IP Library Granted Patent US 10,459,498
Granted Patent B1
US 10,459,498 · App. 16/241,983 · Granted Oct 29, 2019

Heat dissipation in a three chamber chassis of a personal computer

Inventors: Robert Michael Kinstle, III (Fremont, CA); Dennis Wai Cheung Lee (Fremont, CA); Joseph-Eamonn L. Clerkin (Fremont, CA); Dustin Alexander Sklavos (Fremont, CA)
Assignee: Corsair Memory, Inc.
G06F1/20H05K5/0213H05K7/20172H05K7/20272
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Quick Facts
Patent No.
US 10,459,498
App. No.
16/241,983
Granted
Oct 29, 2019
Kind
B1
Abstract

According to certain embodiments, a computer chassis is divided into three isolated thermal chambers to confine the heat loads in separately managed areas.

Claims (22)

1. A computer chassis comprising:

a chassis frame encompassing a chassis cavity, the computer chassis having a top chassis portion oriented in a first X-Y plane of the computer chassis, a bottom chassis portion oriented in a second X-Y plane of the computer chassis, a front chassis portion oriented in a first X-Z plane of the computer chassis, and a rear chassis portion oriented in a second X-Z plane of the computer chassis;

a right side outer panel oriented in a first Y-Z plane of the computer chassis;

a left side outer panel oriented in a second Y-Z plane of the computer chassis;

a central solid bulkhead in the chassis cavity, the central solid bulkhead occupying an entire cross sectional area of the chassis cavity and is oriented in a third Y-Z plane of the computer chassis, where the third Y-Z plane is located about midway in an X direction of the computer chassis,

wherein:

the central solid bulkhead runs from the top chassis portion to the bottom chassis portion and from the front chassis portion to the rear chassis portion; and

the central solid bulkhead divides the chassis cavity into a first chassis cavity portion and a second chassis cavity portion;

a chamber partition in the second chassis cavity portion, the chamber partition occupying an entire cross sectional area of the second chassis cavity portion and is oriented in an X-Y plane and divides the second chassis cavity portion to create a third chassis cavity portion;

wherein the first chassis cavity portion forms a first thermal chamber of the computer chassis, the second chassis cavity portion forms a second thermal chamber of the computer chassis; and the third chassis cavity portion forms a third thermal chamber of the computer chassis.

2. The computer chassis of claim 1 , wherein the second chassis cavity portion is for housing a motherboard and a corresponding central processing unit associated with the motherboard.

3. The computer chassis of claim 1 , wherein the first chassis cavity portion is for housing a graphics processing unit.

4. The computer chassis of claim 1 , wherein the third chassis cavity portion is for housing a power supply unit.

5. The computer chassis of claim 1 , wherein the first chassis cavity portion is for housing a first radiator unit.

6. The computer chassis of claim 1 , wherein the second chassis cavity portion is for housing a second radiator unit.

7. The computer chassis of claim 5 , wherein the first radiator unit is associated with a pump to circulate liquid coolant from a heat source in the computer chassis to the first radiator unit, wherein the liquid coolant removes heat from the heat source and the liquid coolant is cooled at the first radiator unit.

8. The computer chassis of claim 6 , wherein the second radiator unit is associated with a pump to circulate liquid coolant from a heat source in the computer chassis to the second radiator unit, wherein the liquid coolant removes heat from the heat source and the liquid coolant is cooled at the second radiator unit.

9. The computer chassis of claim 1 , further comprising at least one exhaust fan located at the top chassis portion, wherein the at least one exhaust fan pulls air out of the first and second thermal chambers of the computer chassis.

10. The computer chassis of claim 1 , further comprising at least one fan located in the third thermal chamber to supply airflow to the power supply unit based on an internal temperature of the power supply unit.

11. The computer chassis of claim 1 , wherein the right side outer panel allows air from outside the computer chassis to flow into the computer chassis.

12. The computer chassis of claim 1 , wherein the left side outer panel allows air from outside the computer chassis to flow into the computer chassis.

13. The computer chassis of claim 1 , wherein the bottom chassis portion allows air from outside the computer chassis to flow into the computer chassis.

Assignments (2)
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 3, 2021
From: CORSAIR MEMORY, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 057407/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 7, 2019
From: KINSTLE, ROBERT MICHAEL, III; LEE, DENNIS WAI CHUENG; CLERKIN, JOSEPH-EAMONN L.; SKLAVOS, DUSTIN ALEXANDER
To: CORSAIR MEMORY, INC.
Reel/Frame 047923/0463 →
Cited By (1)
US 12,324,122