IP Library Granted Patent US 11,910,525
Granted Patent B2
US 11,910,525 · App. 16/259,302 · Granted Feb 20, 2024

Thin flexible structures with surfaces with transparent conductive films and processes for forming the structures

Inventors: Xiaofeng Chen (San Jose, CA); Byunghwan Kang (Yongin-si, KR); Jackie Chen (San Leandro, CA); Yadong Cao (San Jose, CA); Vicki Luo (San Francisco, CA); Arthur Yung-Chi Cheng (Newark, CA); Andrew Hyeongjoo Moon (Dublin, CA); Xiqiang Yang (Hayward, CA); Ajay Virkar (San Mateo, CA)
Assignee: C3 Nano, Inc.
H05K1/0393G06F3/044G06F3/0412H05K1/0298H05K1/118B32B2457/208H05K2201/0108H05K2201/0145
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Quick Facts
Patent No.
US 11,910,525
App. No.
16/259,302
Granted
Feb 20, 2024
Kind
B2
Abstract

Structures are described having thin flexible polymer substrates with electrically conductive films on each opposing surface while having high optical transmittance and good optical properties. The structures can have total thicknesses of no more than about 30 microns and good flexibility. Processing approaches are described that allow for the coating of the very thin structures by providing support through the coating process. The structures are demonstrated to have good durability under conditions designed to test accelerated wear for touch sensor use.

Claims (29)

1. A double sided conductive structure comprising:

a transparent polymer substrate comprising a polymer and having a first surface and a second surface, wherein the polymer substrate has an average thickness of no more than about 27 microns and the polymer in a configuration of the transparent polymer substrate has a transmittance from 400 nm to 750 nm of at least about 88% and over the UV spectrum from 330 nm to 375 nm of no more than about 15%;

a first sparse metal conductive layer supported on the first surface of the transparent polymer substrate;

a second sparse metal conductive layer supported on the second surface of the transparent polymer substrate; and

first and second polymer overcoats over the first and second sparse metal conductive layers, respectively, wherein each of the first and second polymer overcoats has an average thickness from about 10 nm to about 200 nm;

wherein each surface of the double sided conductive structure has a sheet resistance of no more than about 120 Ohms/sq.

2. The double sided conductive structure of claim 1 further comprising a first hardcoat layer and a second hardcoat layer, each having an average thickness of from about 50 nm to about 3 microns, wherein the first hardcoat layer is between the first surface of the transparent polymer substrate and the first sparse metal conductive layer, wherein the second hardcoat layer is between the second surface of the transparent polymer substrate and the second sparse metal conductive layer, and wherein both hardcoat layers comprise a crosslinked polyacrylate polymer.

3. The double sided conductive structure of claim 2 wherein each hardcoat layer has a thickness from about 100 nm to about 2.5 microns and comprises a highly crosslinked polyacrylate.

4. The double sided conductive structure of claim 1 wherein the double sided conductive structure can be assembled into a test structure with an optically clear adhesive and a 125 micron thick PET film over each surface and subjected to accelerated wear testing at 85° C. and 85% relative humidity for 500 hours with an increase in sheet resistance of no more than about 20%.

5. The double sided conductive structure of claim 1 wherein the transparent polymer substrate comprises polyimide.

6. The double sided conductive structure of claim 1 wherein the polymer substrate has an elongation of at least about 10%, a tensile strength of at least about 50 MPa, and a Young's modulus from about 1.5 GPa to about 7.0 GPa.

7. The double sided conductive structure of claim 1 wherein the transparent polymer substrate comprises polysulfide, polysulfone, polyethylene naphthalate or polyethersulfone.

8. The double sided conductive structure of claim 1 wherein each of the first and second sparse metal conductive layers comprises a fused metal nanostructured network and wherein the double sided conductive structure can be bent around a 1 mm diameter mandrel repeatedly for at least 200,000 times with the sheet resistance of the conductive surfaces changing by no more than 10%.

9. The double sided conductive structure of claim 8 wherein each surface of the double sided conductive structure has a sheet resistance of no more than about 100 Ohms/sq.

10. The double sided conductive structure of claim 9 having a transmittance of visible light of at least about 88%, a haze of no more than about 2.5% and a value of b* of no more than about 4.0.

11. The double sided conductive structure of claim 1 having an average thickness of no more than about 30 microns,

a % TT of at least 89%, a haze of no more than 2.5%, and a b* of no more than about 3.5, and each surface of the double sided conductive structure has a sheet resistance of no more than 100 Ohms/sq,

wherein the double sided conductive structure can be assembled into a test structure with an optically clear adhesive (3M, 8146) and a 125 micron thick PET film over each surface and subjected to accelerated wear testing at 85° C. and 85% relative humidity for 500 hours with an increase in sheet resistance of no more than about 40%.

12. The double sided conductive structure of claim 11 further comprising a first hardcoat layer and a second hardcoat layer, each having an average thickness of from about 50 nm to about 3 microns, wherein the first hardcoat layer is between the first surface of the transparent polymer substrate and the first sparse metal conductive layer, wherein the second hardcoat layer is between the second surface of the transparent polymer substrate and the second sparse metal conductive layer, and wherein both hardcoat layers comprise a crosslinked polyacrylate polymer.

13. The double sided conductive structure of claim 12 wherein each hardcoat layer has a thickness from about 100 nm to about 2.5 microns and comprises a highly crosslinked polyacrylate.

14. The double sided conductive structure of claim 11 wherein the double sided conductive structure can be assembled into a test structure with an optically clear adhesive and a 125 micron thick PET film over each surface and subjected to accelerated wear testing at 85° C. and 85% relative humidity for 500 hours with an increase in sheet resistance of no more than about 20%.

15. The double sided conductive structure of claim 11 wherein the transparent polymer substrate comprises polyimide.

16. The double sided conductive structure of claim 11 wherein the polymer substrate has an elongation of at least about 10%, a tensile strength of at least about 50 MPa, and a Young's modulus from about 1.5 GPa to about 7.0 GPa.

17. The double sided conductive structure of claim 11 wherein the transparent polymer substrate comprises polysulfide, polysulfone, polyethylene naphthalate, or polyethersulfone.

18. The double sided conductive structure of claim 11 wherein each of the first and second sparse metal conductive layers comprises a fused metal nanostructured network and wherein the double sided conductive structure can be bent around a 1 mm diameter mandrel repeatedly for at least 200,000 times with the sheet resistance of the conductive surfaces changing by no more than 10%.

19. The double sided conductive structure of claim 11 wherein each surface of the double sided conductive structure has a sheet resistance of no more than about 75 ohm/sq.

20. The double sided conductive structure of claim 1 having an average thickness of no more than about 30 microns.

21. The double sided conductive structure of claim 1 wherein the first and/or second sparse metal conductive layers are patterned.

22. The double sided conductive structure of claim 1 wherein the first and/or second sparse metal conductive layers are independently patternable with UV light.

Assignments (27)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2024
From: C3 NANO, INC.
To: EKC TECHNOLOGY, INC.
Reel/Frame 069719/0206 →
RELEASE OF SECURITY INTEREST Recorded Oct 11, 2024
From: GALLAGHER IP SOLUTIONS LLC
To: C3 NANO, INC.
Reel/Frame 068877/0619 →
SECURITY INTEREST Recorded Sep 2, 2023
From: C3 NANO, INC.
To: NEWLIGHT CAPITAL LLC
Reel/Frame 064803/0902 →
SECURITY INTEREST Recorded Jul 16, 2022
From: C3 NANO, INC.
To: NEWLIGHT CAPITAL LLC, AS SERVICER
Reel/Frame 060680/0217 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2022
From: LUO, VICKI
To: C3 NANO, INC.
Reel/Frame 060157/0947 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2022
From: CHEN, XIAOFENG
To: C3 NANO, INC.
Reel/Frame 060157/0955 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2022
From: CAO, YADONG
To: C3 NANO, INC.
Reel/Frame 060158/0175 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2022
From: MOON, ANDREW HYEONGJOO
To: C3 NANO, INC.
Reel/Frame 060158/0829 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2022
From: KANG, BYUNGHWAN
To: C3 NANO, INC.
Reel/Frame 060399/0776 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2022
From: CHEN, JACKIE
To: C3 NANO, INC.
Reel/Frame 060157/0765 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2022
From: YANG, XIQIANG
To: C3 NANO, INC.
Reel/Frame 060157/0973 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2022
From: CHENG, ARTHUR YUNG-CHI
To: C3 NANO, INC.
Reel/Frame 060157/0344 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 9, 2022
From: VIRKAR, AJAY
To: C3 NANO, INC.
Reel/Frame 060152/0890 →
SHORT FORM INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Mar 5, 2021
From: C3 NANO, INC.
To: NEWLIGHT CAPITAL LLC
Reel/Frame 055592/0145 →
RELEASE OF SECURITY INTEREST Recorded Feb 23, 2021
From: PALM TREE CAPITAL MANAGEMENT, LP, AS COLLATERAL AGENT
To: C3 NANO, INC.
Reel/Frame 055379/0621 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR PREVIOUSLY RECORDED ON REEL 055281 FRAME 0189. ASSIGNOR(S) HEREBY CONFIRMS THE XIQIANG FENG WAS SPELLED WRONG AND IT SHOULD BE XIQIANG YANG. Recorded Feb 19, 2021
From: YANG, XIQIANG
To: C3 NANO, INC.
Reel/Frame 055344/0878 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 17, 2021
From: CAO, YADONG
To: C3 NANO, INC.
Reel/Frame 055281/0239 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 17, 2021
From: FENG, XIQIANG
To: C3 NANO, INC.
Reel/Frame 055281/0189 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 16, 2021
From: MOON, ANDREW HYEONGJOO
To: C3 NANO, INC.
Reel/Frame 055274/0073 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 16, 2021
From: CHENG, ARTHUR YUNG-CHI
To: C3 NANO, INC.
Reel/Frame 055274/0983 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 16, 2021
From: CHEN, JACKIE
To: C3 NANO, INC.
Reel/Frame 055275/0769 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 16, 2021
From: CHEN, XIAOFENG
To: C3 NANO, INC.
Reel/Frame 055276/0350 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 16, 2021
From: LUO, VICKI
To: C3 NANO, INC.
Reel/Frame 055276/0383 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 16, 2021
From: KANG, BYUNGHWAN
To: C3 NANO, INC.
Reel/Frame 056801/0414 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 16, 2021
From: VIRKAR, AJAY
To: C3 NANO, INC.
Reel/Frame 055274/0952 →
SECURITY INTEREST Recorded Jan 21, 2021
From: C3 NANO, INC.
To: PALM TREE CAPITAL MANAGEMENT, LP, AS COLLATERAL AGENT
Reel/Frame 055060/0840 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 26, 2019
From: CHEN, XIAOFENG; KANG, BYUNGHWAN; CHEN, JACKIE; CAO, YADONG; LUO, VICKI; CHENG, ARTHUR YUNG-CHI; MOON, ANDREW HYEONGJOO; YANG, XIQIANG; VIRKAR, AJAY
To: C3NANO INC.
Reel/Frame 048700/0607 →
Continuity (1)
Related Publication 20200245457A1 · Jul 30, 2020