Light emitting device and manufacturing method thereof

1. A light-emitting device, comprising:

a light-emitting unit including a non-light-emitting element and a light-emitting diode, wherein the light emitting diode has a first electrode and a second electrode and the non-light-emitting element has a third electrode and a fourth electrode;

a reflective layer covering the non-light-emitting element;

a light-transmitting layer covering the reflective layer and the light-emitting diode; and

a metal connection layer electrically connected to the non-light-emitting element and the light-emitting diode, wherein the metal connection layer has a first connection portion covering at least part of the first electrode and at least part of the fourth electrode and a second connection portion covering at least part of the second electrode and at least part of the third electrode.

2. The light-emitting device of claim 1 , further comprising an insulating layer surrounding the light-transmitting layer.

3. The light-emitting device of claim 1 , wherein the first connection portion surrounds the second connection portion.

4. The light-emitting device of claim 1 , further comprising metal bumps formed on the first electrode, the second electrode, the third electrode and the fourth electrode.

5. The light-emitting device of claim 1 , further comprising an apparatus, the light-emitting unit connected with the apparatus through the metal connection layer.

6. The light-emitting device of claim 4 , further comprising an insulating layer surrounding the metal bumps.

7. The light-emitting device of claim 1 , further comprising metal bumps formed on the first electrode and the second electrode.

8. The light-emitting device of claim 7 , further comprising an apparatus that is connected to the light-emitting unit by the metal bumps.

9. The light-emitting device of claim 8 , further comprising solders connecting the light-emitting unit and the apparatus.

10. The light-emitting device of claim 9 , further comprising metal connection layers located between the metal bumps and the solders.

11. The light-emitting device of claim 8 , wherein the apparatus is a substrate having an electrical connection circuit or an insulating carrier board having a metal circuit.

12. The light-emitting device of claim 7 , further comprising an insulating layer surrounding the light-transmitting layer and the metal bumps.

13. The light-emitting device of claim 1 , wherein the non-light-emitting element is a voltage-stabilizing diode.

14. The light-emitting device of claim 13 , wherein the first electrode is a p-electrode of the light-emitting diode, the second electrode is a n-electrode of the light-emitting diode, the third electrode is a p-electrode of the voltage-stabilizing diode and the fourth electrode is a n-electrode of the voltage-stabilizing diode.

15. The light-emitting device of claim 1 , wherein the reflective layer is a glue layer mixing with titanium dioxide, hafnium oxide, barium sulfate, or aluminum oxide particles.

16. The light-emitting device of claim 2 , wherein the insulating layer is a glue layer.

17. The light-emitting device of claim 1 , further comprising phosphor powder particles mixed into the light-transmitting layer.

18. The light-emitting device of claim 17 , wherein the light-transmitting layer is silicone or epoxy.

19. The light-emitting device of claim 1 , wherein the light-transmitting layer comprises sloped sides.