Laser foil trim approaches for foil-based metallization for solar cells
Laser foil trim approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter and the metal foil sheet has a portion overhanging the perimeter. The method also includes laser scribing the metal foil sheet along the perimeter of the wafer using a laser beam that overlaps the metal foil sheet outside of the perimeter of the wafer and at the same time overlaps a portion of the unified pairing of the metal foil sheet and the wafer inside the perimeter of the wafer to remove the portion of the metal foil sheet overhanging the perimeter and to provide a metal foil piece coupled to the surface of the wafer.
1. A method of fabricating a solar cell, the method comprising:
attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter, a metal foil sheet side opposite a wafer side, and a portion of the metal foil sheet overhanging the perimeter; and
laser scribing the metal foil sheet from the metal foil sheet side and along the perimeter of the wafer, the laser scribing comprising removing the portion of the metal foil sheet overhanging the perimeter to provide a metal foil piece coupled to the surface of the wafer, wherein the laser scribing overlaps the wafer inside the perimeter of the wafer and is outside an outermost emitter region of the wafer.
2. The method of claim 1 , wherein attaching the metal foil sheet to the surface of the wafer comprises using a technique selected from the group consisting of a laser welding process, a thermocompression process and an ultrasonic bonding process.
3. The method of claim 1 , wherein the laser scribing comprises using a laser beam having a width approximately in the range of 300-600 microns.
4. The method of claim 1 , wherein the laser scribing comprises using a laser beam having a central axis aligned to the perimeter of the wafer.
5. The method of claim 1 , wherein the laser scribing comprises using a galvanometer alignment system to align a laser beam to the perimeter of the wafer.
6. The method of claim 1 , wherein the laser scribing comprises using a continuous laser beam process.
7. The method of claim 1 , wherein the laser scribing comprises using a pulsed laser beam process.
8. A method of fabricating a solar cell, the method comprising:
attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter, a metal foil sheet side opposite a wafer side, and a portion of the metal foil sheet overhanging the perimeter; and
laser scribing the metal foil sheet from the metal foil sheet side and along the perimeter of the wafer, the laser scribing comprising removing the portion of the metal foil sheet overhanging the perimeter to provide a metal foil piece coupled to the surface of the wafer, the laser scribing further comprising welding a portion of the metal foil sheet to the wafer inside the perimeter of the wafer and is outside an outermost emitter region of the wafer, wherein the laser scribing overlaps the wafer inside the perimeter of the wafer and is outside an outermost emitter region of the wafer.
9. The method of claim 8 , wherein welding the portion of the metal foil sheet to the wafer comprises using the wafer as a heat sink during the laser scribing.
10. The method of claim 8 , wherein attaching the metal foil sheet to the surface of the wafer comprises using a technique selected from the group consisting of a laser welding process, a thermocompression process and an ultrasonic bonding process.
11. The method of claim 8 , wherein the laser scribing comprises using a laser beam having a width approximately in the range of 300-600 microns.
12. The method of claim 8 , wherein the laser scribing comprises using a laser beam having a central axis aligned to the perimeter of the wafer.
13. The method of claim 8 , wherein the laser scribing comprises using a galvanometer alignment system to align a laser beam to the perimeter of the wafer.
14. The method of claim 8 , wherein the laser scribing comprises using a continuous laser beam process or a pulsed laser beam process.
15. A method of fabricating a solar cell, the method comprising:
attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter, a metal foil sheet side opposite a wafer side, and a portion of the metal foil sheet overhanging the perimeter; and
laser scribing the metal foil sheet from the metal foil sheet side using a first laser beam, laser scribing the metal foil sheet from the wafer side using a second laser beam and along the perimeter of the wafer, the laser scribing comprising removing the portion of the metal foil sheet overhanging the perimeter to provide a metal foil piece coupled to the surface of the wafer, wherein the laser scribing overlaps the wafer inside the perimeter of the wafer and outside an outermost emitter region of the wafer.
16. The method of claim 15 , wherein attaching the metal foil sheet to the surface of the wafer comprises using a technique selected from the group consisting of a laser welding process, a thermocompression process and an ultrasonic bonding process.
17. The method of claim 15 , wherein the laser scribing comprises using a first laser beam and a second laser beam having a width approximately in the range of 300-600 microns.
18. The method of claim 15 , wherein the laser scribing comprises using a first laser beam and a second laser beam having a central axis aligned to the perimeter of the wafer.
19. The method of claim 15 , wherein the laser scribing comprises using a galvanometer alignment system to align the central axis of the first laser beam and the second laser beam to the perimeter of the wafer.
20. The method of claim 15 , wherein the laser scribing comprises using a continuous laser beam process or a pulsed laser beam process.