System and method for multi-point thermal path assessment

1. A method for assessing a thermal path associated with an integrated circuit, the method comprising:

identifying a heat application mode based on a design type of the integrated circuit;

measuring a first temperature of at least one thermal sensing device associated with the integrated circuit;

applying heat to at least a portion of the integrated circuit according to the heat application mode;

measuring a second temperature of the at least one thermal sensing device associated with the integrated circuit;

determining a difference between the first temperature and the second temperature;

determining whether a thermal path between the integrated circuit and an associated substrate is sufficient based on a comparison of the difference between the first temperature and the second temperature with a predetermined difference between an initial temperature and a subsequent temperature of the at least one thermal sensing device;

storing the difference as a delta temperature; and

characterizing a type of the integrated circuit based on the stored delta temperature and the predetermined difference.

2. The method of claim 1 , wherein the heat application mode includes at least one of a first test mode, a second test mode, and a normal operation mode.

3. The method of claim 2 , wherein the first test mode includes a low error-heating mode.

4. The method of claim 2 , wherein the second test mode includes a current limit mode.

5. The method of claim 2 , wherein the normal operation mode corresponds to normal operating characteristics of the integrated circuit.

6. The method of claim 1 , wherein the initial temperature corresponds to a baseline temperature of the design type corresponding to the integrated circuit at a time prior to heat being applied.

7. The method of claim 1 , wherein the subsequent temperature corresponds to a temperature of the design type corresponding to the integrated circuit at a time after heat is applied.

8. An integrated circuit thermal path assessment system, comprising:

an integrated circuit configured to be thermally attached to at least one substrate of a printed circuit board;

at least one thermal sensing device associated with the integrated circuit; and

a controller configured to be in communication with the integrated circuit, the controller configured to:

identify a heat application mode based on a design type of the integrated circuit;

measure a first temperature of at least one thermal sensing device associated with the integrated circuit;

apply heat to at least a portion of the integrated circuit according to the heat application mode;

measure a second temperature of the at least one thermal sensing device associated with the integrated circuit;

determine a difference between the first temperature and the second temperature;

determine whether a thermal path associated with the integrated circuit is sufficient based on a comparison of the difference between the first temperature and the second temperature with a predetermined difference between an initial temperature and a subsequent temperature of the at least one thermal sensing device;

store the difference as a delta temperature; and

characterize a type of the integrated circuit based on the stored delta temperature and the predetermined difference.

9. The system of claim 8 , wherein the thermal path includes at least one of a solder connect between the integrated circuit and the at least one substrate of the printed circuit board and a thermal interface between the printed circuit board and an associated pedestal.

10. The system of claim 8 , wherein the heat application mode includes a low error-heating mode.

11. The system of claim 8 , wherein the heat application mode includes a current limit mode.

12. The system of claim 8 , wherein the heat application mode corresponds to normal operating characteristics of the integrated circuit.

13. The system of claim 8 , wherein the initial temperature corresponds to a baseline temperature of the design type corresponding to the integrated circuit at a time prior to heat being applied.

14. The system of claim 8 , wherein the subsequent temperature corresponds to a temperature of the design type corresponding to the integrated circuit at a time after heat is applied.

15. A method for characterizing a first integrated circuit, the method comprising:

measuring an initial temperature of at least a portion of the first integrated circuit;

applying heat to at least a portion of the first integrated circuit according to at least one heat application mode of a plurality of heat application modes;

measuring a subsequent temperature of the portion of the first integrated circuit;

defining a thermal relationship of at least one thermal path between the first integrated circuit and a substrate of a printed circuit board, a location of at least one thermal sensing device on the first integrated circuit, and the at least one heat application mode of the plurality of heat application modes;

storing a difference between the initial temperature and the subsequent temperature as a delta temperature; and

characterizing a type of the first integrated circuit based on the stored delta temperature and a predetermined difference between an initial temperature and a subsequent temperature of the portion of the first integrated circuit.

16. The method of claim 15 , wherein the plurality of heat application modes includes at least one of a first test mode, a second test mode, and a normal operation mode.

17. The method of claim 16 , wherein the first test mode includes a low error-heating mode.

18. The method of claim 16 , wherein the second test mode includes a current limit mode.

19. The method of claim 16 , wherein the normal operation mode corresponds to normal operating characteristics of the first integrated circuit.

20. The method of claim 15 , wherein at least one of the initial temperature and the subsequent temperature is stored in a register on integrated circuits having a design type corresponding to the first integrated circuit.