IP Library Granted Patent US 11,637,225
Granted Patent B2
US 11,637,225 · App. 16/226,313 · Granted Apr 25, 2023

Converter with glass layers

Inventors: Grigoriy Basin (San Francisco, CA); Mooi Guan Ng (Fremont, CA); Lex Alan Kosowsky (San Jose, CA); Phillip Barton (Santa Clara, CA)
Assignee: Lumileds LLC
H01L33/504C09K11/02H01L33/501H01L33/505H01L33/56H01L33/60H01L33/508H01L2933/005H01L2933/0041
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Quick Facts
Patent No.
US 11,637,225
App. No.
16/226,313
Granted
Apr 25, 2023
Kind
B2
Abstract

A wavelength converting layer may have a glass or a silicon porous support structure. The wavelength converting layer may also have a cured portion of wavelength converting particles and a binder filling the porous glass or silicon support structure.

Claims (34)

1. A wavelength converting layer comprising:

a porous support structure including a stack of multiple discrete quartz or glass mesh layers bonded together, all fibers or strings of each mesh layer being confined to only that layer; and

a cured mixture including wavelength converting particles and a binder, the cured mixture filling the porous support structure within and between the multiple mesh layers and bonding together the stack of multiple mesh layers.

2. The wavelength converting layer of claim 1 , wherein the binder includes a silicone.

3. The wavelength converting layer of claim 1 , wherein the binder includes one or more fillers configured to increase a refractive index.

4. The wavelength converting layer of claim 1 , wherein the wavelength converting particles include phosphor particles or pre-formed ceramic phosphor.

5. The wavelength converting layer of claim 1 , the stack of multiple mesh layers being bonded together by being at least partially fused together.

6. The wavelength converting layer of claim 1 , wherein the stack of multiple mesh layers includes one or more layers of woven support material.

7. The wavelength converting layer of claim 6 , wherein a first woven support material includes the fibers or strings that extend across substantially 100% of a transverse dimension of the stack of multiple mesh layers.

8. A light emitting device comprising:

a wavelength converting layer, and

a semiconductor active layer,

the wavelength converting layer comprising a porous support structure including (i) a stack of multiple discrete quartz or glass mesh layers bonded together, all fibers or strings of each mesh layer being confined to only that layer, and (ii) a cured mixture including wavelength converting particles and a binder, the cured mixture filling the porous support structure within and between the multiple mesh layers and bonding together the stack of multiple mesh layers,

the wavelength converting layer being positioned and arranged to absorb first light emitted from the active layer at a first wavelength, and to emit second light at a second wavelength different from the first wavelength.

9. The light emitting device of claim 8 , wherein the binder includes a silicone.

10. The light emitting device of claim 8 , wherein the binder includes one or more fillers configured to increase a refractive index.

11. The light emitting device of claim 8 , wherein the wavelength converting particles include phosphor particles or pre-formed ceramic phosphor.

12. The light emitting device of claim 8 , the stack of multiple mesh layers being bonded together by being at least partially fused together.

13. The light emitting device of claim 8 , wherein the stack of multiple mesh layers includes one or more layers of woven support material.

14. The light emitting device of claim 13 , wherein a first woven support material includes the fibers or strings that extend across substantially 100% of a transverse dimension of the stack of multiple mesh layers.

15. A method comprising:

filling a porous support structure with a mixture that includes wavelength converting particles and an uncured binder, the porous support structure including a stack of multiple discrete quartz or glass mesh layers, all fibers or strings of each mesh layer being confined to only that layer, the mixture filling the porous support structure within and between the stacked mesh layers, and

curing the mixture filling the porous support structure so as to bond together the stack of multiple mesh layers and form a wavelength converting layer.

16. The method of claim 15 wherein the binder includes a silicone, or the wavelength converting particles include phosphor particles or pre-formed ceramic phosphor.

17. The method of claim 15 wherein the stack of multiple mesh layers includes one or more layers of woven support material.

18. The method of claim 15 further comprising:

partially curing the mixture,

positioning multiple semiconductor light emitting devices against corresponding portions of the porous support structure filled with the partially cured mixture, and

attaching the light emitting devices to the corresponding portions of the wavelength converting layer by completing curing of the mixture,

each portion of the wavelength converting layer being positioned and arranged to absorb first light emitted by an active layer of the corresponding attached light emitting device at a first wavelength, and to emit second light at a second wavelength different from the first wavelength.

19. The method of claim 18 further comprising:

before positioning the light emitting devices, singulating the porous support structure filled with the partially cured mixture, and

positioning each light emitting device against a corresponding singulated portion of the porous support structure filled with the partially cured mixture.

20. The method of claim 18 further comprising, after completing curing of the mixture, singulating the wavelength converting layer so that each light emitting device is attached to a corresponding singulated portion of the wavelength converting layer.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2025
From: LUMILEDS LLC
To: LUMILEDS SINGAPORE PTE. LTD.
Reel/Frame 071888/0086 →
RELEASE OF SECURITY INTEREST Recorded Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 3, 2023
From: BASIN, GRIGORIY; NG, MOOI GUAN; KOSOWSKY, LEX ALAN; BARTON, PHILLIP
To: LUMILEDS LLC
Reel/Frame 062877/0030 →
SECURITY INTEREST Recorded Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
PATENT SECURITY AGREEMENT Recorded Dec 9, 2022
From: LUMILEDS, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 062114/0001 →