IP Library Granted Patent US 11,015,435
Granted Patent B2
US 11,015,435 · App. 16/221,843 · Granted May 25, 2021

Distributed sensor arrays for measuring one or more of pressure and temperature and related methods and assemblies

Inventors: Matthew Palmer (Sandy, UT); Tyler Sorensen (Bluffdale, UT); G. Scott Brown (Eagle Mountain, UT); K. Robert Harker (Herriman, UT); Trent Heath (Kaysville, UT)
Assignee: Quartzdyne, Inc.
E21B47/07E21B47/017E21B47/06E21B47/135E21B47/26G01K1/026G01K1/08G01K7/32
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Quick Facts
Patent No.
US 11,015,435
App. No.
16/221,843
Granted
May 25, 2021
Kind
B2
Abstract

A downhole sensor includes a sensor housing with one or more of a pressure sensor or a temperature sensor. A cable segment having a conductor is coupled to the sensor housing. A spacer or retention element is coupled to or secured to at least a portion of the conductor at a location proximate an interface between the cable segment and the sensor housing. Downhole sensor arrays include such sensor housings. Methods relate to forming such sensor arrays.

Claims (34)

1. A downhole distributed sensor array, comprising:

a plurality of sensor housings, each sensor housing containing at least one of a pressure sensor or a temperature sensor;

a plurality of cable segments connecting the sensor housings, at least one of the cable segments comprising a conductor extending through the at least one cable segment; and

a spacer positioned adjacent and coupled and secured to at least a portion of the conductor at a location proximate an interface between the at least one cable segment and a respective sensor housing of the sensor housings coupled to the at least one cable segment, the spacer configured to at least partially secure the conductor and at least partially prevent movement in a direction along a length of the conductor, the conductor being in direct contact with and extending through and beyond the spacer to connect with the at least one of a pressure sensor or a temperature sensor, wherein an interface between the spacer and the at least a portion of the conductor comprises a threaded interface for securing the conductor to the spacer.

2. The distributed sensor array of claim 1 , wherein the at least one of a pressure sensor or a temperature sensor comprises a quartz resonator sensor.

3. The distributed sensor array of claim 1 , wherein the spacer is positioned about an exposed portion of the conductor of the at least one cable segment.

4. The distributed sensor array of claim 3 , wherein the at least one cable segment comprises an insulation material disposed between a portion of the conductor and a portion of a jacket of the at least one cable segment, the insulation material extending along a majority of a length of the at least one cable segment between adjacent sensor housings.

5. The distributed sensor array of claim 4 , wherein the conductor substantially lacks the insulation material proximate the spacer.

6. The distributed sensor array of claim 5 , further comprising another insulation material separate from the insulation material positioned between the conductor and the at least one cable segment.

7. The distributed sensor array of claim 6 , wherein the another insulation material comprises at least one of a first sleeve comprising a polymer material or a second sleeve comprising a metal or metal alloy material.

8. The distributed sensor array of claim 1 , wherein the spacer comprises at least one opening extending axially through the spacer.

9. The distributed sensor array of claim 1 , wherein the spacer is positioned between an end of the at least one of cable segment and a portion of the sensor housing in order to secure the conductor.

10. The distributed sensor array of claim 1 , wherein the spacer is positioned adjacent to an end portion of the at least one cable segment.

11. The distributed sensor array of claim 10 , wherein the spacer abuts the end portion of the at least one cable segment.

12. A downhole distributed sensor array, comprising:

a plurality of sensor housings containing at least one of a pressure sensor or a temperature sensor;

a plurality of cable segments, each cable segment connected to at least one sensor housing and comprising an insulation material disposed between a central conductor and an outer jacket;

a weld joint peripherally bonding a longitudinal end portion of the at least one sensor housing to the outer jacket of a cable segment of the cable segments; and

a retention element positioned outside and proximate to the cable segment, a portion of the central conductor of the cable segment being secured to the retention element to at least substantially inhibit the central conductor from moving in a direction along the length of the array.

13. The distributed sensor array of claim 12 , wherein the retention element is configured to secure the central conductor to substantially prevent the central conductor from moving in a direction along a length of the cable segment extending between adjacent sensor housings.

14. The distributed sensor array of claim 12 , wherein the retention element is substantially prevented from moving in a direction along a length of the cable segment between adjacent sensor housings by at least a portion of the sensor housing.

15. A downhole sensor comprising:

a sensor housing containing at least one of a pressure sensor or a temperature sensor;

at least one cable segment coupled to the sensor housing, the at least one cable segment having a conductor extending through the at least one cable segment; and

a retention element positioned about and coupled to at least a portion of the conductor at a location proximate an interface between the at least one cable segment and the sensor housing, the retention element configured to secure the conductor in a direction along a length of the conductor to at least substantially prevent the conductor from moving in a direction along the length of the conductor.

16. The downhole sensor of claim 15 , wherein the sensor housing comprises a plurality of sensor housings, each having at least one cable segment coupled to the sensor housing and at least one retention element coupled to a conductor of the at least one cable segment.

17. A method of forming a sensor for downhole use, the method comprising:

removing a portion of an insulation material from between a conductor of a cable segment and a jacket of the cable segment proximate an end portion of the cable segment to create an annular opening between the conductor and a surrounding portion of the jacket;

disposing at least one insulative material within the annular opening, the at least one insulative material being distinct from the portion of the insulation material;

securing a spacer to the conductor proximate the end portion of the cable segment by threading the spacer to the conductor; and

inserting the end portion of the cable segment with the spacer secured to the conductor into a sensor housing.

18. The method of claim 17 , further comprising abutting the spacer with the end portion of the cable segment.

19. The method of claim 17 , further comprising securing another conductor of another cable segment to the sensor housing with another spacer.

20. The method of claim 17 , further comprising at least substantially preventing the conductor from moving in a direction along a length of the cable segment with the spacer.

Assignments (6)
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Jul 17, 2025
From: JPMORGAN CHASE BANK, N.A.
To: CHAMPIONX LLC; APERGY ESP SYSTEMS, LLC; APERGY BMCS ACQUISITION CORP; HARBISON-FISCHER, INC.; NORRIS RODS, INC.,; NORRIS RODS, INC.,; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; US SYNTHETIC CORPORATION
Reel/Frame 072004/0019 →
MERGER Recorded Dec 20, 2023
From: QUARTZDYNE, INC.
To: CHAMPIONX LLC
Reel/Frame 065925/0979 →
RELEASE OF SECURITY INTEREST Recorded Jun 7, 2022
From: BANK OF AMERICA, N.A.
To: ACE DOWNHOLE, LLC; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; APERGY BMCS ACQUISITION CORP.; NORRISEAL-WELLMARK, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
Reel/Frame 060305/0001 →
SECURITY INTEREST Recorded Jun 5, 2020
From: ACE DOWNHOLE, LLC; APERGY BMCS ACQUISITION CORP.; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053790/0001 →
SECURITY AGREEMENT Recorded Nov 6, 2019
From: APERGY ESP SYSTEMS, LLC; APERGY BMCS ACQUISITION CORP.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; THETA OILFIELD SERVICES, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 050941/0695 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2018
From: PALMER, MATTHEW; SORENSEN, TYLER; BROWN, G. SCOTT; HARKER, K. ROBERT; HEATH, TRENT
To: QUARTZDYNE, INC.
Reel/Frame 047794/0183 →