Insulated wire, coil, and electric or electronic equipment
View Patent ↗An insulated wire having a thermosetting resin layer on the outer periphery of a conductor and a thermoplastic resin layer on the outer periphery of the thermosetting resin layer, wherein a total thickness of the thermosetting resin layer and the thermoplastic resin layer is 100 μm or more and 250 μm or less, and a degree of orientation of a thermoplastic resin in said thermoplastic resin layer, that is calculated by the following Formula 1, is 20% or more and 90% or less; a coil and an electric and electronic equipment each having the insulated wire. Formula 1 Degree of orientation H (%)=[(360−ΣW n )/360]×100 W n : A half width of orientation peak in the azimuth angle intensity distribution curve by X-ray diffraction n: the number of orientation peak at a β angle of 0° or more and 360° or less.
1. An insulated wire comprising a thermosetting resin layer on the outer periphery of a conductor, and a thermoplastic resin layer on the outer periphery of the thermosetting resin layer,
wherein a total thickness of the thermosetting resin layer and the thermoplastic resin layer is 100 μm or more and 250 μm or less, and a degree of orientation of a thermoplastic resin in the thermoplastic resin layer, that is calculated by the following Formula 1, is 20% or more and 90% or less;
Formula 1 Degree of orientation H (%)=[(360−ΣW n )/360]×100
W n : A half width of orientation peak in the azimuth angle intensity distribution curve by X-ray diffraction
n: the number of orientation peak at a β angle of 0° or more and 360° or less.
2. The insulated wire described in claim 1 , wherein the thermoplastic resin layer comprises at least one thermoplastic resin selected from the group consisting of a polyetheretherketone, a thermoplastic polyimide, and a polyphenylene sulfide, and a melting point of the thermoplastic resin is 260° C. or more and 390° C. or less.
3. The insulated wire described in claim 1 , wherein a thickness of the thermoplastic resin layer is 15 μm or more and 100 μm or less.
4. The insulated wire described in claim 1 , wherein the thermosetting resin layer comprises at least one thermosetting resin selected from the group consisting of a polyamideimide, a polyimide, and a polyesterimide.
5. A coil comprising the insulated wire described in claim 1 .
6. An electric or electronic equipment formed with using the coil described in claim 5 .