IP Library Granted Patent US 10,784,602
Granted Patent B2
US 10,784,602 · App. 16/286,405 · Granted Sep 22, 2020

Module mount interposer

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Quick Facts
Patent No.
US 10,784,602
App. No.
16/286,405
Granted
Sep 22, 2020
Kind
B2
Abstract

A module mount interposer may include one or more fastener receivers configured to mechanically couple with one or more fasteners so as to mechanically and electrically couple a module to the interposer. The module mount interposer may also include a core configured to electrically couple with the module, wherein each of the fastener receivers are mechanically coupled to the core. The module mount interposer may additionally include a solder layer electrically coupled to the core and configured to electrically couple with a printed circuit board (PCB) so as to provide an electrical signal from the module to the PCB and to provide an electrical signal from the PCB to the module.

Claims (12)

1. A module mount interposer comprising:

a core configured to electrically couple with a module, the core including one or more fastener receivers that are mechanically coupled to the core;

a plurality of electrical connections coupled to the core and configured to electrically couple a printed circuit board (PCB) to the module; and

a plurality of solder ball connectors coupled to the core, the plurality of solder ball connectors located in a region that is directly opposite the fastener receivers.

2. The module mount interposer of claim 1 , further comprising one or more alignment pins.

3. A module mount mechanism including the module mount interposer of claim 1 and one or more fasteners that are each configured to mechanically couple with the one or more fastener receivers.

4. The module mount mechanism of claim 3 , wherein each of the fasteners include a head and each of the fasteners pass through a corresponding hole defined by the module, wherein the head of the fasteners are oversized compared to the corresponding holes defined by the module and the heads urge the module towards the interposer.

5. The module mount mechanism of claim 3 , wherein each of the fasteners comprises a bolt and each of the fastener receivers comprises a nut.

6. The module mount mechanism of claim 5 , wherein each of the nuts comprises a surface mount technology (SMT) nut.

7. The module mount mechanism of claim 5 , wherein each of the fasteners and nuts are electrically coupled to a ground plane in the core which is electrically coupled to a ground plane in the PCB.

8. The module mount interposer of claim 1 , wherein the fastener receivers comprise four fastener receivers located at different corners of the core.

9. The module mount interposer of claim 1 wherein the core is configured to electrically couple with the module through a beam grid when the module is mechanically and electrically coupled to the interposer.

Assignments (3)
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2019
From: LIAN, JIA; PENG, HUAPING; SHI, SHAMEI; WANG, WILLIAM H; FLENS, FRANK; VERGEEST, HENRICUS JOZEF
To: FINISAR CORPORATION
Reel/Frame 048447/0404 →