Low noise capacitors
Relatively low noise capacitors are provided for surface mounted applications. Electro-mechanical vibrations generate audible noise, which are otherwise relatively reduced through modifications to MLCC device structures, and/or their mounting interfaces on substrates such as printed circuit boards (PCBs). Different embodiments variously make use of flexible termination compliance so that surface mounting has reduced amplitude vibrations transmitted to the PCB. In other instances, side terminal and transposer embodiments effectively reduce the size of the mounting pads relative to the case of the capacitor, or a molded enclosure provides standoff, termination compliance and clamping of vibrations.
1. A surface mountable relatively low noise multilayer ceramic capacitor (MLCC) capacitor assembly, comprising:
a main body comprising a ceramic material;
a plurality of conductive layers of respective first and second polarities interleaved with a plurality of ceramic layers to form respective pairs of opposing capacitor plates in a stacked arrangement within the main body; and
respective first and second polarity terminations on opposite ends of said main body and electrically connected, respectively, to said first and second polarity conductive layers, wherein each of said terminations include a respective compliant layer comprising a silver filled polymer, wherein the compliant layer is configured to dampen vibrations and reduce electro-mechanical noise such that the capacitor assembly exhibits a peak sound pressure level of less than 37 dB over a frequency range of 1 kHz to 10 kHz at a distance of 2 mm when tested at 3.15 VAC and 3.15 VDC.
2. The capacitor assembly of claim 1 , wherein the compliant layers are configured to dampen vibrations and reduce electro-mechanical noise such that the capacitor assembly has a figure of merit less than about 0.52 Pa-Hz.
3. The capacitor assembly of claim 1 , wherein the first polarity termination further comprises a flashing layer, and wherein the first compliant layer is formed over the flashing layer.
4. The capacitor assembly of claim 3 , wherein the flashing layer comprises copper.
5. The capacitor assembly of claim 3 , wherein the first polarity termination further comprises a plating layer, and wherein the plating layer is formed over the first compliant layer.
6. The capacitor assembly of claim 5 , wherein the plating layer comprises nickel and tin.
7. A surface mountable multilayer ceramic capacitor assembly, comprising:
a main body comprising a ceramic material;
a first plurality of conductive layers disposed within the main body;
a second plurality of conductive layer disposed within the main body and capacitively coupled with the first plurality of conductive layers; and
a first termination disposed on a first end of the main body and electrically connected with the first plurality of conductive layers;
a second termination disposed on a second end of the main body and electrically connected with the second plurality of conductive layers;
wherein each of the terminations include a respective compliant layer having a modulus of elasticity of less than 5 GPa, wherein the respective compliant layers are configured to dampen vibrations and reduce electro-mechanical noise such that the capacitor assembly exhibits a peak sound pressure level of less than 37 dB over a frequency range of 1 kHz to 10 kHz at a distance of 2 mm when tested at 3.15 VAC and 3.15 VAC.
8. The capacitor assembly of claim 7 , wherein the compliant layer is configured to dampen vibrations and reduce electro-mechanical noise such that the capacitor assembly has a figure of merit less than about 0.52 Pa-Hz.
9. The capacitor assembly of claim 7 , wherein the compliant layer comprises at least one of a silver-polymer layer, a silver filled polymer, a copper filled polymer, or a nickel filled polymer.
10. The capacitor assembly of claim 7 , wherein each the first termination further comprises a flashing layer, and wherein the first compliant layer is formed over the flashing layer.
11. The capacitor assembly of claim 10 , wherein the flashing layer comprises copper.
12. The capacitor assembly of claim 11 , wherein the first termination further comprises a plating layer, and wherein the plating layer is formed over the first compliant layer.
13. The capacitor assembly of claim 12 , wherein the plating layer comprises nickel and tin.
14. Methodology for relatively reducing electro-mechanical noise associated with a surface mountable multilayer ceramic capacitor (MLCC) capacitor assembly, comprising:
providing a main body having a plurality of conductive layers of respective first and second polarities interleaved with a plurality of ceramic layers to form respective pairs of opposing capacitor plates in a stacked arrangement; and
forming respective first and second polarity terminations on opposite ends of said main body and electrically connected, respectively, to said first and second polarity conductive layers,
wherein said terminations include a compliant layer for relatively dampening vibrations between such capacitor assembly and a surface on which it is mounted for relatively reducing electro-mechanical noise, wherein the capacitor assembly exhibits a peak sound pressure level of less than 37 dB over a frequency range of 1 kHz to 10 kHz at a distance of 2 mm when tested at 3.15 VAC and 3.15 VDC.