IP Library Granted Patent US 10,866,085
Granted Patent B2
US 10,866,085 · App. 16/292,586 · Granted Dec 15, 2020

Measurement apparatus, circuit board, display device, and measurement method

Inventors: Hiroshi Ueda (Kumamoto, JP); Seiji Takaki (Tokyo, JP)
Assignee: Mitsubishi Electric Corporation
G01B11/0608H05K1/028H05K1/11H05K2201/10121H05K2201/10136H05K2201/10151
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Quick Facts
Patent No.
US 10,866,085
App. No.
16/292,586
Granted
Dec 15, 2020
Kind
B2
Abstract

The object of the present invention is to provide a technic for accurately measuring a connection state between a flexible board and a circuit board. A measurement apparatus includes a flexible board connected to a plurality of electrode terminals in a state of being superimposed on the plurality of electrode terminals provided on a circuit board, and a laser displacement meter configured to measure a height distribution of a surface of a connection portion of the plurality of electrode terminals of the circuit board. The plurality of electrode terminals are linearly arranged at a predetermined pitch, and the laser displacement meter is configured to continuously measure a height position of the surface of the connection portion while scanning from one side to an other side in an arrangement direction of the plurality of linearly arranged electrode terminals.

Claims (23)

1. A measurement apparatus, comprising:

a flexible board connected to a plurality of electrode terminals in a state of being superimposed on the plurality of electrode terminals provided on a circuit board;

a laser displacement meter configured to measure a height distribution of a surface of a connection portion of the plurality of electrode terminals of the circuit board; and

a processor,

the plurality of electrode terminals being linearly arranged at a predetermined pitch,

the laser displacement meter being configured to continuously measure a height position of the surface of the connection portion while scanning from one side to an other side in an arrangement direction of the plurality of linearly arranged electrode terminals, and the processor being configured to perform a process in which warpage and inclination existing on the flexible board and the circuit board are cancelled by averaging the measurement data measured within a range wider than a pitch of the electrode terminals centered on each measurement data relating to the height position continuously measured by the laser displacement meter, and subtracting the averaged data from each measurement data centered on.

2. The measurement apparatus according to claim 1 , wherein

the processor is configured to set a value obtained by subtracting a minimum value from a maximum value, within the range wider than the pitch of the electrode terminals, centered on each data after the process of cancelling the warpage and inclination of the flexible board, as an irregularity amount of the flexible board, and determine adequacy of a connection state of the flexible board and the circuit board based on the irregularity amount.

3. The measurement apparatus according to claim 1 , further comprising

pressing the circuit board from above to keep the circuit board horizontal.

4. The measurement apparatus according to claim 1 , further comprising

a stage on which the circuit board is placed, wherein

the stage has a suction hole formed on an upper surface thereof for adsorbing the circuit board.

5. A circuit board being a measurement object of the measurement apparatus according to claim 1 ,

the measurement apparatus being configured to perform measurement with the flexible board connected to the circuit board.

6. A display device, comprising:

the circuit board according to claim 5 , and

the flexible board.

7. A measurement method for a measurement apparatus including a flexible board connected to a plurality of electrode terminals in a state of being superimposed on the plurality of electrode terminals provided on a circuit board, and a laser displacement meter configured to measure a height distribution of a surface of a connection portion of the plurality of electrode terminals of the circuit board, comprising:

arranging the plurality of electrode terminals linearly at a predetermined pitch;

the laser displacement meter continuously measuring a height position of the surface of the connection portion while scanning from one side to an other side in an arrangement direction of the plurality of linearly arranged electrode terminals; and

averaging the measurement data measured within a range wider than a pitch of the electrode terminals centered on each measurement data relating to the height position continuously measured by the laser displacement meter, and subtracting the averaged data from each measurement data centered on to cancel warpage and inclination existing on the flexible board and the circuit board.

8. The measurement apparatus according to claim 1 , further including a stage having a plurality of suction holes formed on an upper surface of the stage for adsorbing the circuit board, every suction hole of the plurality of the suction holes being arranged linearly.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 15, 2021
From: MITSUBISHI ELECTRIC CORPORATION
To: TRIVALE TECHNOLOGIES
Reel/Frame 057651/0234 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 5, 2019
From: UEDA, HIROSHI; TAKAKI, SEIJI
To: MITSUBISHI ELECTRIC CORPORATION
Reel/Frame 048502/0814 →
Priority Claims (1)
JP 2018-055917 · Mar 23, 2018 · national
Continuity (1)
Related Publication 20190293410A1 · Sep 26, 2019