Three-dimensional adhesive device having a microelectronic system embedded therein
A three-dimensional adhesive device to be attached to the body surface of a mammal including a microelectronic sensing system. The system includes (a) a three-dimensional adhesive body made of a pressure sensitive adhesive having an upper surface and a bottom surface; (b) a microelectronic system embedded in the body of the pressure sensitive adhesive; (c) one or more cover layer(s) attached to the upper surface; and (d) optionally a release liner releasably attached to the bottom surface. Suitably the microelectronic system is capable of sensing physical input such as pressure, vibration, sound, electrical activity (e,g. from muscle activity), tension, blood-flow, moisture, temperature, enzyme activity, bacteria, pH, blood sugar, conductivity, resistance, capacitance, inductance or other chemical, biochemical, biological, mechanical or electrical purposes.
1. A sensor assembly adapted to be attached to the body surface of a mammal, comprising:
an encapsulated sensor circuit including a plurality of electrical components arranged on a printed circuit board, wherein the plurality of electrical components includes an antenna and a microprocessor, wherein the encapsulated sensor circuit is encapsulated in one of a polymer film, a polymer foil, a polymer coating, a glass, or a ceramic material, and wherein the encapsulated sensor circuit has a proximal portion and a distal portion, the proximal portion of the encapsulated sensor circuit being configured to couple to the body surface of the mammal;
at least one power source for powering at least the antenna and the microprocessor of the encapsulated sensor circuit;
an adhesive device including at least one adhesive for attaching the sensor assembly to the body surface of the mammal, wherein a portion of the adhesive device extends distal to the distal portion of the encapsulated sensor circuit, the adhesive device being adhesively coupled to, and contacting, the at least one power source in a first contact area and being adhesively coupled to, and contacting, the encapsulated sensor circuit in a second contact area, wherein the adhesive coupling between the adhesive device and the power source resists greater pull force than does the adhesive coupling between the adhesive device and the encapsulated sensor circuit, and wherein the adhesive device does not include electrical contacts; and
a housing at least partially containing the encapsulated sensor circuit, the housing having a recess adapted to receive the at least one power source, wherein the housing is formed of a proximal housing part and a distal housing part;
wherein the first contact area is less than the second contact area.
2. The sensor assembly according to claim 1 , wherein the adhesive is applied to the distal side of the housing and the distal side of the at least one power source.
3. The sensor assembly according to claim 2 , wherein at least one transducer is attached to a proximal surface of the proximal housing part.
4. The sensor assembly according to claim 1 , wherein at least one transducer is attached to a proximal surface of the proximal housing part.
5. The sensor assembly according to claim 2 , wherein at least one electrical contact is provided in the distal housing part providing electrical connection between the at least one power source and the electrical components.
6. The sensor assembly according to claim 1 , wherein at least one electrical contact is provided in the distal housing part providing electrical connection between the at least one power source and the electrical components.
7. The sensor assembly according to claim 1 , wherein the housing comprises a polymer surface at the second contact area.
8. The sensor assembly according to claim 7 , wherein the housing comprises PolyDiMethylSiloxane (PDMS) at the second contact area.
9. The sensor assembly according to claim 8 , wherein the adhesive device is coated with a pressure-sensitive adhesive.
10. The sensor assembly according to claim 9 , wherein the pressure-sensitive adhesive comprises hydrocolloids or foamed adhesive.
11. The sensor assembly according to claim 4 , wherein the transducer comprises a non-invasive detecting element.
12. The sensor assembly according to claim 4 , wherein the transducer comprises an invasive detecting element.
13. The sensor assembly according to claim 11 , wherein there is no physical contact between the detecting element and the body surface of the mammal.
14. The sensor assembly according to claim 4 , wherein the transducer comprises a detecting element selected from electrodes (polar, bipolar), a pressure sensor, a needle with an electrode, an accelerometer, a photo detector, a microphone, ISFET, an NTC resistor, a band gap detector, an ion membrane, an enzyme detector or a condenser.
15. The sensor assembly according to claim 4 , wherein the transducer is capable of at least one of detecting a physiological condition, influencing a physiological condition, detecting a neurological condition, and influencing a neurological condition.
16. The sensor assembly according to claim 1 , wherein the sensor assembly is capable of measuring electromyographic (EMG) signals, electrocardiographic (ECG) signals and electroencephalography (EEG) signals.
17. A multi-sensor network comprising one or more sensor assembly according to claim 1 .
18. A multi-sensor network comprising at least two sensor assemblies according to claim 17 suitable for measuring heart rate.
19. A sensor assembly adapted to be attached to a body surface, comprising:
a sensor circuit including a plurality of electrical components arranged on a printed circuit board, wherein the plurality of electrical components includes an antenna and a microprocessor, and wherein the sensor circuit having a proximal portion and a distal portion, the proximal portion of the sensor circuit configured to couple to the body surface;
a housing containing at least the printed circuit board of the sensor circuit, the housing having a recess adapted to receive at least one power source for powering at least the antenna and the microprocessor of the sensor circuit, wherein the housing is formed of a proximal housing part and a distal housing part;
the at least one power source, wherein the at least one power source is disposed within the recess of the housing;
an adhesive device including at least one adhesive material for attaching the sensor assembly to the body surface, the adhesive device being adhesively coupled to, and contacting, the at least one power source in a first contact area and being adhesively coupled to, and contacting, the sensor circuit in a second contact area;
wherein the adhesive coupling between the adhesive device and the power source resists greater pull force than does the adhesive coupling between the adhesive device and the sensor circuit; and
wherein the adhesive device does not include electrical contacts.