IP Library Granted Patent US 10,760,827
Granted Patent B2
US 10,760,827 · App. 16/251,770 · Granted Sep 1, 2020

Method and system for maximizing the thermal properties of a thermoelectric cooler and use therewith in association with hybrid cooling

Inventor: Tony Quisenberry (Highland Village, TX)
Assignee: THERMOTEK, INC.
F25B21/02B60H1/00478B60H1/3201B60H1/32011B60H1/32284F24F5/0042F25B25/00F25B15/00
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Quick Facts
Patent No.
US 10,760,827
App. No.
16/251,770
Granted
Sep 1, 2020
Kind
B2
Abstract

A cooling system including a first cooling apparatus thermally exposed to a space to be cooled. The cooling system further includes a second cooling apparatus thermally exposed to the space to be cooled and thermally exposed to the first cooling apparatus. Heat discharged from the second cooling apparatus powers the first cooling apparatus.

Claims (16)

1. A method for maximizing thermal properties of a thermoelectric element, the method comprising:

thermally exposing a cold side of the thermoelectric element to a space to be cooled;

removing heat from the space to be cooled through the thermoelectric element;

discharging the heat removed from the space to be cooled from the thermoelectric element to an absorption system;

transmitting heat from the heat-transfer fluid contained in a heat pipe to the absorption cooling system.

2. The method of claim 1 , comprising arranging the heat pipe between a hot side of the thermoelectric element and the absorption system.

3. The method of claim 1 , comprising utilizing a heat source to power the absorption system.

4. The method of claim 3 , wherein a heat-transfer loop transfers heat from the heat source to the absorption system.

5. The method of claim 1 , wherein the absorption system removes heat from the space to be cooled.

6. A cooling system of the type employing a cascading arrangement of cooling cycles, the cooling system comprising:

a plenum having a volume of air moving therethrough;

an absorption cooling system comprising an absorbent and a refrigerant;

a chiller coil disposed within an interior region of the plenum, the chiller coil fluidly coupled to the absorption cooling system;

a heat pipe coupled to, and thermally exposed to, the absorption cooling system; and

a thermoelectric element comprising a hot side and a cold side, the cold side being thermally exposed to the interior region of the plenum, the hot side being thermally exposed to the heat pipe.

7. The cooling system of claim 6 , comprising a secondary heat source, wherein the secondary heat source is thermally exposed to the absorption cooling system.

Assignments (3)
SECURITY AGREEMENT Recorded Nov 12, 2020
From: THERMOTEK, INC.
To: OXFORD FINANCE LLC, AS AGENT
Reel/Frame 054401/0337 →
SECURITY AGREEMENT Recorded Oct 22, 2020
From: THERMOTEK, INC.
To: OXFORD FINANCE LLC, AS AGENT
Reel/Frame 054214/0105 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 25, 2019
From: QUISENBERRY, TONY
To: THERMOTEK, INC.
Reel/Frame 048137/0903 →
Continuity (4)
Continuation 15227491 · Aug 3, 2016
Continuation 13250159 · Sep 30, 2011
Provisional Application 61388399 · Sep 30, 2010
Related Publication 20190154314A1 · May 23, 2019
Cited By (2)
US 12,188,692 US 12,472,093