Electrical connection to a micro electro-mechanical system
A MEMS device includes, in part, first and second conductive semiconductor substrates, an insulating material disposed between the semiconductor substrates, a cavity formed in the second semiconductor substrate, and at least first and second drive masses each of which includes a multitude of beams etched from the first semiconductor substrate and is adapted to move in the cavity in response to an applied force. At least a first portion of the first substrate is adapted to move in response to the applied force and causes the at least first and second drive mass to be in electrical communication with the first substrate. The device may further include, in part, a coupling spring disposed between and in electrical communication with the first and second drive masses. The coupling spring is adapted to provide electrical communication between a second portion of the first substrate and the first and second drive masses.
1. A MEMS device comprising:
a first electrically conductive semiconductor substrate;
a second electrically conductive semiconductor substrate;
an insulating material disposed between the first and second conductive semiconductor substrates;
a cavity formed in the second conductive semiconductor substrate, said second conductive semiconductor substrate extending along a bottom of the cavity; and
at least first and second drive masses each comprising a plurality of beams etched from the first conductive semiconductor substrate and adapted to move in the cavity and in response to an applied force, wherein at least a first portion of the first conductive semiconductor substrate is adapted to move in response to the applied force and causes the at least first and second drive mass to be in electrical communication with the first conductive semiconductor substrate.
2. The MEMS device of claim 1 further comprising:
at least one coupling spring disposed between and in electrical communication with the at least first and second drive masses, said at least one coupling spring adapted to provide electrical communication between a second portion of the first conductive substrate and the first and second drive masses, said second portion of the first conductive semiconductor substrate adapted not to move in response to the applied force.
3. The MEMS device of claim 1 wherein said first and second semiconductor substrates are silicon substrates and the first insulating layer is a silicon oxide layer.
4. The MEMS device of claim 1 further comprising an isolation joint formed in the first conductive semiconductor substrate.
5. The MEMS device of claim 4 further comprising at least one spring isolated from at least a portion of each of the first and second drive masses by the isolation joint.
6. The MEMS device of claim 1 wherein each of the plurality of beams is a silicon beam.
7. The MEMS device of claim 1 further comprising:
a metal layer formed on a surface of the first semiconductor substrate; and
a wirebond in electrical communication with the second portion of the first semiconductor substrate via the metal layer.