IP Library Granted Patent US 11,087,958
Granted Patent B2
US 11,087,958 · App. 16/260,610 · Granted Aug 10, 2021

Restoration method for plasma processing apparatus

Inventor: Hiroyuki Mizuno (Kuwana, JP)
Assignee: TOSHIBA MEMORY CORPORATION
H01J37/32091C04B41/52C04B41/89C23C16/44H01J37/32541
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Quick Facts
Patent No.
US 11,087,958
App. No.
16/260,610
Granted
Aug 10, 2021
Kind
B2
Abstract

According to one embodiment, a restoration method for a plasma processing apparatus is provided. The method includes performing application of a restoration liquid from a coating part onto a consumed region on a component for serving as a constituent element of the plasma processing apparatus, by controlling positions of the component and the coating part, and an application amount of the restoration liquid; and solidifying the restoration liquid applied on the component.

Claims (13)

1. A restoration method for a plasma processing apparatus, the method comprising:

acquiring first component shape information about a shape of a component in a brand new state, the component serving as a constituent element of the plasma processing apparatus, and second component shape information about a shape of the component after use in a plasma process;

acquiring a consumed region of the component from a difference between the first component shape information and the second component shape information;

performing an application of a restoration liquid from a coating part onto the consumed region on the component by controlling positions of the component and the coating part, and an application amount of the restoration liquid in accordance with the consumed region; and

solidifying the restoration liquid applied on the component.

2. The restoration method for a plasma processing apparatus according to claim 1 , wherein the first component shape information and the second component shape information include image data picked up by a camera, and

the consumed region is acquired from a difference between the first component shape information and the second component shape information.

3. The restoration method for a plasma processing apparatus according to claim 2 , wherein, in performing the application of the restoration liquid, an application amount of the restoration liquid is a same amount for all positions on the component.

4. The restoration method for a plasma processing apparatus according to claim 1 , wherein

the first component shape information and the second component shape information include information about a depression or protrusion on the component acquired by a three-dimensional measuring instrument,

the consumed region is acquired from a difference between the first component shape information and the second component shape information, and

an application amount of the restoration liquid is changed in accordance with a depth of the consumed region at each position on the component.

5. The restoration method for a plasma processing apparatus according to claim 1 , wherein the restoration liquid contains liquid SiC or SOG solution.

Assignments (2)
CHANGE OF NAME AND ADDRESS Recorded Jan 31, 2022
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 058905/0582 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2019
From: MIZUNO, HIROYUKI
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 048166/0164 →
Priority Claims (1)
JP JP2018-114256 · Jun 15, 2018 · national
Continuity (1)
Related Publication 20190385818A1 · Dec 19, 2019