Power supply for socket assembly

1. A socket assembly for an electronic system comprising:

a socket connector including a printed circuit board defining a socket substrate having an upper surface and a lower surface, the socket connector including upper socket contacts on the upper surface configured to be terminated to an electronic package, the socket connector including lower socket contacts configured to be terminated to a host circuit board, the upper socket contacts being electrically connected to the corresponding lower socket contacts through the socket substrate to electrically connect the electronic package to the host circuit board, the socket connector including a first power contact, the socket connector including a second power contact electrically connected to the first power contact, the first power contact configured to be terminated to the electronic package; and

a power connector separate and discrete from the socket substrate and terminated to the socket substrate, the power connector having a power connector terminal being electrically connected to the second power contact;

wherein the printed circuit board defining the socket substrate is configured to electrically connect the power connector to the electronic package through the first power contact and the second power contact.

2. The socket assembly of claim 1 , wherein the first and second power contacts are on the upper surface.

3. The socket assembly of claim 1 , wherein the power connector powers the electronic package through the first power contact and the second power contact without passing the power through the host circuit board.

4. The socket assembly of claim 1 , wherein the socket connector includes a power conductor contained within the socket substrate being electrically connected between the first power contact and the second power contact.

5. The socket assembly of claim 1 , wherein the socket substrate includes a first mating area and a second mating area spaced apart from the first mating area, the socket substrate receiving the electronic package at the first mating area, the socket substrate receiving the power connector at the second mating area.

6. The socket assembly of claim 1 , further comprising a socket frame coupled to the upper surface of the socket substrate, the socket frame having a frame wall defining a frame opening receiving the electronic package.

7. The socket assembly of claim 6 , wherein the power connector is spaced apart from the socket frame.

8. The socket assembly of claim 6 , wherein the socket frame has a frame footprint on the socket substrate, the socket substrate extending beyond the frame footprint, the power connector has a power connector footprint on the socket substrate not overlapping the frame footprint.

9. The socket assembly of claim 1 , wherein the power connector includes a power connector housing having a slot configured to receive a power supply component, the power connector terminal being exposed in the slot to engage and electrically connect to the power supply component.

10. The socket assembly of claim 1 , wherein the power connector includes a straddle mount housing including an upper mount coupled to the upper surface and a lower mount coupled to the lower surface, the power connector terminal being an upper power connector terminal coupled to the upper surface, the straddle mount housing holding a lower power connector terminal coupled to the lower surface.

11. The socket assembly of claim 1 , wherein the power connector terminal includes a terminating end being press-fit into the socket substrate to electrically connect to the second power contact.

12. The socket assembly of claim 1 , wherein the second power contact comprises a contact pad printed on the socket substrate.

13. The socket assembly of claim 1 , wherein the second power contact comprises a plated via in the socket substrate.

14. The socket assembly of claim 1 , wherein the first power contact comprises a compressible spring finger having a compressible mating interface for interfacing with the electronic package.

15. The socket assembly of claim 1 , wherein the lower socket contacts and the upper socket contacts transmit data signals between the host circuit board and the electronic package.

16. A socket assembly for an electronic system comprising:

a socket connector including a printed circuit board defining a socket substrate having an upper surface and a lower surface, the socket connector including upper socket contacts on the upper surface configured to be terminated to an electronic package, the socket connector including lower socket contacts configured to be terminated to a host circuit board, the upper socket contacts being electrically connected to the corresponding lower socket contacts through the socket substrate to electrically connect the electronic package to the host circuit board, the socket connector including a first power contact, the socket connector including a second power contact electrically connected to the first power contact, the first power contact configured to be terminated to the electronic package;

a socket frame coupled to the upper surface of the socket substrate, the socket frame having at least one frame wall forming a frame opening above the upper surface configured to locate the electronic package on the upper surface of the socket substrate; and

a power connector separate and discrete from the socket substrate and terminated to the socket substrate exterior of the frame opening, the power connector having a power connector terminal being electrically connected to the second power contact;

wherein the printed circuit board defining the socket substrate is configured to electrically connect the power connector to the electronic package through the first power contact and the second power contact.

17. The socket assembly of claim 16 , wherein the power connector powers the electronic package through the first power contact and the second power contact without passing the power through the host circuit board.

18. The socket assembly of claim 16 , wherein the socket substrate includes a first mating area and a second mating area spaced apart from the first mating area, the socket substrate receiving the electronic package at the first mating area, the socket substrate receiving the power connector at the second mating area.

19. The socket assembly of claim 16 , wherein the socket frame has a frame footprint on the socket substrate, the socket substrate extending beyond the frame footprint, the power connector has a power connector footprint on the socket substrate not overlapping the frame footprint.

20. A socket assembly for an electronic system comprising:

a socket connector including a printed circuit board defining a socket substrate having an upper surface and a lower surface, the lower surface having a lower mating area configured to be mated to a host circuit board, the socket substrate having a first upper mating area for mating with an electronic package, the socket substrate having a second upper mating area for mating with a power connector;

upper socket contacts at the first upper mating area for mating with the electronic package;

lower socket contacts at the lower mating area for mating with the host circuit board, the lower socket contacts being electrically connected to corresponding upper socket contacts;

first power contacts at the first upper mating area for mating with the electronic package; and

second power contacts at the second upper mating area for mating with the power connector, the second power contacts being electrically connected to corresponding first power contacts;

wherein the upper socket contacts and the first power contacts in the first upper mating area define a package interface for mating with the electronic package, wherein the lower socket contacts define a host circuit board interface for mating with the host circuit board, and wherein the second power contacts define a power connector interface for mating with the power connector;

wherein the printed circuit board defining the socket substrate is configured to electrically connect the power connector to the electronic package through the first power contact and the second power contact, and wherein the socket substrate is configured to electrically connect the host circuit board to the electronic package through the lower socket contacts and the upper socket contacts.