IP Library Granted Patent US 10,545,547
Granted Patent B2
US 10,545,547 · App. 16/248,286 · Granted Jan 28, 2020

Device having time division multiplexing capability of heat dissipation

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Quick Facts
Patent No.
US 10,545,547
App. No.
16/248,286
Granted
Jan 28, 2020
Kind
B2
Abstract

In the embodiments of the present disclosure, a device having time division multiplexing capability of heat dissipation is provided, including: a first component and a second component arranged in different orientations; and a heat sink arranged to guide an air flow flowing through the heat sink to the first component and the second component respectively during different time periods. Therefore, the device having time division multiplexing capability of heat dissipation of the present disclosure may reduce the number of heat sinks in the device and thus, reduce the overall size of the device.

Claims (11)

1. A device having time division multiplexing capability of heat dissipation, comprising: a first component and a second component arranged in different orientations; and a heat sink arranged to guide an air flow flowing through the heat sink respectively to the first component and the second component during different time periods; wherein the heat sink comprises a rotatable set of cooling fins configured to control a direction of the air flow by rotating orientations of the cooling fins.

2. The device of claim 1 , wherein the heat sink is configured to switch the air flow to the second component in response to an air pressure of the air flow exceeding a threshold.

3. The device of claim 1 , wherein the heat sink is configured to switch the air flow to the first component in response to an air pressure of the air flow being lower than a threshold.

4. The device of claim 1 , wherein the heat sink comprises a coil spring configured to be operable to drive the cooling fins to rotate in response to an air pressure of the air flow being lower or higher than a threshold, so as to change the direction of the air flow.

5. The device of claim 4 , wherein the heat sink comprises a fixed baseplate and a rotatable baseplate, between which the coil spring is arranged, and the coil spring is operable to drive the rotatable baseplate.

6. The device of claim 1 , wherein the device is an input/output (I/O) card.

7. The device of claim 6 , wherein the first component is an M.2 card and the second component is a battery.

8. The device of claim 7 , further comprising a third component, wherein the heat sink is arranged on the third component, and the fixed baseplate contacts the third component so as to dissipate heat for the third component.

9. The device of claim 8 , wherein the third component is a central processing unit (CPU).

10. An electronic apparatus, comprising the device according to claim 1 .

11. An electrical apparatus, comprising the device according to claim 1 .

Assignments (6)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST AF REEL 052243 FRAME 0773 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 058001/0152 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 26, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 052243/0773 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 25, 2019
From: ZHAI, HAIFANG; WU, HENDRY XIAOPING; DONG, DAVID; ZHOU, YUJIE
To: DELL PRODUCTS L.P.
Reel/Frame 048421/0205 →