Connection bridges for dual interface transponder chip modules
View Patent ↗Connection bridges (CBR) for dual-interface transponder chip modules (TCM) 200 may have an area which is substantially equal to or greater than an area of a contact pad (CP) of a contact pad array (CPA). A given connection bridge may be L-shaped and may comprise (i) a first portion disposed external to the contact pad array and extending parallel to the insertion direction, and (ii) a second portion extending from an end of the first portion perpendicular to the insertion direction to within the contact pad array (CPA) such as between C 1 and C 5 . The connection bridge may extend around a corner of the contact pad array, may be large enough to accommodate wire bonding, and may be integral with a coupling frame (CF) extending around the contact pad array. The transponder chip modules may be integrated into a smart card (SC).
1. Transponder chip module (TCM) comprising:
a substrate (MT, CCT) having a first surface and a second surface;
a contact pad array (CPA) disposed on the first surface of the substrate;
a coupling frame (CF) disposed on the first surface of the substrate, at least partially surrounding the contact pad array; and
components comprising a chip and an antenna disposed on the second surface of the substrate, said components requiring connection with one another;
wherein the coupling frame serves as a connection bridge (CBR) for interconnecting the components disposed on the second surface of the substrate.
2. The transponder chip module of claim 1 , wherein:
the coupling frame extends to an interior of the contact pad array (CPA).
3. The transponder chip module of claim 1 , wherein:
the coupling frame extends between two contact pads of the contact pad array.
4. The transponder chip module of claim 1 , wherein:
an insertion direction is defined for the transponder chip module;
a first portion of the connection bridge is external to the contact pad array and extends parallel to the insertion direction; and
a second portion of the connection bridge extends perpendicular to the insertion direction to within the contact pad array.
5. The transponder chip module of claim 1 , wherein:
at least a portion of the connection bridge has an area large enough to support wire bonding.
6. The transponder chip module of claim 1 , wherein:
the connection bridge can effect interconnections without requiring plated-through holes.
7. The transponder chip module of claim 1 , wherein:
the connection bridge is large enough to support a logo.
8. The transponder chip module of claim 1 , wherein:
the connection bridge is large enough to accommodate wire bonding.
9. The transponder chip module of claim 1 , wherein:
the connection bridge is disposed entirely external to the contact pad array.
10. The transponder chip module of claim 1 , wherein:
the connection bridge is disposed at least partially internal to the contact pad array.
11. The transponder chip module of claim 1 , further comprising:
a second connection bridge disposed on the first surface of the substrate.
12. The transponder chip module of claim 11 , wherein:
an insertion direction is defined for the transponder chip module; and
both connection bridges extend parallel to the insertion direction.
13. A smart card comprising the transponder chip module of claim 1 .
14. Method of connecting components disposed on a bottom surface of a substrate for a transponder chip module (TCM), the transponder chip module having a contact pad array on a front surface thereof, the method comprising:
providing a coupling frame on the front surface of the substrate, wherein the coupling frame at least partially surrounds the contact pad array; and
connecting the components through the substrate, via the coupling frame, to one another.
15. The method of claim 14 , wherein:
a portion of the coupling frame extends between contacts of the contact pad array.
16. The method of claim 14 , further comprising:
incorporating the transponder chip module into a smart card.