Galvanic isolation for isolation transformer

1. A galvanic separating apparatus, comprising

a printed circuit board, the printed circuit board comprising a first soldering pad, a second soldering pad and a recess, whereby the pads are arranged on a lower side of the printed circuit board thereby defining a clearance and/or creepage distance between the pads, and the recess is arranged between the pads,

a bobbin arranged on an upper side of the printed circuit board, the bobbin comprising an axle and a pair of flanges,

a primary insulated winding layer connected to the first soldering pad and a second insulated winding layer connected to the second soldering part, whereby the winding layers are arranged on the upper side of the printed circuit board and are wound about the axle of the bobbin within the pair of flanges, and

an insulating layer, whereby the insulating layer extends from the upper side through the recess and protrudes on the lower side beyond the printed circuit board thereby increasing the clearance and/or creepage distance, whereby

a portion of the insulating layer is arranged within the bobbin between the pair of flanges, and

the clearance and/or creepage distance is ≥1.2 a distance between the pads on the lower side of the printed circuit board.

2. The galvanic separating apparatus according to claim 1 , whereby the insulating layer comprises an insulation plate which extends parallel to the printed circuit board and perpendicular to the insulating layer, and is arranged between the printed circuit board and the winding layers.

3. The galvanic separating apparatus according to claim 1 , whereby the insulating layer extends at least partly perpendicular to the printed circuit board.

4. The galvanic separating apparatus according to claim 1 , comprising a second insulation layer which extends parallel to the printed circuit board and is arranged in between and thereby insulating the winding layers from each other.

5. The galvanic separating apparatus according to claim 1 , whereby the conductor paths are insulated from each other by potting.

6. The galvanic separating apparatus according to claim 1 , whereby the primary winding layer and/or the secondary winding layer comprises a THT or SMT bobbin.

7. The galvanic separating apparatus according to claim 1 , whereby the first soldering pad and/or the second soldering pad comprises a THT pin.

8. The galvanic separating apparatus according to claim 1 , whereby the insulating layer is removable fixed to the winding layers.

9. The galvanic separating apparatus according to claim 1 , whereby the insulating layer comprises a thickness of 1 mm.

10. The galvanic separating apparatus according to claim 1 , whereby the distance between the pads on the lower side of the printed circuit board is ≥3 mm.

11. The galvanic separating apparatus according to claim 1 , whereby the clearance and/or creepage distance is 1.5 times the distance.

12. The galvanic separating apparatus according to claim 1 , whereby the insulating layer protrudes on the lower side beyond the printed circuit board ≥0.25 times of the distance.

13. The galvanic separating apparatus according to claim 1 , whereby the insulating layer protrudes beyond the winding layers in a direction parallel to and/or away from the printed circuit board.

14. The galvanic separating apparatus according to claim 2 , whereby the insulating layer extends at least partly perpendicular to the printed circuit board.

15. The galvanic separating apparatus according to claim 14 , comprising a second insulation layer which extends parallel to the printed circuit board and is arranged in between and thereby insulating the winding layers from each other.

16. The galvanic separating apparatus according to claim 1 , whereby the insulating layer comprises a thickness of ≥2 mm.

17. The galvanic separating apparatus according to claim 1 , whereby the distance between the pads on the lower side of the printed circuit board is ≥5.5 mm.

18. The galvanic separating apparatus according to claim 1 , whereby the clearance and/or creepage distance is ≥2.5 times the distance.

19. The galvanic separating apparatus according to claim 1 , whereby the insulating layer is arranged in between and thereby insulates the winding layers from each other and protrudes beyond the winding layers.

20. The galvanic separating apparatus according to claim 1 , whereby the insulating layer comprises an insulation plate which extends parallel to the printed circuit board on the upper side and perpendicular to the insulating layer, and is arranged within the bobbin between the pair of flanges and between the printed circuit board and the winding layers.

21. The galvanic separating apparatus according to claim 1 , whereby the bobbin comprises a THT or SMT bobbin.

22. The galvanic separating apparatus according to claim 1 , whereby the primary winding layer and/or the secondary winding layer comprises helical conductor paths and the helical conductor paths comprise a triple isolation according to IEC 60950.

23. The galvanic separating apparatus according to claim 1 , whereby

the insulating layer is arranged in between the winding layers with the primary insulated winding layer being on one side of the insulating layer and the secondary insulated winding layer being disposed on another side of the insulating layer, the insulating layer thereby insulating the winding layers from each other, and

the insulating layer protruding beyond the winding layers on the upper side of the printed circuit board and extending through the recess to protrude on the lower side of the printed circuit board.