Optical component, optical assembly, optical module, and manufacturing method thereof

1. An optical component, comprising:

an active optical surface at a first side face of the optical component, the active optical surface facing a first direction;

a back surface at a second side face of the optical component, the back surface facing a second direction opposite to the first direction, and the back surface being separated from the active optical surface by a distance; and

an installation surface connecting the active optical surface and the back surface,

wherein the active optical surface is formed with a first metal layer on at least a portion of an area of the first side face located away from a center of the first side face, and the back surface is formed with a second metal layer on at least a portion of an area of the second side face located away from a center of the second side face,

the first metal layer on the active optical surface and the second metal layer on the back surface are arranged opposite to each other,

the installation surface is configured for contacting a substrate on which the optical component is installed, and

the first metal layer on the active optical surface and the second metal layer on the back surface are connected to the same surface of the substrate on which the optical component is installed.

2. The optical component of claim 1 , wherein the first and second metal layers are used for soldering to external components.

3. The optical component of claim 1 , wherein the optical component comprises semiconductor material, ceramic, glass, or acrylic.

4. The optical component of claim 1 , wherein the optical component is a lens, a prism, a plane mirror, an optical filter, a wavelength division multiplexer, an optical splitter, a wave plate, or a beam splitter.

5. The optical component of claim 1 , wherein the first metal layer on the first side face of the optical component is arranged along a rim of the first side face adjacent to the installation surface, and the second metal layer on the second side face of the optical component is arranged along a rim of the second side face adjacent to the installation surface.

6. An optical assembly, comprising:

the optical component of claim 1 ; and

the substrate on which the optical component is installed,

wherein the installation surface of the optical component contacts the substrate, and

the first and second metal layers of the optical component and the substrate are soldered together to secure the optical component to the substrate.

7. An optical module, comprising the optical assembly of claim 6 .

8. An optical component manufacturing method, comprising:

providing a substrate having a front surface, the front surface facing a first direction, the back surface facing a second direction opposite to the first direction;

forming a plurality of optical components on the substrate, wherein each one of the optical components includes an active optical surface at a first side face included in the front surface of the substrate and a back surface at a second side face included in the back surface of the substrate, and the plurality of optical components are arranged side by side in a direction parallel to the active optical surfaces of the optical components;

forming a metal layer on each one of the first side face and the second side face of at least one of the plurality of optical components, wherein the metal layer is formed on at least a portion of an area away from a center of each one of the first side face and the second side face of the at least one of the plurality of optical components; and

cutting the plurality of optical components formed with the metal layers on the first side faces and the second side faces to form a plurality of separate optical components.

9. The optical component manufacturing method of claim 8 , wherein the substrate is a semiconductor wafer, a ceramic plate, a glass plate, or an acrylic plate.

10. The optical component of claim 1 , wherein the optical component comprises a semiconductor material selected from germanium, silicon, selenium, boron, tellurium, antimony, gallium arsenide, indium phosphide, indium antimonide, or silicon carbide.