IP Library Patent Application 16245183
Patent Application
App. No. 16/245,183

ACCURATE THREE-DIMENSIONAL PRINTING

Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US None
App. No.
16/245,183
Abstract

The present disclosure provides three-dimensional (3D) printing methods, apparatuses, and systems using, inter alia, a controller that regulates formation of at least one 3D object (e.g., in real time during the 3D printing); and a non-transitory computer-readable medium facilitating the same. For example, a controller that regulates a deformation of at least a portion of the 3D object. The control may be in situ control. The control may be real-time control during the 3D printing process. For example, the control may be during a physical-attribute pulse. The present disclosure provides various methods, apparatuses, systems and software for estimating the fundamental length scale of a melt pool, and for various tools that increase the accuracy of the 3D printing.

Claims (32)

1 . A method for three-dimensional printing analysis, comprising:

(a) using at least one processor to execute a simulation of an electrical circuit model to produce a result, which electrical circuit model comprises one or more electrical component that analogize a heat capacity and/or a thermal conductivity of a material type used in the three-dimensional printing to print at least one three-dimensional object that includes one or more layers, which simulation evaluates a temperature distribution of the at least one three-dimensional object; and

(b) using the at least one processor to output the result.

2 . The method of claim 1 , wherein the simulation occurs during a time at which a layer of one or more layers is printed by the three-dimensional printing.

3 . The method of claim 1 , wherein using the at least one processor to output the result comprises storing the result in a computer memory device.

4 . The method of claim 1 , wherein the result is configured for utilization in printing the at least one three-dimensional objects.

5 . The method of claim 1 , wherein the electrical circuit model comprises an electrical component, which electrical component comprises a passive or an electromechanical component.

6 . The method of claim 1 , wherein the electrical circuit model comprises an electronic component, which electrical component comprises a variable component.

7 . The method of claim 1 , wherein the simulation comprises using the electrical circuit model to imitate one or more the physical properties of the three-dimensional printing by using electrical circuit model.

8 . The method of claim 1 , wherein the electrical circuit model comprises a resistor, capacitor, ground element, current source, voltage element, or an electrical branch.

9 . The method of claim 8 , wherein the electrical branch comprises a resistor coupled in parallel to a capacitor.

10 . The method of claim 8 , wherein the electrical branch represents one or more physical properties related to printing the at least one three-dimensional object.

11 . The method of claim 10 , wherein the one or more physical properties comprises a (i) heat profile, (ii) thermal history, (iii) power profile of an energy source utilized in the three-dimensional printing, or (iv) irradiation profile of an energy beam utilized in the three-dimensional printing.

12 . The method of claim 1 , wherein the three-dimensional printing comprises transforming at least a portion of a pre-transformed material using an energy beam.

13 . The method of claim 12 , wherein the pre-transformed material is at least a portion of a material bed, and wherein the material bed is planarized using an apparatus comprising a cyclonic separator.

14 . The method of claim 12 , wherein the pre-transformed material comprises at least one member selected from the group consisting of an elemental metal, metal alloy, ceramic, and an allotrope of elemental carbon.

15 . A non-transitory computer-readable medium in which program instructions are stored, which instructions, when read by a computer, cause the computer to perform operations comprising:

(a) executing a simulation of an evolution of a temperature distribution in at least one three-dimensional object that develops during three-dimensional printing of the at least one three-dimensional object, to produce a result, which simulating is by using an electrical circuit model that comprises one or more electrical components, which one or more electrical components are analogous to a heat capacity and/or a thermal conductivity of a material type used in the three-dimensional printing to print the at least one three-dimensional object; and

(b) outputting the result of executing the simulation.

16 . The non-transitory computer-readable medium of claim 15 , wherein outputting comprise storing the result in a computer memory device.

17 . The non-transitory computer-readable medium of claim 15 , wherein the result is utilized to affect the three-dimensional printing of the at least one three-dimensional object.

18 . The non-transitory computer-readable medium of claim 15 , wherein the result is configured to be utilized for predicting a deviation of the at least one three-dimensional object from at least one requested three-dimensional object.

19 . The non-transitory computer-readable medium of claim 15 , wherein the simulation occurs during a time at which a layer of one or more layers is printed by the three-dimensional printing.

20 . The non-transitory computer-readable medium of claim 15 , wherein the electrical circuit model comprises an electrical component, which electrical component comprises a passive or an electromechanical component.

21 . The non-transitory computer-readable medium of claim 15 , wherein the electrical circuit model comprises an electronic component, which electrical component comprises a variable component.

22 . The non-transitory computer-readable medium of claim 15 , wherein the simulation comprises using the electrical circuit model to imitate one or more the physical properties of the three-dimensional printing by using electrical circuit model.

23 . The non-transitory computer-readable medium of claim 15 , wherein the electrical circuit model comprises a resistor, capacitor, ground element, current source, voltage element, or an electrical branch.

24 . The non-transitory computer-readable medium of claim 23 , wherein the electrical branch comprises a resistor coupled in parallel to a capacitor.

25 . The non-transitory computer-readable medium of claim 23 , wherein the electrical branch represents one or more physical properties.

26 . The non-transitory computer-readable medium of claim 25 , wherein the one or more physical properties comprises a (i) heat profile, (ii) thermal history, (iii) power profile of an energy source utilized in the three-dimensional printing, or (iv) irradiation profile of an energy beam utilized in the three-dimensional printing.

27 . The non-transitory computer-readable medium of claim 23 , wherein the three-dimensional printing comprises transforming at least a portion of a pre-transformed material using an energy beam.

28 . The non-transitory computer-readable medium of claim 27 , wherein the pre-transformed material comprises at least one member selected from the group consisting of an elemental metal, metal alloy, ceramic, and an allotrope of elemental carbon.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded Sep 8, 2023
From: SILICON VALLEY BANK, A DIVISION OF FIRST- CITIZENS BANK & TRUST COMPANY (SUCCESSOR BY PURCHASE TO THE FEDERAL DEPOSIT INSURANCE CORPORATION AS RECEIVER FOR SILICON VALLEY BRIDGE BANK, N.A. (AS SUCCESSOR TO SILICON VALLEY BANK))
To: VELO3D, INC.
Reel/Frame 064845/0523 →
RELEASE OF SECURITY INTEREST Recorded Sep 8, 2023
From: SILICON VALLEY BANK, A DIVISION OF FIRST- CITIZENS BANK & TRUST COMPANY (SUCCESSOR BY PURCHASE TO THE FEDERAL DEPOSIT INSURANCE CORPORATION AS RECEIVER FOR SILICON VALLEY BRIDGE BANK, N.A. (AS SUCCESSOR TO SILICON VALLEY BANK))
To: VELO3D, INC.
Reel/Frame 064845/0840 →
SECURITY INTEREST Recorded May 17, 2021
From: VELO3D, INC.
To: SILICON VALLEY BANK, AS ADMINISTRATIVE AND COLLATERAL AGENT
Reel/Frame 056259/0328 →
SECURITY INTEREST Recorded May 17, 2021
From: VELO3D, INC.
To: SILICON VALLEY BANK, AS ADMINISTRATIVE AND COLLATERAL AGENT
Reel/Frame 056259/0341 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2019
From: BULLER, BENYAMIN; LAPPAS, TASSO; LAPPEN, ALAN RICK
To: VELO3D, INC.
Reel/Frame 048757/0757 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2019
From: BULLER, BENYAMIN; LAPPAS, TASSO; LAPPEN, ALAN RICK
To: VELO3D, INC.
Reel/Frame 048214/0001 →