Method of controlling the placement of micro-objects on a micro-assembler
Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patterns may be part of a library of control patterns.
1. A method, comprising:
detecting a set of micro-objects on a surface of a micro-assembler comprising an array of force generating pixels;
determining a set of positions of the set of micro-objects;
determining a second set of positions of the set of micro-objects;
identifying one or more types of the set of micro-objects;
identifying a set of control patterns from a control pattern library based on the set of positions and the one or more types of the set of micro-objects;
identifying a second set of control patterns from the control pattern library based on the second set of positions and the one or more types of the set of micro-objects;
manipulating the set of micro-objects using the set of control patterns, wherein each control pattern of the set of control patterns indicates a force pattern on a portion of the array of force generating pixels; and
manipulating the set of micro-objects using the second set of control patterns.
2. The method of claim 1 , further comprising:
determining a set of orientations of the set of micro-objects, wherein the set of control patterns is identified further based on the set of orientations of the set of micro-objects.
3. The method of claim 1 , wherein the control pattern library comprises control patterns that cause one or more of electrophoretic forces or dielectrophoretic forces to be exerted on the set of micro-objects.
4. The method of claim 3 , wherein the one or more of electrophoretic forces or dielectrophoretic forces one or more of:
move the set of micro-objects;
hold the set of micro-objects in an area;
rotate the set of micro-objects; and
change a set of orientations of the set of micro-objects.
5. The method of claim 1 , wherein determining a set of positions of the set of micro-objects comprises:
obtaining an image of the set of micro-objects; and
analyzing the image to determine the set of positions of the set of micro-objects.
6. The method of claim 1 , wherein the set of positions of the set of micro-objects is determined by determining a set of boundaries of the set of micro-objects.
7. The method of claim 1 , wherein the set of control patterns are one or more of:
automatically generated by a computing device;
based on user input; and
based on previous testing of the set of control patterns.
8. The method of claim 1 , wherein the set of control patterns indicate voltages with different polarity.
9. The method of claim 1 , wherein the set of control patterns indicates at least one refresh rate for a first control pattern of the set of control patterns.
10. The method of claim 1 , wherein each control pattern of the set of control patterns further indicates a center position and an orientation for a respective voltage pattern.
11. The method of claim 1 , wherein manipulating the set of micro-objects on the surface of the micro-assembler comprises:
controlling orientations of the set of micro-objects in three dimensions relative to the surface of the micro-assembler.
12. The method of claim 1 , wherein different control patterns of the set of control patterns are used at different time periods.