Mask member and method for producing semiconductor device
A mask member contains tungsten (W), boron (B), and carbon (C). The mask member includes a first portion in contact with a process film, the first portion, in which the terms of the composition ratio, which correspond to boron and carbon, are larger than the term of the composition ratio, which corresponds to tungsten, and a second portion in which the term of the composition ratio, which corresponds to tungsten, is larger than the terms of the composition ratio, which correspond to carbon and boron.
1. A method for producing a semiconductor device, comprising:
forming a process film on a semiconductor substrate;
forming a mask member on the process film, wherein the mask member comprises:
a first region that includes (i) a first portion containing tungsten, boron, and carbon, the first portion having a greater amount of boron and carbon than tungsten, and (ii) a second portion containing tungsten, boron, and carbon, the second portion having a greater amount of tungsten than boron and carbon, the second portion having a smaller amount of boron than the first portion, and
a second region containing tungsten, boron, and carbon, and having a greater amount of tungsten than boron and carbon, the second region being in contact with the second portion of the first region;
patterning the mask member; and
processing the process film based on a pattern of the mask member,
wherein forming the first region includes increasing a rate of flow of a gas containing the carbon during at least part of forming the first region.
2. The method according to claim 1 , the method further comprising forming the first region while changing rates of flow of a first gas containing the tungsten, a second gas containing the boron, and a third gas containing the carbon.
3. The method according to claim 2 , wherein after formation of the first region, forming the second region while fixing the rates of flow of the first gas, the second gas, and the third gas.
4. The method according to claim 2 , further comprising forming the process film by alternately stacking a first film and a second film, each of the first film and the second film containing silicon.
5. The method according to claim 2 , further comprising:
forming a pattern in the mask member, and
forming a hollow portion in the process film based on the pattern.
6. The method according to claim 5 , wherein the hollow portion is formed by reactive ion etching.
7. The method according to claim 1 , further comprising forming the process film by alternately stacking a first film and a second film, each of the first film and the second film containing silicon.
8. The method according to claim 1 , further comprising:
forming a pattern in the mask member, and forming a hollow portion in the process film based on the pattern.
9. The method according to claim 8 , wherein the hollow portion is formed by reactive ion etching.
10. The method according to claim 1 , further comprising forming the mask member by plasma chemical vapor deposition.
11. The method according to claim 1 , wherein
in the first region, a percentage of the tungsten is higher than 40% and a ratio of a content of the carbon to a content of the boron is greater than 0.9 and smaller than 1.4.
12. The method according to claim 1 , wherein
the second portion being in contact with the first portion.
13. The method according to claim 1 , wherein the second portion having a higher amount of boron than the second region and the second portion having a lower amount of tungsten than the second region.
14. The method according to claim 1 , wherein
an upper portion of the second region having a higher amount of carbon than that of boron.
15. The method according to claim 1 , wherein
forming the first region while using a constant rate of flow of the gas containing the carbon during at least another part of forming the first region.