Micro assembler with fine angle control
An assembly surface has an array of electrodes arranged such that each of a plurality of chiplets can be positioned to cover at least one of the electrodes. A field generator applies a rotation field that is orthogonal to the clamping force field applied by the electrodes. A processor is operable to determine a desired orientation angle of a first subset of the chiplets and activate one or more of the electrodes so that a second subset of the chiplets different than the first subset is kept from rotating by a clamping force field applied by the one or more of the electrodes. While the clamping force field is being applied, the processor applies the rotation field at the selected angle to cause the first subset of the chiplets to be oriented at the desired orientation angle.
1. An apparatus, comprising:
an assembly surface comprising an array of electrodes arranged such that each of a plurality of chiplets can be positioned to cover at least one of the electrodes, each of the electrodes capable of being individually activated to apply a clamping force field to one of the chiplets;
a field generator that applies a rotation field that is orthogonal to the clamping force field applied by the electrodes, the field generator comprising an input that selects an angle of the rotation field; and
a processor coupled to the electrodes and the field generator, the processor operable to:
determine a desired orientation angle of a first subset of the chiplets;
activate one or more of the electrodes so that a second subset of the chiplets different than the first subset is kept from rotating by the clamping force field applied by the one or more of the electrodes; and
while the clamping force field is being applied, apply the rotation field at a selected angle to cause the first subset of the chiplets to be oriented at the desired orientation angle.
2. The apparatus of claim 1 , wherein the rotation field comprises a magnetic field and wherein the clamping force field comprises an electrostatic field.
3. The apparatus of claim 2 , wherein the magnetic field is generated by a first pair of coils located on a first pair of opposite sides of the assembly surface and a second pair of coils located on a second pair of opposite sides of the assembly surface different from the first pair of opposite sides, the angle of the rotation field selectable by varying first and second currents applied to the respective first and second pairs of coils.
4. The apparatus of claim 2 , wherein the magnetic field is generated by a pair of magnets, the angle of the rotation field being selected via relative rotation between the magnets and the assembly surface.
5. The apparatus of claim 2 , wherein the chiplets comprise patterned magnetic material such that the chiplets will align with the magnetic field.
6. The apparatus of claim 2 , wherein each of the second subset of chiplets are over two or more of the electrodes, wherein activating the electrodes comprises selecting, for each of the second subset of chiplets, one of the two or more electrodes that will minimize an induced electric field that interferes with the magnetic field.
7. The apparatus of claim 1 , wherein applying the rotation field comprises time-varying a direction of the rotation field around the selected angle to induce small movements in the first subset of the chiplets, the small movements overcoming stiction between the first subset of the chiplets and the assembly surface.
8. The apparatus of claim 1 , wherein the chiplets comprise 2-D materials.
9. An apparatus, comprising:
an assembly surface comprising an array of electrodes arranged such that each of a plurality of chiplets can be positioned to cover at least one of the electrodes, each of the electrodes capable of being individually activated to apply a clamping force field to one of the chiplets;
at least one magnet that is configurable via an input to exert a magnetic field on the chiplets at a selectable angle relative to the assembly surface; and
a processor coupled to the electrodes and the at least one magnet, the processor operable to:
determine a desired orientation angle of a first subset of the chiplets;
activate one or more of the electrodes so that a second subset of the chiplets different than the first subset is kept from rotating by the clamping force field applied by the one or more of the electrodes; and
while the clamping force field is being applied, activate the at least one magnet at a selected angle to cause the first subset of the chiplets to be oriented at the desired orientation angle.
10. The apparatus of claim 9 , wherein the at least one magnet comprises:
a first pair of coils located on a first pair of opposite sides of the assembly surface; and
a second pair of coils located on a second pair of opposite sides of the assembly surface different from the first pair of opposite sides, the selectable angle of the magnetic field selectable by varying first and second currents applied to the respective first and second pairs of coils.
11. The apparatus of claim 9 , wherein the at least one magnet comprises a pair of magnets on opposite sides of the assembly surface, the apparatus further comprising a motor that induces relative rotation between the pair of magnets and the assembly surface, the selectable angle of the magnetic field selected via the motor.
12. The apparatus of claim 9 , wherein the chiplets comprise patterned magnetic material such that the chiplets will align with the magnetic field.
13. The apparatus of claim 9 , wherein each of the second subset of chiplets are over two or more of the electrodes, wherein activating the electrodes comprising selecting, for each of the second subset of chiplets, one of the two or more electrodes that will minimize an induced electric field that interferes with the magnetic field.
14. The apparatus of claim 9 , wherein activating the at least one magnet at the selected angle comprises time-varying a direction of the magnetic field around the selected angle to induce small movements in the first subset of the chiplets, the small movements overcoming stiction between the first subset of the chiplets and the assembly surface.
15. A method comprising:
arranging a plurality of chiplets on an assembly surface such that the chiplets do not interfere with one another, the assembly surface comprising an array of electrodes and the chiplets arranged such that each chiplet is over at least one of the electrodes;
determining a desired orientation angle of a first subset of the chiplets;
activating one or more of the electrodes so that a second subset of the chiplets different than the first subset is kept from rotating by a clamping force field applied by the one or more electrodes; and
applying a rotation field that is orthogonal to the clamping force field applied by the one or more electrodes, an angle of the rotation field selectable to cause the first subset of the chiplets to be oriented at the desired orientation angle.
16. The method of claim 15 , wherein the rotation field comprises a magnetic field and wherein the clamping force field comprises an electrostatic field.
17. The method of claim 16 , wherein the magnetic field is generated by a first pair of coils located on a first pair of opposite sides of the assembly surface and a second pair of coils located on a second pair of opposite sides of the assembly surface different from the first pair of opposite sides, the angle of the rotation field selectable by varying first and second currents applied to the respective first and second pairs of coils.
18. The method of claim 16 , wherein the magnetic field is generated by a pair of magnets, the angle of the rotation field selectable via relative rotation between the magnets and the assembly surface.
19. The method of claim 16 , wherein each of the second subset of chiplets are over two or more of the electrodes, wherein activating the electrodes comprising selecting, for each of the second subset of chiplets, one of the two or more electrodes that will minimize an induced electric field that interferes with the magnetic field.
20. The method of claim 15 , wherein applying the rotation field comprises time-varying a direction of the rotation field around the angle to induce small movements in the first subset of the chiplets, the small movements overcoming stiction between the first subset of the chiplets and the assembly surface.
21. The method of claim 15 , further comprising activating an additional one or more electrodes under at least one chiplet of the first subset to fix a rotation point of the at least one chiplet while allowing the at least one chiplet to rotate around the rotation point in response to the rotation field.