Semiconductor memory and manufacturing method thereof
A semiconductor memory includes a substrate, a memory controller, a plurality of memory modules, and a cover layer. The memory controller is provided on an upper surface of the substrate. Each of the memory modules partially covers an upper surface of the memory controller and the upper surface of the substrate through at least an adhesive layer. The cover layer is on the upper surface of the substrate and encloses the memory controller and the plurality of memory modules between the substrate and the cover layer.
1. A semiconductor memory comprising
a substrate;
a first chip provided on an upper surface of the substrate;
a plurality of first bonding wires connecting the substrate and the first chip, each of the first bonding wires being wire-bonded to the substrate and the first chip;
a plurality of first modules, each of the first modules partially covering an upper surface of the first chip and the upper surface of the substrate through at least an adhesive layer;
a plurality of second bonding wires connecting the substrate and the plurality of first modules, each of the second bonding wires being wire-bonded to the substrate and one of the plurality of first modules; and
a cover layer covering the upper surface of the substrate and upper surfaces of the plurality of first modules,
wherein the plurality of first bonding wires are embedded in the adhesive layer, and the plurality of second bonding wires are embedded in the cover layer.
2. The semiconductor memory according to claim 1 , wherein
the plurality of first modules include a first semiconductor chip and a second semiconductor chip, the first semiconductor chip covering a first region of the upper surface of the first chip through a first adhesive layer, and the second semiconductor chip covering a second region of the upper surface of the first chip through a second adhesive layer.
3. The semiconductor memory according to claim 2 , wherein a side surface of the first adhesive layer above the first chip and a side surface of the second adhesive layer above the first chip are in contact with each other.
4. The semiconductor memory according to claim 3 , wherein
the side surface of the first adhesive layer and the side surface of the second adhesive layer both have a convex portion, and
the convex portion on the side surface of the first adhesive layer and the convex portion on the side surface of the second adhesive layer are in contact with each other.
5. The semiconductor memory according to claim 2 , wherein a side surface of the first adhesive layer above the first chip and a side surface of the second adhesive layer above the first chip are spaced apart from each other.
6. The semiconductor memory according to claim 2 , wherein
the plurality of first modules further include a third semiconductor chip and a fourth semiconductor chip, the third semiconductor chip covering a third region of the upper surface of the first chip through a third adhesive layer, and the fourth semiconductor chip covering a fourth region of the upper surface of the first chip through a fourth adhesive layer.
7. The semiconductor memory according to claim 6 , wherein
a first side surface of the first adhesive layer above the first chip and a side surface of the second adhesive layer above the first chip are in contact with each other, and
a second side surface of the first adhesive layer above the first chip and a side surface of the third adhesive layer above the first chip are in contact with each other.
8. The semiconductor memory according to claim 7 , wherein
a third side surface of the fourth adhesive layer above the first chip and a side surface of the second adhesive layer above the first chip are in contact with each other, and
a fourth side surface of the fourth adhesive layer above the first chip and a side surface of the third adhesive layer above the first chip are in contact with each other.
9. The semiconductor memory according to claim 1 , wherein
the adhesive layer encloses the first chip,
the semiconductor memory further comprises an intervening member entirely covering an upper surface of the first chip through the adhesive layer, and
the plurality of first modules are above the intervening member.
10. The semiconductor memory according to claim 9 , wherein the cover layer encloses the intervening member.
11. A semiconductor memory comprising:
a substrate;
a first chip provided on an upper surface of the substrate;
a plurality of first bonding wires connecting the substrate and the first chip, each of the first bonding wires being wire-bonded to the substrate and the first chip;
an intervening member entirely covering an upper surface of the first chip through a first adhesive layer enclosing the first chip, wherein
a plurality of first modules, each of the first modules partially covering an upper surface of the intervening member through a plurality of second adhesive layers, respectively;
a plurality of second bonding wires connecting the substrate and the plurality of first modules, each of the second bonding wires being wire-bonded to the substrate and one of the first modules; and
a cover layer covering the upper surface of the substrate and upper surfaces of the plurality of first modules,
wherein the plurality of first bonding wires are embedded in the first adhesive layer, and the plurality of second bonding wires are embedded in the cover layer.