Stackable via package and method
A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A<B and 0=<C<½×D. The shape of the via aperture prevents solder deformation of the solder column formed from the solder ball as well as prevents solder bridging between adjacent solder columns.
1. An electronic device comprising:
a first substrate (S1) comprising a first S1 side facing a first direction, a second S1 side facing a second direction opposite the first direction, and a plurality of lateral S1 sides that extend between the first S1 side and the second S1 side, the first substrate comprising a first terminal on the second S1 side;
a semiconductor die comprising a first SD side, a second SD side, and a plurality of lateral SD sides that extend between the first SD side and the second SD side;
a vertical interconnect structure comprising a pin, wherein:
the pin comprises a first pin end that is attached to the first terminal, and a second pin end opposite the first pin end;
the pin generally extends from the first terminal in the second direction; and
no portion of the pin is positioned in the first direction relative to the first terminal; and
a dielectric layer that laterally surrounds the second pin end and does not laterally surround the first pin end.
2. The electronic device of claim 1 , wherein the first pin end is directly attached to the first terminal in a solderless connection.
3. The electronic device of claim 1 , wherein the dielectric layer is a cured liquid dielectric material.
4. The electronic device of claim 1 , wherein the dielectric layer is a molding compound.
5. The electronic device of claim 1 , wherein the dielectric layer does not directly contact the first substrate.
6. The electronic device of claim 1 , wherein the vertical interconnect structure comprises a solder that is reflow-attached to the second pin end.
7. The electronic device of claim 6 , wherein the dielectric layer directly contacts and laterally surrounds at least a portion of the solder.
8. An electronic device comprising:
a first substrate (S1) comprising a first S1 side facing a first direction, a second S1 side facing a second direction opposite the first direction, and a plurality of lateral S1 sides that extend between the first S1 side and the second S1 side, the first substrate comprising a first terminal on the second S1 side;
a semiconductor die comprising a first SD side, a second SD side, and a plurality of lateral SD sides that extend between the first SD side and the second SD side;
a vertical interconnect structure comprising a pin and a solder, wherein:
the pin comprises a first pin end that is attached to the first terminal in a solderless connection, and a second pin end opposite the first pin end;
the pin generally extends from the first terminal in the second direction;
no portion of the pin is positioned in the first direction relative to the first terminal; and
the solder is reflow-attached to the second pin end; and
a dielectric layer that laterally surrounds the second pin end and does not laterally surround the first pin end.
9. The electronic device of claim 8 , further comprising a second substrate (S2) comprising a first S2 side facing the first direction, a second S2 side facing the second direction, and a plurality of lateral S2 sides that extend between the first S2 side and the second S2 side, the second substrate comprising a second terminal on the first S2 side, wherein the solder is reflow-attached to the second terminal.
10. The electronic device of claim 9 , wherein:
the dielectric layer (DL) comprises a first DL side facing the first direction and a second DL side facing the second direction; and
the solder extends from the second terminal in the first direction at least as far as the first DL side.
11. The electronic device of claim 9 , wherein the solder is laterally wider than the first and second terminals, and the pin is laterally narrower than the first and second terminals.
12. The electronic device of claim 9 , wherein the solder extends from the second substrate in the first direction at least as far as the dielectric layer extends from the second substrate in the first direction.
13. The electronic device of claim 9 , wherein one of the first and second terminals is laterally surrounded by solder mask, and another of the first and second terminals is not laterally surrounded by solder mask.
14. The electronic device of claim 8 , wherein the dielectric layer directly contacts and laterally surrounds at least a portion of the solder.
15. The electronic device of claim 8 , wherein the solder comprises a first solder end generally facing toward the first direction and free of contact with the dielectric layer.
16. The electronic device of claim 8 , wherein the solder is shaped like a sphere elongated in the first and second directions.
17. A method of manufacturing an electronic device, the method comprising:
providing a first substrate (S1) comprising a first S1 side facing a first direction, a second S1 side facing a second direction opposite the first direction, and a plurality of lateral S1 sides that extend between the first S1 side and the second S1 side, the first substrate comprising a first terminal on the second S1 side;
providing a semiconductor die comprising a first SD side, a second SD side, and a plurality of lateral SD sides that extend between the first SD side and the second SD side;
providing a vertical interconnect structure comprising a pin, wherein:
the pin comprises a first pin end that is attached to the first terminal, and a second pin end opposite the first pin end;
the pin generally extends from the first terminal in the second direction; and
no portion of the pin is positioned in the first direction relative to the first terminal; and
providing a dielectric layer that laterally surrounds the second pin end and does not laterally surround the first pin end.
18. The method of claim 17 , wherein the second pin end is directly attached to the first terminal in a solderless connection.
19. The method of claim 17 , wherein the vertical interconnect structure comprises a solder that is reflow-attached to the second pin end.
20. The method of claim 19 , wherein the dielectric layer directly contacts and laterally surrounds at least a portion of the solder.