IP Library Granted Patent US 11,391,611
Granted Patent B2
US 11,391,611 · App. 16/281,796 · Granted Jul 19, 2022

Thermal airflow sensor

Inventors: Ryosuke Doi (Hitachinaka, JP); Hiroshi Nakano (Tokyo, JP); Keiji Hanzawa (Hitachinaka, JP)
Assignee: Hitachi Astemo, Ltd.
G01F1/692B81B7/0016B81C1/00825G01F1/684G01F1/6842G01F1/6845G01P5/12H01L21/565H01L28/20H01L2224/05553H01L2224/45144H01L2224/48091H01L2224/48247H01L2224/49171H01L2924/10158H01L2924/181H01L2924/1815
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Quick Facts
Patent No.
US 11,391,611
App. No.
16/281,796
Granted
Jul 19, 2022
Kind
B2
Abstract

A thermal airflow sensor includes a sensor element, a bonding wire, a resin, and a protective film. The sensor element has a thin-wall portion. The thin-wall portion has a heating resistor. The bonding wire is electrically connected to the sensor element. The resin covers the bonding wire. The protective film is formed on a surface of the sensor element so that the heating resistor is exposed. The protective film has at least a slit between the resin and the thin-wall portion.

Claims (17)

1. A thermal airflow sensor comprising:

a sensor element having a thin-wall portion,

wherein the thin-wall portion has a heating resistor;

a bonding wire electrically connected to the sensor element;

a resin covering the bonding wire;

a protective film formed on a surface of the sensor element so that the thin-wall portion having a heating resistor is exposed; and

etched slits that are defined at least partially on the protective film between a region of the resin covering the bonding wire and a region of the thin-wall portion.

2. The thermal airflow sensor according to claim 1 , wherein the protective film is not covered with the resin and has an outer peripheral edge located outside of the thin-wall portion.

3. The thermal airflow sensor according to claim 1 , wherein the etched slits define a stagger; wherein the stagger is formed between an exposed surface of the sensor element and the protective film.

4. A thermal airflow sensor comprising:

a sensor element having a thin-wall portion,

wherein the thin-wall portion has a heating resistor;

a bonding wire electrically connected to the sensor element;

a resin covering the bonding wire;

a protective film formed on a surface of the sensor element so that the thin-wall portion having a heating resistor is exposed; and

a stagger, wherein

the stagger is formed by etched slits on the protective film between an exposed surface of the sensor element and the protective film.

Assignments (1)
CHANGE OF NAME Recorded Nov 30, 2021
From: HITACHI AUTOMOTIVE SYSTEMS, LTD.
To: HITACHI ASTEMO, LTD.
Reel/Frame 058481/0935 →
Priority Claims (1)
JP 2012-146286 · Jun 29, 2012 · national
Continuity (4)
Continuation 15979301 · May 14, 2018
Continuation 15495268 · Apr 24, 2017
Continuation 14410713
Related Publication 20190178694A1 · Jun 13, 2019