IP Library Granted Patent US 10,755,733
Granted Patent B1
US 10,755,733 · App. 16/293,142 · Granted Aug 25, 2020

Read head including semiconductor spacer and long spin diffusion length nonmagnetic conductive material and method of making thereof

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Quick Facts
Patent No.
US 10,755,733
App. No.
16/293,142
Granted
Aug 25, 2020
Kind
B1
Abstract

A read head includes a first ferromagnetic layer, a second ferromagnetic layer, a first diffusion-assist nonmagnetic metallic layer located between the first ferromagnetic layer and the second ferromagnetic layer, a second diffusion-assist nonmagnetic metallic layer located between the first ferromagnetic layer and the second ferromagnetic layer, and a semiconductor spacer layer located between the first diffusion-assist nonmagnetic metallic layer and the second diffusion-assist nonmagnetic metallic layer.

Claims (39)

1. A read head, comprising:

a first ferromagnetic layer;

a second ferromagnetic layer;

a first diffusion-assist nonmagnetic metallic layer located between the first ferromagnetic layer and the second ferromagnetic layer;

a second diffusion-assist nonmagnetic metallic layer located between the first ferromagnetic layer and the second ferromagnetic layer; and

a semiconductor spacer layer located between the first diffusion-assist nonmagnetic metallic layer and the second diffusion-assist nonmagnetic metallic layer;

wherein each of the first diffusion-assist nonmagnetic metallic layer and the second diffusion-assist nonmagnetic metallic layer comprises a metal selected from Ag, Au, Cu, or Ti; and

wherein the semiconductor spacer layer comprises a material selected from copper-indium-gallium-selenide, copper-indium-selenide or copper-gallium-selenide.

2. The read head of claim 1 , wherein the semiconductor spacer layer directly contacts both the first diffusion-assist nonmagnetic metallic layer and the second diffusion-assist nonmagnetic metallic layer.

3. The read head of claim 1 , wherein:

the first ferromagnetic layer directly contacts the first diffusion-assist nonmagnetic metallic layer; and

the second ferromagnetic layer directly contacts the second diffusion-assist nonmagnetic metallic layer.

4. The read head of claim 1 , wherein at least one of the first ferromagnetic layer and the second ferromagnetic layer comprises a ferromagnetic Heusler alloy layer.

5. The read head of claim 4 , wherein the first ferromagnetic layer and the second ferromagnetic layer comprises a Co 2 FeAl alloy or a Co 2 MnGe alloy.

6. The read head of claim 1 , wherein each of the first diffusion-assist nonmagnetic metallic layer and the second diffusion-assist nonmagnetic metallic layer has a thickness in a range from 1 monolayer of the elemental metal to 3 monolayers of the metal.

7. The read head of claim 6 , wherein the semiconductor spacer layer has a thickness in a range from 1 nm to 3 nm.

8. The read head of claim 7 , wherein each of the first ferromagnetic layer and the second ferromagnetic layer has a thickness in a range from 0.8 nm to 3 nm.

9. The read head of claim 1 , wherein:

the first ferromagnetic layer is a first free layer having a first magnetization having at least two preferred magnetization directions; and

the second ferromagnetic layer is a second free layer having a second magnetization having at least two preferred magnetization directions.

10. The head of claim 1 , further comprising a synthetic antiferromagnetic stack, wherein one of the first and the second ferromagnetic layers comprises a free layer and the other one of the first and the second ferromagnetic layers comprises a pinned reference layer.

11. The head of claim 1 , further comprising a first magnetic shield and a second magnetic shield, wherein a sensor layer stack comprising the first ferromagnetic layer, the second ferromagnetic layer, the first diffusion-assist nonmagnetic metallic layer, the second diffusion-assist nonmagnetic metallic layer and the semiconductor spacer layer is located between the first magnetic shield and the second magnetic shield.

12. A hard disk drive, comprising:

a magnetic head containing the read head of claim 1 ;

a slider supporting the magnetic head;

an actuator arm supporting the slider; and

a motor configured to control the actuator arm.

13. A read head, comprising:

a first ferromagnetic layer;

a second ferromagnetic layer;

a first diffusion-assist nonmagnetic metallic layer located between the first ferromagnetic layer and the second ferromagnetic layer;

a second diffusion-assist nonmagnetic metallic layer located between the first ferromagnetic layer and the second ferromagnetic layer; and

a semiconductor spacer layer located between the first diffusion-assist nonmagnetic metallic layer and the second diffusion-assist nonmagnetic metallic layer;

wherein at least one of the first ferromagnetic layer and the second ferromagnetic layer comprises a layer stack comprising a negative magnetostriction material layer, an amorphous nonmagnetic material layer, an amorphous magnetic material layer and a Heusler alloy magnetic material layer.

14. The read head of claim 13 , wherein:

the negative magnetostriction material layer comprises a NiFe5% alloy;

the amorphous nonmagnetic material layer comprises amorphous tantalum which directly contacts the negative magnetostriction material layer;

the amorphous magnetic material layer comprises an amorphous CoFeB alloy which directly contacts the amorphous nonmagnetic material layer; and

the Heusler alloy magnetic material layer comprises a Co 2 FeAl alloy or a Co 2 MnGe alloy which directly contacts the amorphous magnetic material layer.

Assignments (6)
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 056285 FRAME 0292 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058982/0001 →
SECURITY INTEREST Recorded May 19, 2021
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 056285/0292 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 2, 2021
From: SANDISK TECHNOLOGIES LLC
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 055116/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 15, 2019
From: ZHENG, YUANKAI; KAISER, CHRISTIAN; DIAO, ZHITAO
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 048608/0161 →