IP Library Granted Patent US 10,366,809
Granted Patent B2
US 10,366,809 · App. 16/250,501 · Granted Jul 30, 2019

Insulated wire, coil, and electric or electronic equipment

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Quick Facts
Patent No.
US 10,366,809
App. No.
16/250,501
Granted
Jul 30, 2019
Kind
B2
Abstract

An insulated wire having a thermosetting resin layer on the outer periphery of a conductor and a thermoplastic resin layer on the outer periphery of the thermosetting resin layer, wherein a total thickness of the thermosetting resin layer and the thermoplastic resin layer is 100 μm or more and 250 μm or less, and a degree of orientation of a thermoplastic resin in said thermoplastic resin layer, that is calculated by the following Formula 1, is 20% or more and 90% or less; a coil and an electric and electronic equipment each having the insulated wire. Formula 1 Degree of orientation H (%)=[(360−ΣW n )/360]×100 W n : A half width of orientation peak in the azimuth angle intensity distribution curve by X-ray diffraction n: the number of orientation peak at a β angle of 0° or more and 360° or less.

Claims (10)

1. An insulated wire comprising a thermosetting resin layer on the outer periphery of a conductor, and a thermoplastic resin layer on the outer periphery of the thermosetting resin layer,

wherein a total thickness of the thermosetting resin layer and the thermoplastic resin layer is 100 μm or more and 250 μm or less, and a degree of orientation of a thermoplastic resin in the thermoplastic resin layer, that is calculated by the following Formula 1, is 20% or more and 90% or less;

Formula 1 Degree of orientation H (%)=[(360−ΣW n )/360]×100

W n : A half width of orientation peak in the azimuth angle intensity distribution curve by X-ray diffraction

n: the number of orientation peak at a β angle of 0° or more and 360° or less.

2. The insulated wire described in claim 1 , wherein the thermoplastic resin layer comprises at least one thermoplastic resin selected from the group consisting of a polyetheretherketone, a thermoplastic polyimide, and a polyphenylene sulfide, and a melting point of the thermoplastic resin is 260° C. or more and 390° C. or less.

3. The insulated wire described in claim 1 , wherein a thickness of the thermoplastic resin layer is 15 μm or more and 100 μm or less.

4. The insulated wire described in claim 1 , wherein the thermosetting resin layer comprises at least one thermosetting resin selected from the group consisting of a polyamideimide, a polyimide, and a polyesterimide.

5. A coil comprising the insulated wire described in claim 1 .

6. An electric or electronic equipment formed with using the coil described in claim 5 .

Assignments (7)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 30, 2025
From: FURUKAWA MAGNET WIRE CO., LTD.
To: ESSEX SOLUTIONS INC.
Reel/Frame 072420/0913 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 6, 2021
From: FURUKAWA MAGNET WIRE CO., LTD.
To: ESSEX FURUKAWA MAGNET WIRE LLC.
Reel/Frame 056150/0284 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2020
From: FURUKAWA ELECTRIC CO., LTD.
To: FURUKAWA ELECTRIC MAGNET WIRE AMERICA, INC.
Reel/Frame 054325/0650 →
SECURITY INTEREST Recorded Oct 16, 2020
From: ESSEX FURUKAWA MAGNET WIRE LLC
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 054073/0917 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 14, 2020
From: FURUKAWA ELECTRIC MAGNET WIRE AMERICA, INC.
To: ESSEX FURUKAWA MAGNET WIRE LLC
Reel/Frame 054050/0242 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 14, 2020
From: FURUKAWA ELECTRIC CO., LTD.
To: FURUKAWA ELECTRIC MAGNET WIRE AMERICA, INC.
Reel/Frame 054049/0608 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2019
From: FUKUDA, HIDEO; TOMOMATSU, ISAO; OYA, MAKOTO; MUTO, DAISUKE
To: FURUKAWA ELECTRIC CO., LTD.; FURUKAWA MAGNET WIRE CO., LTD.
Reel/Frame 049310/0001 →