IP Library Granted Patent US 11,133,594
Granted Patent B2
US 11,133,594 · App. 16/240,057 · Granted Sep 28, 2021

System and method with multilayer laminated waveguide antenna

Inventor: Majid Ahmadloo (Lowell, MA)
Assignee: VEONEER US, INC.
H01Q13/06H01Q1/422H01Q13/18H01Q23/00
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Quick Facts
Patent No.
US 11,133,594
App. No.
16/240,057
Granted
Sep 28, 2021
Kind
B2
Abstract

A waveguide antenna apparatus includes a lower laminate layer of non-radio-frequency (RF) material and a first layer of conductive material formed on a top surface of the lower laminate layer of non-RF material. A middle layer of non-RF material formed over the first layer of conductive material, the middle layer of non-RF material comprising a waveguide cavity formed through the middle layer of non-RF material, such that air forms a propagation medium for radiation in the waveguide cavity. An upper layer of non-RF material is formed over the middle layer of non-RF material, and a second layer of conductive material is formed on a top surface of the upper layer of non-RF material, the first and second layers of conductive material and the waveguide cavity being part of a waveguide antenna.

Claims (32)

1. An apparatus, comprising:

a lower laminate layer of non-radio-frequency (RF) material, the non-RF material being glass-reinforced epoxy laminate material;

a middle layer of the non-RF material formed over the first layer of conductive material, the middle layer of the non-RF material comprising a waveguide cavity formed through the middle layer of the non-RF material, such that air forms a propagation medium for radiation in the waveguide cavity, a thickness of the middle layer of the non-RF material defining a dimension of the waveguide cavity;

an upper layer of the non-RF material formed over the middle layer of the non-RF material;

a first layer of conductive material formed under the middle layer of the non-RF material; and

a second layer of conductive material formed over the middle layer of the non-RF material, the first and second layers of conductive material and the waveguide cavity being part of a waveguide antenna.

2. The apparatus of claim 1 , wherein the second layer of conductive material comprises a pattern of openings.

3. The apparatus of claim 2 , wherein the pattern of openings comprises a pattern of slots such that the waveguide antenna is a slot antenna.

4. The apparatus of claim 2 , wherein the pattern of openings comprises a pattern of patch openings such that the waveguide antenna is a slotted waveguide antenna.

5. The apparatus of claim 2 , wherein the pattern of openings comprises a pattern of patch openings such that the waveguide antenna can be configured as a differential pair antenna.

6. The apparatus of claim 2 , further comprising a protecting layer of the non-RF material formed over the second layer of conductive material to seal the openings, the protecting layer functioning as a radome.

7. The apparatus of claim 1 , further comprising a plurality of through vias formed through the layers of the non-RF material and surrounding the waveguide cavity to define a boundary of the waveguide cavity.

8. The apparatus of claim 1 , further comprising a feeding structure for coupling the waveguide antenna to associated circuitry.

9. The apparatus of claim 8 , wherein the associated circuitry is formed on at least one of the lower and upper layers of the non-RF material.

10. The apparatus of claim 8 , wherein the associated circuitry is formed on both of the lower and upper layers of the non-RF material.

11. The apparatus of claim 8 , wherein the associated circuitry comprises a monolithic microwave integrated circuit (MMIC).

12. The apparatus of claim 8 , wherein:

the associated circuitry comprises a monolithic microwave integrated circuit (MMIC) mounted over the top surface of the upper layer of the non-RF material and other associated circuitry mounted under a bottom surface of the lower layer of the non-RF material; and

the feeding structure comprises a first connection between the MIMIC and the other associated circuitry and a second connection between the MIMIC and the waveguide antenna.

13. The apparatus of claim 8 , wherein:

the associated circuitry comprises a monolithic microwave integrated circuit (MMIC) and other associated circuitry mounted under a bottom surface of the lower layer of the non-RF material; and

the feeding structure comprises a connection between the MIMIC and the waveguide antenna.

14. The apparatus of claim 8 , wherein:

the associated circuitry comprises a monolithic microwave integrated circuit (MMIC) mounted under a bottom surface of the upper layer of the non-RF material and within the waveguide cavity and other associated circuitry mounted under a bottom surface of the lower layer of the non-RF material; and

the feeding structure comprises a connection between the MIMIC and the waveguide antenna.

15. The apparatus of claim 1 , wherein the waveguide antenna is a receive antenna structure.

16. The apparatus of claim 1 , wherein the waveguide antenna is a transmit antenna structure.

17. The apparatus of claim 1 , further comprising multiple waveguide cavities and radiating slots forming multiple transmit and receive antennas tightly placed in a single laminar package.

18. The apparatus of claim 1 , wherein a configuration of radiating slots is selected to radiate various polarizations such as vertical and/or horizontal polarizations.

19. The apparatus of claim 1 , wherein:

the first layer of conductive material is formed on a top surface of the lower laminate layer of the non-RF material; and

the second layer of conductive material is formed on a top surface of the upper layer of the non-RF material.

Assignments (4)
CHANGE OF NAME Recorded Apr 25, 2024
From: VEONEER US, LLC
To: MAGNA ELECTRONICS, LLC
Reel/Frame 067234/0861 →
AFFIDAVIT / CHANGE OF ADDRESS Recorded Feb 3, 2023
From: VEONEER US, LLC
To: VEONEER US, LLC
Reel/Frame 065049/0150 →
CHANGE OF NAME Recorded Aug 3, 2022
From: VEONEER US, INC.
To: VEONEER US, LLC
Reel/Frame 061069/0535 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 23, 2019
From: AHMADLOO, MAJID
To: VEONEER US, INC.
Reel/Frame 048967/0780 →
Continuity (1)
Related Publication 20200220273A1 · Jul 9, 2020
Cited By (2)
US 12,489,188 US 12,489,208