Methods and apparatuses for packaging an ultrasound-on-a-chip
Aspects of the disclosure described herein related to packaging an ultrasound-on-a-chip. In some embodiments, an apparatus includes an ultrasound-on-a-chip that has through-silicon vias (TSVs) and an interposer coupled to the ultrasound-on-a-chip and including vias, where the ultrasound-on-a-chip is coupled to the interposer such that the TSVs in the ultrasound-on-a-chip are electrically connected to the vias in the interposer. In some embodiments, an apparatus includes an ultrasound-on-a-chip having bond pads, an interposer that has bond pads and that is coupled to the ultrasound-on-a-chip, and wirebonds extending from the bond pads on the ultrasound-on-a-chip to the bond pads on the interposer.
1. An apparatus, comprising:
an ultrasound-on-a-chip; and
an interposer coupled to the ultrasound-on-a-chip, the interposer comprising:
a plurality of first vias electrically coupled to the ultrasound-on-a-chip; and
a plurality of second vias different than the plurality of first vias and configured to conduct heat away from the ultrasound-on-a-chip.
2. The apparatus of claim 1 , wherein a thickness of the ultrasound-on-a-chip is about 200 microns to about 300 microns.
3. The apparatus of claim 1 , wherein the interposer comprises a heat sink portion that includes the plurality of second vias.
4. The apparatus of claim 3 , wherein the heat sink portion comprises ceramic material.
5. The apparatus of claim 4 , wherein the ceramic material is aluminum nitride.
6. The apparatus of claim 1 , wherein the interposer further comprises an electrical connectivity portion that includes plurality of first vias.
7. The apparatus of claim 6 , wherein the electrical connectivity portion comprises an organic, glass, and/or silicon material.
8. The apparatus of claim 1 , wherein the plurality of second vias are coupled to copper patterns disposed on a face of the interposer and protruding towards the ultrasound-on-a-chip from the face of the interposer.
9. The apparatus of claim 1 , wherein the ultrasound-on-a-chip and the interposer are coupled together using a surface-mount technology (SMT) process.
10. The apparatus of claim 1 , wherein underfill is disposed along substantially all of an interface between the ultrasound-on-a-chip and the interposer.
11. The apparatus of claim 1 , wherein an adhesive is disposed along a portion of an interface between the ultrasound-on-a-chip and the interposer.
12. The apparatus of claim 1 , wherein an empty space exists along a portion of an interface between the ultrasound-on-a-chip and the interposer.
13. The apparatus of claim 1 , wherein a size of an upper face of the ultrasound-on-a-chip is approximately the same as a size of an upper face of the apparatus.
14. The apparatus of claim 6 , further comprising a printed circuit board comprising circuitry and/or traces and coupled to the interposer such that the plurality of first vias in the interposer are electrically connected to the circuitry and/or traces in the printed circuit board.
15. An apparatus, comprising:
an ultrasound-on-a-chip including first bond pads;
an interposer comprising second bond pads and coupled to the ultrasound-on-a-chip; and
wirebonds extending from the first bond pads on the ultrasound-on-a-chip to the second bond pads on the interposer.
16. The apparatus of claim 15 , wherein a thickness of the ultrasound-on-a-chip is about 200 microns to about 300 microns.
17. The apparatus of claim 15 , wherein the interposer comprises a heat sink portion.
18. The apparatus of claim 17 , wherein the heat sink portion comprises ceramic material.
19. The apparatus of claim 18 , wherein the ceramic material is aluminum nitride.
20. The apparatus of claim 15 , wherein the interposer further comprises an electrical connectivity portion that includes a plurality of first vias electrically coupled to the ultrasound-on-a-chip.
21. The apparatus of claim 20 , wherein the electrical connectivity portion comprises an organic, glass, and/or silicon material.
22. The apparatus of claim 20 , wherein the interposer comprises a plurality of second vias different than the plurality of first vias, the plurality of second vias configured to conduct heat away from the ultrasound-on-a-chip, wherein vias of the plurality of second vias are coupled to copper patterns protruding towards the ultrasound-on-a-chip from a face of the interposer.
23. The apparatus of claim 15 , wherein the ultrasound-on-a-chip and the interposer are coupled together through an adhesive.
24. The apparatus of claim 15 , further comprising a printed circuit board comprising circuitry and/or traces, and wherein:
the interposer further comprises a plurality of first vias; and
the printed circuit board is coupled to the interposer such that the plurality of first vias in the interposer are electrically connected to the circuitry and/or traces in the printed circuit board.