Semiconductor device with bidirectional diode
Provided is a semiconductor device, including: a drain region of a first conductivity type and a source region of the first conductivity type in a semiconductor substrate; a base region of a second conductivity type between the drain region and the source region; a base contact region of the second conductivity type in the base region; a gate electrode on the base region through a gate insulating film; a bidirectional diode overlapping with the gate electrode in a first direction perpendicular to the semiconductor substrate, and having one end electrically connected to the gate electrode and the other end electrically connected to the source region; a source metal layer electrically connected to the source region, the base contact region, and the other end of the bidirectional diode; and a gate metal layer electrically connected to the gate electrode, and overlapping with the source metal layer in the first direction.
1. A semiconductor device, comprising:
a semiconductor substrate;
a drain region of a first conductivity type and a source region of the first conductivity type formed in the semiconductor substrate;
a base region of a second conductivity type formed between the drain region and the source region;
a base contact region of the second conductivity type formed in the base region and being higher in concentration than the base region;
a gate electrode formed in the base region through a gate insulating film so that a channel is formed in the base region;
a bidirectional diode having a first end electrically connected to the source region;
a source metal layer electrically connected to the source region, the base contact region, and the first end of the bidirectional diode; and
a gate metal layer electrically connected to the gate electrode, and overlapping at least partially with the source metal layer in a first direction perpendicular to a surface of the semiconductor substrate, in at least a part of a region on the semiconductor substrate,
wherein the gate electrode is composed of a polysilicon layer of the first conductivity type,
wherein the bidirectional diode includes the gate electrode, a second polysilicon layer of the second conductivity type formed on the gate electrode, and a third polysilicon layer of the first conductivity type formed on the second polysilicon layer, and
wherein the gate electrode, the second polysilicon layer, and the third polysilicon layer are arranged in this order in the first direction.
2. The semiconductor device according to claim 1 , further comprising a trench formed in the semiconductor substrate;
wherein the drain region is formed in the semiconductor substrate to have a predetermined thickness from a rear surface of the semiconductor substrate,
wherein the trench reaches an upper surface of the drain region from an upper surface of the semiconductor substrate,
wherein the gate insulating film covers inner bottom and side surfaces of the trench, and
wherein the gate electrode is embedded in the trench through the gate insulating film.
3. The semiconductor device according to claim 2 , wherein the second polysilicon layer is embedded in the trench through the gate insulating film.
4. The semiconductor device according to claim 3 , wherein the third polysilicon layer is embedded in in the trench through the gate insulating film.
5. The semiconductor device according to claim 1 , wherein the bidirectional diode is provided in the semiconductor substrate through the gate insulating film.
6. The semiconductor device according to claim 1 , wherein a second end of the bidirectional diode is connected to the gate metal layer, and the first end of the bidirectional diode is connected to the source metal layer.