample portion, a middle sample portion, and a lower sample portion loaded into the chamber and spaced apart from each other in a first axis direction, while the chamber is maintained at atmospheric pressure; and
a movable member moving the upper sample portion and the middle sample portion and compressing each of the upper sample portion, the middle sample portion, and the lower sample portion together, while maintaining a vacuum state in the chamber,
wherein
the apparatus further comprises a stretchable jig unit configured to extend the middle sample portion in a second direction orthogonal to the first axis direction, prior to compressing the upper sample portion, the middle sample portion, and the lower sample portion together by the movable member, and
the upper sample portion is compressed to a first region of the middle sample portion, and includes a support film configured to induce a pattern in a second region of the middle region which is a region other than the first region.
2. The apparatus of claim 1 , further comprising
a plurality of vacuum chucks to load the upper sample portion, the middle sample portion, and the lower sample portion, and configured to remove air in the chamber to maintain the vacuum state in the chamber.
3. The apparatus of claim 1 , wherein the stretchable jig unit is radially formed to radially stretch the middle sample portion.
4. The apparatus of claim 1 , wherein
the pattern includes a planar structure or a buckling structure.
5. The apparatus of claim 1 , wherein:
the support film includes a buckling support film, and
the buckling support film includes a glass film, a ceramic film, a metal thin film, or a plastic film.
6. The apparatus of claim 1 , wherein
the support film is shaped as a circular cylinder, a triangular column, a quadrangular column, or a cone with the central part cut off.
7. The apparatus of claim 1 , wherein
a Young's modulus of the support film is at least 0.1 MPa.
8. The apparatus of claim 1 , wherein
the upper sample portion is disposed on the support film, and includes a first pressure dispersion layer configured to uniformly disperse pressure by the upper sample portion to the middle sample portion through the support film.
9. The apparatus of claim 8 , wherein the middle sample portion includes
an adhesive film, and
a first release film patterned on the adhesive film to block the adhesive film from the first pressure dispersion layer and protect the adhesive film from the first pressure dispersion layer.
10. The apparatus of claim 9 , wherein
the movable member compresses the plurality of sample portions under pressure of 10 −2 MPa to 10 6 MPa.
11. The apparatus of claim 9 , wherein the lower sample portion includes:
an electronic element;
a second pressure dispersion layer disposed under the electronic element, and constantly dispersing pressure by the lower sample portion to the middle sample portion through the electronic element; and
a second release film disposed between the second pressure dispersion layer and the electronic element to block the second pressure dispersion layer from the adhesive film and protect the adhesive film from the second pressure dispersion film.
12. The apparatus of claim 11 , wherein the lower sample portion includes:
a heat-resistant substrate configured to support the electronic element, and
a sacrificial film disposed between the heat-resistant substrate and the electronic element, and configured to support the electronic element.
13. The apparatus of claim 12 , wherein
a thickness of the heat-resistant substrate is between 100 nm and 1000 μm.
14. The apparatus of claim 11 ,
further comprising a plurality of other electronic elements different from the electronic element, and
wherein the electronic element and the plurality of other electronic elements are disposed in a vertical structure, a parallel structure, a tandem structure, or a composite structure.