Laser slicing apparatus and laser slicing method
A laser slicing apparatus for dividing a workpiece with a laser beam, including: a light shielding area detection section that detects light shielding areas existing on a side of a first surface of the workpiece; and a control section that radiates a first laser beam from the side of the first surface so as to scan across a whole area of the first surface of the workpiece and form a first modified layer in a to-be-sliced plane inside the workpiece, and that radiates a second laser beam to the light shielding areas of the workpiece from a second surface on an opposite side of the first surface and form a second modified layer in such a manner that the second modified layer is continuous with the first modified layer in the to-be-sliced plane.
1. A laser slicing apparatus configured to divide a workpiece horizontally into an upper layer side and a lower layer side with a laser beam including a first laser beam and a second laser beam, the laser slicing apparatus comprising:
a hardware processor configured to: detect a defective part existing on a side of a first surface of the workpiece;
radiate the first laser beam from the side of the first surface so as to scan across a whole area of the first surface of the workpiece, the first laser beam having a first point of convergence, and form a first modified layer coinciding with the first point of convergence in a to-be-sliced plane inside the workpiece; and
radiate the second laser beam to, in plan view, only an area where the defective part exists in the workpiece from a second surface on an opposite side of the first surface, the second laser beam having a second point of convergence, and form a second modified layer coinciding with the second point of convergence in such a manner that the second modified layer is continuous with the first modified layer in the to-be-sliced plane,
wherein the laser slicing apparatus is configured to slice the workpiece horizontally into the upper layer side and the lower layer side along the to-be-sliced plane in a detaching step, after the first modified layer and the second modified layer are formed.
2. The laser slicing apparatus according to claim 1 , wherein a substrate material is separated from the workpiece.
3. The laser slicing apparatus according to claim 2 , wherein the workpiece is a plate-like body.
4. The laser slicing apparatus according to claim 3 , wherein the workpiece is a plate-like member which has undergone a planarizing process until the first surface and the second surface have a predetermined surface roughness or less.
5. The laser slicing apparatus according to claim 1 , wherein the workpiece is a plate-like semiconductor material having a first plate surface and a second plate surface, and the first surface is a surface of a side where more of the defective part are exposed among the first plate surface and the second plate surface of the workpiece.
6. The laser slicing apparatus according to claim 1 , wherein the workpiece is a semiconductor material, and wherein the side of the first surface is located on the upper layer side, and wherein the upper layer side is used as a semiconductor wafer.
7. The laser slicing apparatus according to claim 1 , wherein the workpiece is gallium nitride, and wherein the side of the first surface is located on the upper layer side, and wherein the upper layer side is used as a semiconductor wafer.
8. The laser slicing apparatus according to claim 1 , wherein the workpiece is a brittle material.
9. The laser slicing apparatus according to claim 1 , wherein the hardware processor sets a focus point of the first laser beam to a height position of the to-be-sliced plane to form the first modified layer and sets a focus point of the second laser beam to the height position of the to-be-sliced plane to form the second modified layer.
10. The laser slicing apparatus according to claim 9 , wherein the hardware processor causes a laser beam path of a laser beam radiated by a laser oscillator to switch to radiate the first laser beam and the second laser beam to the workpiece.
11. The laser slicing apparatus according to claim 1 , wherein the hardware processor detects the defective part on a basis of information from a camera that captures an image of a surface state of the first surface of the workpiece.
12. A laser slicing method for slicing a workpiece horizontally into an upper layer side and a lower layer side with a laser beam including a first laser beam and a second laser beam, the method comprising:
detecting a defective part existing on a side of a first surface of the workpiece;
radiating the first laser beam from the side of the first surface so as to scan across a whole area of the first surface of the workpiece, the first laser beam having a first point of convergence, and forming a first modified layer coinciding with the first point of convergence in a to-be-sliced plane inside the workpiece; and
radiating the second laser beam to, in plan view, only an area where the defective part exists in the workpiece from a second surface on an opposite side of the first surface, the second laser beam having a second point of convergence, and forming a second modified layer coinciding with the second point of convergence in such a manner that the second modified layer is continuous with the first modified layer in the to-be-sliced plane,
slicing the workpiece horizontally into the upper layer side and the lower layer side along the to-be-sliced plane in a detaching step, after the first modified layer and the second modified layer are formed.
13. The laser slicing apparatus according to claim 1 , wherein a width of a radiation region of the second laser is a width corresponding to a width of the defective part on the first surface of the workpiece in cross-sectional view of the workpiece.