IP Library Granted Patent US 11,018,464
Granted Patent B2
US 11,018,464 · App. 16/264,045 · Granted May 25, 2021

Pin bridge connector for modular building block system for RF and microwave design

Inventors: John Dale Richardson (Austin, TX); Raymond Thomas Page (Georgetown, TX)
Assignee: X-Microwave, LLC
H01R24/50G01R1/06772
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,018,464
App. No.
16/264,045
Granted
May 25, 2021
Kind
B2
Abstract

An RF signal processing system including multiple drop-in modular circuit blocks is disclosed. The drop-in modular circuit blocks include input and output launches exhibiting the same launch geometry. The RF system may include a conductive plate with a grid of holes disposed on the conductive plate. Multiple modular blocks may be installed on the conductive plate to form a cascade of modular blocks that exhibit common launch geometries. The cascade may include an RF probe with a projection and conductive pin that overhang a portion of a launch of a modular block at an end of the cascade. Flex connects may be disposed on, and held in position by, anchors to connect adjacent modular blocks together in a prototype system. A production RF system may exhibit the same overall geometry as a prototype RF system to speed up the transition from prototype design to production design.

Claims (28)

1. A radio frequency (RF) assembly, comprising:

an electrically conductive housing including a housing floor having a plurality of mounting holes arranged in a grid pattern, the electrically conductive housing including first and second end walls coupled to the housing floor, and first and second side walls coupled to the housing floor;

a first modular circuit block situated on the housing floor, the first modular circuit block including a plurality of mounting holes that are aligned with corresponding mounting holes of the housing floor, the first modular circuit block including a launch that is situated adjacent the first end wall of the housing;

a connector situated external to the housing on the first end wall of the housing, the connector including a conductive pin that extends through an opening in the first end wall of the housing and into the interior of the housing above the launch of the first modular circuit block; and

a discrete pin bridge situated at the launch of the first modular circuit block, the pin bridge including a channel through which the conductive pin extends to contact a signal conductor of the launch of the first modular circuit block, the pin bridge providing an electrically conductive path between a ground conductor of the launch of the first modular circuit block and the first end wall.

2. The RF assembly claim of 1 , wherein the pin bridge includes first and second opposed ends at which first and second mounting holes are located, respectively.

3. The RF assembly of claim 2 , wherein the first and second mounting holes of the pin bridge are aligned with corresponding mounting holes of the first modular circuit block and corresponding mounting holes of the housing floor of the electrically conductive housing below.

4. The RF assembly of claim 3 , further comprising first and second mounting screws extending through the first and second mounting holes of the pin bridge, through the corresponding mounting holes of the first modular circuit block and into the corresponding mounting holes of the housing floor of the electrically conductive housing below.

5. The RF assembly of claim 3 , wherein the pin bridge is fabricated of electrically insulative material, the pin bridge further including a central contact region that is coated with electrically conductive material to provide the electrically conductive path between the ground conductor of the launch of the first modular block and the first end wall of the housing.

6. The RF assembly of claim 3 , further comprising:

a second modular circuit block situated on the housing floor, the second modular circuit block including a plurality of mounting holes that are aligned with corresponding mounting holes of the housing floor, the second modular circuit block including a launch that is situated adjacent to, and coupled to, a launch of the first modular circuit block to form a cascade of modular circuit blocks.

7. A radio frequency (RF) assembly, comprising:

an electrically insulative main body including opposed ends;

a central contact region extending from the main body, a coating of electrically conductive material being situated on the central contact region of the main body to make contact with a ground conductor of a launch of a modular circuit block and an inner wall of an electrically conductive housing;

the central contact region including a channel configured to provide room for a connector conductor to extend therethrough and make contact with a signal trace of the launch of the modular circuit block;

the opposed ends of the main body including first and second mounting holes that are configured to align with corresponding mounting holes in the modular circuit block.

8. The RF assembly of claim 7 , wherein the first and second mounting holes of the main body are aligned with corresponding mounting holes of the modular circuit block and are further aligned with corresponding mounting holes in a floor of the electrically conductive housing.

9. The RF assembly of claim 8 , further comprising:

respective screws extending through the first and second mounting holes of the main body and further extending through the corresponding mounting holes in the modular circuit block and still further extending through corresponding mounting holes in the floor of the electrically conductive housing.

10. A radio frequency (RF) assembly, comprising:

an electrically conductive housing including a housing floor having a plurality of mounting holes arranged in a grid pattern, the electrically conductive housing including first and second end walls coupled to the housing floor, and first and second side walls coupled to the housing floor;

a first modular circuit block situated on the housing floor, the first modular circuit block including a plurality of mounting holes that are aligned with corresponding mounting holes of the housing floor, the first modular circuit block including a launch that is situated adjacent the first end wall of the housing;

a connector situated external to the housing on the first end wall of the housing, the connector including a conductive pin that extends through an opening in the first end wall of the housing and into the interior of the housing above the launch of the first modular circuit block;

a pin bridge situated at the launch of the first modular circuit block, the pin bridge including a channel through which the conductive pin extends to contact a signal conductor of the launch of the first modular circuit block, the pin bridge providing an electrically conductive path between a ground conductor of the launch of the first modular circuit block and the first end wall;

wherein the pin bridge includes first and second opposed ends at which first and second mounting holes are located, respectively;

wherein the first and second mounting holes of the pin bridge are aligned with corresponding mounting holes of the first modular circuit block and corresponding mounting holes of the housing floor of the electrically conductive housing below; and

first and second mounting screws extending through the first and second mounting holes of the pin bridge, through the corresponding mounting holes of the first modular circuit block and into the corresponding mounting holes of the housing floor of the electrically conductive housing below.

11. The RF assembly claim of 1 , wherein the conductive pin extends through the channel and parallel to the housing floor to contact a signal conductor of the launch of the first modular circuit block.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Feb 27, 2025
From: ADAMS STREET CREDIT ADVISORS LP, AS ADMINISTRATIVE AGENT
To: X-MICROWAVE, LLC; PAKTRON LLC
Reel/Frame 070355/0751 →
SECURITY INTEREST Recorded Feb 27, 2025
From: X-MICROWAVE, LLC; TANTALUM PELLET COMPANY, LLC; EVANS CAPACITOR COMPANY, LLC; PACIFIC AEROSPACE & ELECTRONICS, LLC; OHIO ASSOCIATED ENTERPRISES, LLC; FILCONN, LLC; HERMETIC SOLUTIONS GROUP INC.; RUBBERCRAFT CORPORATION OF CALIFORNIA, LTD.; SWIFT TEXTILE METALIZING LLC; RMB PRODUCTS; BAL SEAL ENGINEERING, LLC; KAMATICS CORPORATION; BEI PRECISION SYSTEMS & SPACE COMPANY, INC.; PAKTRON LLC; OHMEGA TECHNOLOGIES, LLC; TICER TECHNOLOGIES, LLC; CUSTOM INTERCONNECTS, LLC; SANDERS INDUSTRIES HOLDINGS, INC.; AKROFIRE, LLC; KAMAN AEROSPACE CORPORATION; KAMAN CORPORATION
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 070344/0430 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2019
From: RICHARDSON, JOHN DALE; PAGE, RAYMOND THOMAS
To: X-MICROWAVE, LLC
Reel/Frame 048212/0331 →