Semiconductor device with transistor portion having low injection region on the bottom of a substrate
To improve the withstand capability of a transistor portion, provided is a semiconductor device including a semiconductor substrate; a transistor portion provided in the semiconductor substrate; and a diode portion provided in the semiconductor substrate and arranged adjacent to the transistor portion in a predetermined arrangement direction. The transistor portion includes a collector region provided in a bottom surface of the semiconductor substrate, at respective ends adjacent to the diode portion; and a first low injection region that is provided on a bottom surface side of the semiconductor substrate farther inward than the respective ends, and has a carrier injection density from the bottom surface side to a top surface side of the semiconductor substrate that is lower than that of the collector region.
1. A semiconductor device comprising:
a semiconductor substrate;
a transistor portion provided in the semiconductor substrate; and
a diode portion provided in the semiconductor substrate and arranged adjacent to the transistor portion in a predetermined arrangement direction,
wherein the transistor portion includes:
a collector region provided in a bottom surface of the semiconductor substrate, at respective ends of the transistor portion that are adjacent to diode portions; and
a first low injection region located within the transistor portion that is provided closer to the bottom surface than a top surface of the semiconductor substrate farther inward than the respective ends, and has a density of carrier injection between the bottom surface and the top surface of the semiconductor substrate that is lower than that of the collector region.
2. The semiconductor device according to claim 1 , wherein
the diode portion and the transistor portion are arranged in an alternating manner in the arrangement direction.
3. The semiconductor device according to claim 1 , wherein
the first low injection region includes a center of the transistor portion in the arrangement direction.
4. The semiconductor device according to claim 1 , wherein
the transistor portion includes a gate trench portion that is provided inside the semiconductor substrate from the top surface of the semiconductor substrate, and extends in an extension direction orthogonal to the arrangement direction in the top surface of the semiconductor substrate, and
a portion of the first low injection region overlaps with the gate trench portion, in a top view of the semiconductor substrate.
5. The semiconductor device according to claim 4 , further comprising:
an active region in which the transistor portion and the diode portion are arranged, and through which a current flows between the top surface and the bottom surface of the semiconductor substrate; and
a peripheral region provided between the active region and a peripheral edge of the semiconductor substrate, in a top view of the semiconductor substrate, wherein
a plurality of emitter regions are provided in the extension direction in the transistor portion, in contact with the gate trench portion and the top surface of the semiconductor substrate,
an end portion of the first low injection region on the peripheral region side in the extension direction is arranged at a predetermined distance in the extension direction from the emitter region provided closest to the peripheral region, in the top view of the semiconductor substrate, and
the predetermined distance is less than a diffusion length of a carrier injected through the first low injection region.
6. The semiconductor device according to claim 5 , wherein
an end portion of the first low injection region on the peripheral region side in the extension direction is provided in the peripheral region, in the top view of the semiconductor substrate.
7. The semiconductor device according to claim 5 , wherein
the collector region extends in the extension direction from an end portion of the first low injection region on the peripheral region side in the extension direction to the peripheral region.
8. The semiconductor device according to claim 5 , further comprising:
a first gate metal layer that extends in the arrangement direction and is provided adjacent to the active region; and
a second gate metal layer that extends in the extension direction orthogonal to the arrangement direction, is provided adjacent to the active region, and is connected to the first gate metal layer, wherein
the active region includes a corner portion that is opposite the second gate metal layer in the arrangement direction and opposite the first gate metal layer in the extension direction that is orthogonal to the arrangement direction, in the top view of the semiconductor substrate, and
the transistor portion further includes a second low injection region that is provided in the corner portion on the bottom surface side of the semiconductor substrate, and has a carrier injection density from the bottom surface side to the top surface side of the semiconductor substrate lower than that of the collector region.
9. The semiconductor device according to claim 1 , wherein
a width of the first low injection region in the arrangement direction is greater than or equal to a trench pitch in the arrangement direction and less than or equal to ⅓ of a width of the transistor portion in the arrangement direction.
10. The semiconductor device according to claim 1 , wherein
the first low injection region and the collector region have a second conductivity type, and
an integrated concentration obtained by integrating a doping concentration of the first low injection region in a depth direction of the semiconductor substrate is lower than an integrated concentration obtained by integrating a doping concentration of the collector region in the depth direction of the semiconductor substrate.
11. The semiconductor device according to claim 10 , wherein
a thickness of the first low injection region is less than a thickness of the collector region, in the depth direction of the semiconductor substrate.
12. The semiconductor device according to claim 1 , wherein
the first low injection region includes a lifetime control region that contains a lifetime killer and is provided on the bottom surface side of the semiconductor substrate.
13. The semiconductor device according to claim 1 , wherein
at least a portion of the first low injection region includes an injection inhibition region having a conductivity type that is the opposite of a conductivity type of the collector region.
14. The semiconductor device according to claim 1 , wherein
a plurality of transistor portions, among which each transistor portion is the transistor portion, are arranged in an extension direction orthogonal to the arrangement direction,
the transistor portions at respective ends in the extension direction each include the collector region and the first low injection region provided in the bottom surface of the semiconductor substrate, and
each transistor portion that is not at a respective end includes the collector region provided in the bottom surface of the semiconductor substrate, but does not include the first low injection region in the bottom surface of the semiconductor substrate.
15. The semiconductor device according to claim 1 , wherein the transistor portion includes a plurality of collector regions provided in the bottom surface of the semiconductor substrate, each collector region at an end in the predetermined arrangement direction of the transistor portion that is adjacent to the diode portion, wherein
the first low injection region is located between collector regions.
16. A semiconductor device comprising:
a semiconductor substrate;
a transistor portion provided in the semiconductor substrate; and
a diode portion provided in the semiconductor substrate and arranged adjacent to the transistor portion in a predetermined arrangement direction, wherein the transistor portion includes:
a collector region provided in a bottom surface of the semiconductor substrate, at respective ends of the transistor portion that are adjacent to diode portions; and
a first low injection region that is provided closer to the bottom surface than a top surface of the semiconductor substrate farther inward than the respective ends, and has a density of carrier injection between the bottom surface and the top surface of the semiconductor substrate that is lower than that of the collector region; and
a top surface side lifetime control region that is provided across the diode portion and part of the transistor portion in the arrangement direction, is provided on the top surface side of the semiconductor substrate, and includes a lifetime killer, wherein
the first low injection region does not overlap with the top surface side lifetime control region, in a top view of the semiconductor substrate.
17. A semiconductor device comprising:
a semiconductor substrate;
a transistor portion provided in the semiconductor substrate; and
a diode portion provided in the semiconductor substrate and arranged adjacent to the transistor portion in a predetermined arrangement direction, wherein the transistor portion includes:
a collector region provided in a bottom surface of the semiconductor substrate, at respective ends of the transistor portion that are adjacent to diode portions; and
a first low injection region that is provided closer to the bottom surface than a top surface of the semiconductor substrate farther inward than the respective ends, and has a density of carrier injection between the bottom surface and the top surface of the semiconductor substrate that is lower than that of the collector region; wherein
the first low injection region and the collector region have a second conductivity type,
an integrated concentration obtained by integrating a doping concentration of the first low injection region in a depth direction of the semiconductor substrate is lower than an integrated concentration obtained by integrating a doping concentration of the collector region in the depth direction of the semiconductor substrate, and
the doping concentration of the first low injection region is lower than the doping concentration of the collector region.
18. A semiconductor device comprising:
a semiconductor substrate;
a transistor portion provided in the semiconductor substrate; and
a diode portion provided in the semiconductor substrate and arranged adjacent to the transistor portion in a predetermined arrangement direction,
wherein the transistor portion includes:
a collector region provided in a bottom surface of the semiconductor substrate, at respective ends of the transistor portion that are adjacent to diode portions; and
a first low injection region located within the transistor portion that is provided closer to the bottom surface than a top surface of the semiconductor substrate farther inward than the respective ends, and has a doping concentration that is lower than that of the collector region.