Method and system for powering multiple computer platforms in symmetric configuration
Techniques pertaining to powering multiple platforms with a minimum impact on air passage in a predefined environment are disclosed. Instead of connecting each of the platforms in a chassis to a power supply therein, embodiments of the present invention uses what is referred to as cascading powering to power all platforms within minimum cable delivery. According to one embodiment of the present invention, a motherboard is disposed between two power supply units that are used to power the motherboard. The motherboard has power connectors located towards or near the power supply units so that only short cables are needed to power the platform.
1. A method for powering multiple mother boards in an enclosed computing environment, the method comprising:
connecting a first short cable to a power supply unit and to a first mother board to couple the power supply unit disposed immediately adjacent to a first side of the first mother board, wherein the first short cable is configured to transfer power at different voltage levels as well as control signals from the power supply unit to the first mother board; and
coupling a second mother board to the power supply unit via a second short cable, wherein the second mother board is disposed immediately adjacent to a second side of the first mother board that is opposite to the first side of the first mother board, and wherein the second short cable is configured to transfer power at different voltage levels as well as control signals to the second mother board.
2. The method of claim 1 , wherein coupling the second mother board to the power supply unit via the second short cable comprises connecting the second short cable to the first mother board and to the second mother board, and wherein the second short cable is configured to transfer power at different voltage levels as well as control signals to the second mother board via the first mother board.
3. The method of claim 2 , wherein the first mother board includes a first connector to which the first short cable is connected and a second connector to which the second short cable is connected.
4. The method of claim 3 , wherein the first connector is disposed on the first side of the first mother board, and the second connector is disposed on the second side of the first mother board.
5. The method of claim 4 , wherein the second mother board includes a third connector to which the second short cable is connected, wherein the third connector is disposed on a first side of the second mother board, and wherein the first side of the second mother board is immediately adjacent to the second side of the first mother board.
6. The method of claim 2 , further comprising:
coupling a third mother board to the power supply unit via a third short cable, wherein the third short cable is configured to transfer power at different voltage levels as well as control signals to the third mother board.
7. The method of claim 6 , wherein coupling the third mother board to the power supply unit via the third short cable comprises connecting the third short cable to the second mother board and to the third mother board.
8. The method of claim 6 , further comprising:
coupling a fourth mother board to the power supply unit via a fourth short cable, wherein the fourth short cable is configured to transfer power at different voltage levels as well as control signals to the fourth mother board.
9. An enclosed computing system for powering multiple mother boards, the system comprising:
a first mother board having a first side and a second side opposite to the first side;
a power supply unit that is connected to the first mother board via a first short cable, wherein the power supply unit is disposed immediately adjacent to the first side of the first motherboard, and wherein the first short cable is configured to transfer power at different voltage levels as well as control signals from the power supply unit to the first mother board; and
a second mother board that is coupled to the power supply via a second short cable, wherein the second mother board is disposed immediately adjacent to the second side of the first motherboard, and wherein the second short cable is configured to transfer power at different voltage levels as well as control signals to the second mother board.
10. The system of claim 9 , wherein the second mother board is connected to the first mother board via the second short cable, and wherein the second short cable is configured to transfer power at different voltage levels as well as control signals to the second mother board via the first mother board.
11. The system of claim 10 , wherein the first mother board includes a first connector to which the first short cable is connected and a second connector to which the second short cable is connected.
12. The system of claim 11 , wherein the first connector is disposed on the first side of the first mother board, and the second connector is disposed on the second side of the first mother board.
13. The system of claim 12 , wherein the second mother board includes a third connector to which the second short cable is connected, wherein the third connector is disposed on a first side of the second mother board, and wherein the first side of the second mother board is immediately adjacent to the second side of the first mother board.
14. The system of claim 10 , further comprising:
a third mother board that is coupled to the power supply unit via a third short cable, wherein the third short cable is configured to transfer power at different voltage levels as well as control signals to the third mother board.
15. The system of claim 14 , wherein the third short cable is connected to the second mother board via the third short cable, and wherein the third short cable is configured to transfer power at different voltage levels as well as control signals to the third mother board via the second mother board.
16. The system of claim 14 , further comprising:
a fourth mother board that is coupled to the power supply unit via a fourth short cable, wherein the fourth short cable is configured to transfer power at different voltage levels as well as control signals to the fourth mother board.
17. A system, comprising:
a first mother board having a first side and a second side opposite to the first side;
a power supply unit that is connected to the first mother board via a first short cable, wherein the power supply unit is disposed immediately adjacent to the first side of the first motherboard, and wherein the first short cable is configured to transfer power at different voltage levels as well as control signals from the power supply unit to the first mother board; and
a second mother board that is coupled to the power supply via a second short cable, wherein the second mother board is disposed immediately adjacent to the second side of the first motherboard, and wherein the second short cable is configured to transfer power at different voltage levels as well as control signals to the second mother board.
18. The system of claim 17 , wherein the second mother board is connected to the first mother board via the second short cable, and wherein the second short cable is configured to transfer power at different voltage levels as well as control signals to the second mother board via the first mother board.
19. The system of claim 18 , wherein the first mother board includes a first connector to which the first short cable is connected and a second connector to which the second short cable is connected, wherein the first connector is disposed on the first side of the first mother board, and the second connector is disposed on the second side of the first mother board.
20. The system of claim 18 , further comprising:
a third mother board that is coupled to the power supply unit via a third short cable, wherein the third short cable is configured to transfer power at different voltage levels as well as control signals to the third mother board.