IP Library Granted Patent US 10,655,993
Granted Patent B2
US 10,655,993 · App. 16/248,070 · Granted May 19, 2020

Thermal flow meter including a cover mounted on a housing and where a bypass passage is formed by the cover and a bypass passage trench

Inventors: Noboru Tokuyasu (Hitachinaka, JP); Shinobu Tashiro (Hitachinaka, JP); Keiji Hanzawa (Hitachinaka, JP); Takeshi Morino (Hitachinaka, JP); Ryosuke Doi (Hitachinaka, JP); Akira Uenodan (Hitachinaka, JP)
Assignee: Hitachi Automotive Systems, Ltd.
G01F1/684G01F1/6842G01F1/6845G01F1/6965G01F15/14
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Quick Facts
Patent No.
US 10,655,993
App. No.
16/248,070
Granted
May 19, 2020
Kind
B2
Abstract

The present invention has been made to improve measurement accuracy of a thermal flow meter. In the thermal flow meter according to the invention, a circuit package ( 400 ) that measures a flow rate is molded in a first resin molding process. In a second resin molding process, a housing ( 302 ) having an inlet trench ( 351 ), a bypass passage trench on frontside ( 332 ), an outlet trench ( 353 ), and the like are formed through resin molding, and an outer circumferential surface of the circuit package ( 400 ) produced in the first resin molding process is enveloped by a resin in the second resin molding process to fix the circuit package ( 400 ) to the housing ( 302 ).

Claims (20)

1. A thermal flow meter comprising:

a gas passage to take in and permit to flow therethrough of a measurement target gas flowing in a main passage,

a circuit package having a flow rate measurement circuit to measure a flow rate by performing heat transfer between (a) the measurement target gas flowing in the gas passage, and (b) the gas passage itself, a first resin being used to seal the flow rate measurement circuit, and

a housing having an external connector for electrical connection to external devices, and housing the circuit package, formed by a second resin, a thermal expansion coefficient of which is different from a thermal expansion coefficient of the first resin,

wherein the circuit package has a measurement terminal for outputting a measurement result of the flow rate measurement circuit, and an inspection terminal for inspecting the flow rate measurement circuit, after resin sealing,

wherein the circuit package is in a shape having a plurality of sides,

wherein the inspection terminal and the measurement terminal are provided at different sides of the circuit package, and

wherein the inspection terminal is shorter than the measurement terminal.

2. The thermal flow meter according to claim 1 ,

wherein the circuit package further has a calibration terminal for reading adjustment data from outside the housing.

3. The thermal flow meter according to claim 2 ,

wherein an edge of an external terminal connection side to at least one of the external devices has a different shape from that of the calibration terminal.

4. The thermal flow meter according to claim 2 ,

wherein the measurement terminal and the calibration terminal are provided with curved portions.

5. The thermal flow meter according to claim 2 ,

wherein the inspection terminal is shorter than the calibration terminal.

6. The thermal flow meter according to claim 1 , further comprising a cover and an external terminal,

wherein the gas passage is a bypass passage defined by a bypass passage trench and the cover, which covers the bypass passage trench.

7. The thermal flow meter according to claim 6 ,

wherein an electrical connection portion between the measurement terminal and the external terminal is covered by the second resin.

Assignments (1)
CHANGE OF NAME Recorded Mar 25, 2021
From: HITACHI AUTOMOTIVE SYSTEMS, LTD.
To: HITACHI ASTEMO, LTD.
Reel/Frame 056299/0447 →