Semiconductor device and manufacturing method thereof
An end of a stacked-structure of conductive and insulating layers above a substrate has a staircase structure. The staircase includes a step pair. The risers of steps are opposed to each other. The step pairs are provided at different levels in the form in the staircase. First contact-plugs are provided on treads of respective steps of the first step part. A second contact-plug is provided in either an intermediate region between the first and the second steps of the step pair or the second step to extend in the stacked structure in a direction in which the conductive and insulating layers are stacked. A CMOS circuit is provided below the stacked structure and is connected to the second contact-plug. The second contact-plug is provided in either the intermediate region on which the first contact-plug is not formed or the second step on which the first contact-plug is not formed.
1. A semiconductor device comprising:
a substrate;
a plurality of conductive layers and a plurality of insulating layers that are stacked above the substrate, where an end of a stacked structure formed by the conductive layers and the insulating layers having a staircase structure in which the conductive layers form treads of respective steps, the staircase structure including a step pair formed by a first step part and a second step part, risers of respective steps of the step pair being opposed to each other, and a plurality of the step pairs being provided at different levels in the form of a staircase in the staircase structure;
a plurality of first contact plugs provided on treads of respective steps of the first step part;
second contact plugs provided in both of an intermediate region between the first step part and the second step part of the step pair and the second step part to extend in the stacked structure in a direction in which the conductive layers and the insulating layers are stacked; and
a CMOS (Complementary Metal Oxide Semiconductor) circuit provided below the stacked structure and electrically connected to the second contact plugs, wherein
the second contact plugs are provided in both of the intermediate region in which the first contact plug is not formed thereon and the second step part in which the first contact plug is not formed thereon.
2. The device of claim 1 , wherein a step having a substantially same height as the first or second step part is provided between the step pairs adjacent to each other.
3. The device of claim 1 , wherein the first and second step parts of the step pair are substantially symmetrical to each other.
4. The device of claim 2 , wherein the first and second step parts of the step pair are substantially symmetrical to each other.
5. The device of claim 1 , wherein a width of the intermediate region is equal to or more than twice a width of the first or second step part.
6. The device of claim 1 , wherein a width of a landing between the step pairs adjacent to each other is substantially same as a width of the first or second step part.
7. A manufacturing method of a semiconductor device, comprising:
forming a stacked structure in which a plurality of conductive layers and a plurality of insulating layers are stacked above a substrate;
forming a first resist film on the stacked structure;
forming a plurality of step pairs each formed by a first step part and a second step part by repeating a first process that etches one of the conductive layers and one of the insulating layers by using the first resist film as a mask and a second process that etches side surfaces of the first resist film, risers of respective step being opposed to each other;
forming a second resist film on the stacked structure; and
etching one or more of the step pairs of the stacked structure by using the second resist film as a mask to make the one or more step pairs have different heights from other step pairs, wherein
the first resist film is formed between regions where the step pairs adjacent to each other are formed,
the second resist film covers a first step pair that is a closest one of the step pairs to a center of the stacked structure,
the stacked structure is etched using the second resist film as a mask,
after the second resist film is removed, a third resist film is formed to cover the first step pair and a second step pair adjacent to the first step pair, and
the stacked structure is etched using the third resist film as a mask.
8. A manufacturing method of a semiconductor device comprising:
forming a stacked structure in which a plurality of conductive layers and a plurality of insulating layers are stacked above a substrate;
forming a first resist film on the stacked structure;
forming a plurality of step pairs each formed by a first step part and a second step part by repeating a first process that etches one of the conductive layers and one of the insulating layers by using the first resist film as a mask and a second process that etches side surfaces of the first resist film, risers of respective step being opposed to each other;
forming a second resist film on the stacked structure; and
etching one or more of the step pairs of the stacked structure by using the second resist film as a mask to make the one or more step pairs have different heights from other step pairs, wherein
the first resist film is formed between regions where the step pairs adjacent to each other are formed,
the second resist film intermittently exposes the step pairs,
the step pairs are etched using the second resist film as a mask,
after the second resist film is removed, a third resist film is formed to expose two of the step pairs from a first end of the stacked structure,
the step pairs are etched using the third resist film as a mask,
after the third resist film is removed, a fourth resist film is formed to expose four of the step pairs from the first end of the stacked structure, and
the step pairs are etched using the fourth resist film as a mask.