IP Library Granted Patent US 11,107,959
Granted Patent B2
US 11,107,959 · App. 16/276,980 · Granted Aug 31, 2021

Light emitting device

Inventors: Floris Maria Hermansz Crompvoets (Bunde, NL); Christian Kleijnen (Ell, DE); Georg Henninger (Aachen, DE); Danijel Labas (Baesweiler, DE); Gerhard Hebbinghaus (Juelich, DE)
Assignee: Lumileds LLC
H01L33/56H01L33/483H01L33/486H01L33/60H01L33/62H01L33/641H01L33/58H01L2933/005
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Quick Facts
Patent No.
US 11,107,959
App. No.
16/276,980
Granted
Aug 31, 2021
Kind
B2
Abstract

The invention relates to a light emitting device (LED), especially a LED at least partly embedded in transparent or translucent silicone fill, whereby the embedded LED is housed in a white silicone housing. Here and in the following, the wording transparent silicone fill always means a transparent or translucent silicone material. The invention further relates to a method for embedding the LED partly in a white silicone housing on the one hand and partly in transparent silicone fill on the other hand. The invention finally relates to the transparent silicone fill. The inner part of the LED device is at least partly embedded in transparent silicone fill, wherein the at least partly embedded LED device is housed in a white silicone housing comprising a white box silicone. A part of the inner part of the LED device is embedded in the white box silicone.

Claims (8)

1. A method comprising:

housing an inner part of a light emitting diode (LED) device in a housing comprising white silicone with at least a contact of the inner part of the LED device at least partially embedded in the white silicone;

encasing the inner part of the LED device at least partially with a transparent silicone fill leaving at least the contact exposed;

applying, after encasing the inner part of the LED device, a silicone diffusor on a side of the LED device opposite the contact; and

after applying the silicone diffusor, molding the white silicone at least partially around the transparent silicone fill leaving the side of the LED device opposite of the contact exposed.

2. The method according to claim 1 , wherein in the step of encasing the inner part of the LED device at least partially with transparent silicone fill, additionally the LED device is at least partially left open from encasing the inner part of the LED device partially with transparent silicone fill.

3. The method according to claim 1 , further comprising during the encasing, at least partially leaving an interposer exposed.

4. The method according to claim 1 , wherein the molding includes overmolding.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2025
From: LUMILEDS LLC
To: LUMILEDS SINGAPORE PTE. LTD.
Reel/Frame 071888/0086 →
RELEASE OF SECURITY INTEREST Recorded Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
SECURITY INTEREST Recorded Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
PATENT SECURITY AGREEMENT Recorded Dec 9, 2022
From: LUMILEDS, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 062114/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 3, 2021
From: LUMILEDS HOLDING B.V.
To: LUMILEDS, LLC
Reel/Frame 057065/0895 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 30, 2021
From: CROMPVOETS, FLORIS MARIA HERMANSZ; KLEIJNEN, CHRISTIAN; HENNINGER, GEORG; LABAS, DANIJEL; HEBBINGHAUS, GERHARD
To: LUMILEDS HOLDING B.V.
Reel/Frame 057038/0001 →