Model based dynamic positional correction for digital lithography tools
The present disclosure generally relates to photolithography systems, and methods for correcting positional errors in photolithography systems. When a photolithography system is first started, the system enters a stabilization period. During the stabilization period, positional readings and data, such as temperature, pressure, and humidity data, are collected as the system prints or exposes a substrate. A model is created based on the collected data and the positional readings. The model is then used to estimate errors in subsequent stabilization periods, and the estimated errors are dynamically corrected during the subsequent stabilization periods.
1. A method, comprising:
starting a photolithography system and entering a stabilization period;
collecting data and positional readings as the photolithography system prints one or more substrates or one or more calibration plates during the stabilization period, wherein the data collected is temperature data collected using a plurality of temperature sensors disposed throughout the photolithography system;
creating a model based on the data and the positional readings, wherein the model is formed using one or more parameters selected from the following group: where the positional readings should be at during the stabilization period without thermal effects, where the positional readings actually are due to thermal effects, approximations of perturbations of the positional readings, an initial temperature of the photolithography system, and a measured change in temperature from the initial temperature after a predetermined amount of time has passed; and
dynamically correcting estimated errors during subsequent stabilization periods using the model to print one or more substrates during the subsequent stabilization periods.
2. The method of claim 1 , wherein the temperature data is collected during heating and cooling periods of the stabilization period.
3. The method of claim 1 , wherein the data collected is pressure data.
4. The method of claim 1 , wherein the data collected is humidity data.
5. The method of claim 1 , wherein the model is a set of cascaded transient models.
6. The method of claim 1 , wherein the model is created based on pressure data.
7. The method of claim 1 , wherein the model is created based on humidity data.
8. The method of claim 1 , wherein the plurality of temperature sensors are disposed near parts of the photolithography system known to fluctuate in temperature during the stabilization period.
9. The method of claim 1 , wherein the data is collected using one or more sensors configured to collect pressure data or one or more sensors configured to collect humidity data.
10. The method of claim 1 , wherein the dynamic correction is to enhance at least one of precision and accuracy when printing the one or more substrates during the stabilization periods.
11. A method, comprising:
starting a photolithography system and entering a stabilization period;
collecting temperature data and positional readings as the photolithography system prints one or more substrates or one or more calibration plates during the stabilization period, wherein the temperature data is collected during heating and cooling periods using a plurality of temperature sensors disposed throughout the photolithography system;
creating a model based on the temperature data and the positional readings, wherein the model is formed using one or more parameters selected from the following group: where the positional readings should be at during the stabilization period without thermal effects, where the positional readings actually are due to thermal effects, approximations of perturbations of the positional readings, an initial temperature of the photolithography system, and a measured change in temperature from the initial temperature after a predetermined amount of time has passed;
calibrating the model;
using the calibrated model to estimate errors in subsequent stabilization periods; and
dynamically correcting the estimated errors during the subsequent stabilization periods to print one or more substrates during the subsequent stabilization periods.
12. The method of claim 11 , wherein pressure data is further collected, and the model is created based on the pressure data.
13. The method of claim 11 , wherein humidity data is further collected, and the model is created based on the humidity data.
14. The method of claim 11 , wherein the model is a set of cascaded transient models.
15. The method of claim 11 , wherein the photolithography system comprises one or more sensors configured to collect pressure data or one or more sensors configured to collect humidity data.
16. A method, comprising:
starting a photolithography system and entering a stabilization period;
collecting temperature data and positional readings as the photolithography system prints one or more substrates or one or more calibration plates during the stabilization period, wherein temperature data is collected using a plurality of temperature sensors disposed throughout the photolithography system;
creating a model based on the temperature data and the positional readings, wherein the model is formed using one or more parameters selected from the following group: where the positional readings should be at during the stabilization period without thermal effects, where the positional readings actually are due to thermal effects, approximations of perturbations of the positional readings, an initial temperature of the photolithography system, and a measured change in temperature from the initial temperature after a predetermined amount of time has passed;
forming an optimization problem to determine thermal capacitance and transmission coefficients of the photolithography system;
using the model and optimization problem to estimate errors in subsequent stabilization periods; and
dynamically correcting the estimated errors during the subsequent stabilization periods to print one or more substrates during the subsequent stabilization periods.
17. The method of claim 16 , wherein pressure data is further collected, and the model is created based on the pressure data.
18. The method of claim 16 , wherein humidity data is further collected, and the model is created based on the humidity data.
19. The method of claim 16 , wherein the model is a set of cascaded transient models.
20. The method of claim 16 , wherein the temperature data is collected during heating and cooling periods of the stabilization period.
21. The method of claim 16 , wherein the photolithography system comprises one or more sensors configured to collect pressure data or one or more sensors configured to collect humidity data.