Closed loop temperature controlled circuit to improve device stability
An integrated circuit is provided having an active circuit. A heating element is adjacent to the active circuit and configured to heat the active circuit. A temperature sensor is also adjacent to the active circuit and configured to measure a temperature of the active circuit. A temperature controller is coupled to the active circuit and configured to receive a temperature signal from the temperature sensor. The temperature controller operates the heating element to heat the active circuit to maintain the temperature of the active circuit in a selected temperature range.
1. A method comprising:
forming an active circuit in a semiconductor substrate;
forming a temperature sensor in the substrate;
forming a temperature controller in the substrate;
forming a first dielectric layer on the substrate over the active circuit, the temperature sensor, and the temperature controller;
forming a plurality of apertures in the first dielectric layer;
forming a plurality of first contacts in the apertures in the first dielectric layer;
forming a plurality of first metal lines overlaying the first dielectric layer;
forming a heating element between two of the first metal lines;
forming a second dielectric layer over the heating element and the first metal lines;
forming a plurality of apertures in the second dielectric layer over two or more of the first metal lines;
forming a plurality of second contacts in the apertures in the second dielectric layer over the two or more of the first metal lines; and
forming a plurality of second metal lines overlaying the second contacts.
2. The method according to claim 1 wherein the forming of the heating element between the two of the first metal lines includes forming a thin film heating element between the two of the first metal lines.
3. The method according to claim 2 wherein the thin film heating element comprises TaAl.
4. The method according to claim 1 wherein the forming of the plurality of first metal lines overlaying the first dielectric layer includes forming at least two of the first metal lines over two of the first contacts disposed over the temperature controller, forming at least two of the first metal lines over two of the first contacts disposed over the active circuit, and forming at least one of the first metal lines over the temperature sensor.
5. The method according to claim 4 wherein the forming of the heating element between the two of the first metal lines includes forming the heating element between one of the at least two of the first metal lines over the temperature controller and one of the at least one of the first metal lines over the temperature sensor.
6. The method according to claim 1 wherein the forming of the temperature sensor in the substrate includes forming a band gap temperature sensor in the substrate.
7. The method according to claim 1 wherein the temperature sensor or the temperature controller is formed as part of the active circuit.
8. The method according to claim 1 wherein the first dielectric layer comprises silicon nitride or silicon oxide.
9. A method comprising:
forming an active circuit in a semiconductor substrate;
forming a band gap temperature sensor in the substrate;
forming a temperature controller in the substrate;
depositing a first dielectric layer on the substrate over the active circuit, the temperature sensor, and the temperature controller;
forming a plurality of apertures in the first dielectric layer over the active circuit and the temperature controller;
forming a plurality of first contacts in the apertures in the first dielectric layer over the active circuit and the temperature controller;
forming a plurality of first metal lines overlaying the first dielectric layer;
forming a heating element between two of the first metal lines;
depositing a second dielectric layer over the heating element and the first metal lines;
forming a plurality of apertures in the second dielectric layer over two or more of the first metal lines;
forming a plurality of second contacts in the apertures in the second dielectric layer over the two or more of the first metal lines; and
forming a plurality of second metal lines overlaying the second dielectric layer and the second contacts.
10. The method according to claim 9 wherein the heating element comprises TaAl.
11. The method according to claim 9 wherein the forming of the plurality of first metal lines overlaying the first dielectric layer includes forming at least two of the first metal lines over two of the first contacts disposed over the temperature controller, forming at least two of the first metal lines over two of the first contacts disposed over the active circuit, and forming at least one of the first metal lines over the temperature sensor.
12. The method according to claim 11 wherein the forming of the heating element between the two of the first metal lines includes forming the thin film heating element between one of the at least two of the first metal lines over the temperature controller and one of the at least one of the first metal lines over the temperature sensor.
13. The method according to claim 9 wherein the temperature sensor or the temperature controller is formed as part of the active circuit.
14. The method according to claim 9 wherein the first dielectric layer comprises silicon nitride or silicon oxide.
15. The method according to claim 9 wherein the forming of the apertures in the first dielectric layer over the active circuit and the temperature controller includes etching a plurality of portions of the first dielectric layer over the active circuit and the temperature controller.
16. A method, comprising:
forming an active circuitry in an active region of a semiconductor substrate;
forming a temperature sensor circuitry in the active region adjacent to the active circuit;
forming a temperature controller circuitry in the active region coupled to the temperature sensor circuitry;
forming a dielectric layer over the active circuitry, the temperature sensor circuitry and the temperature controller circuitry;
forming an interconnection structure in and through the dielectric layer, the interconnection structure coupled to the temperature controller circuitry; and
forming a thin film element over the dielectric layer, the thin film element coupled to the interconnection structure,
wherein the thin film element is structured to generate a heat in response to receiving a current from the temperature controller circuitry.
17. The method of claim 16 wherein the temperature sensor circuitry is structured to measure a temperature of the active circuitry.
18. The method of claim 16 wherein the thin film element is tantalum aluminum alloy.
19. The method of claim 16 wherein the temperature sensor circuitry includes a bandgap temperature sensor.