SEMICONDUCTOR DEVICE
A semiconductor device may include a semiconductor substrate provided with an IGBT range and a diode range. The semiconductor substrate may include n-type emitter regions provided in the IGBT range, a p-type body region provided in the IGBT range, a p-type anode region provided in the diode range and an n-type drift region provided across the IGBT range and the diode range. The drift region in a border inter-trench semiconductor region which is located closest to the diode range may include a high concentration layer. An n-type impurity concentration in the high concentration layer may be higher than the n-type impurity concentration in the drift region under the high concentration layer,
1 . A semiconductor device comprising an IGBT (insulated gate bipolar transistor) and a diode, the semiconductor device comprising:
a semiconductor substrate;
an upper electrode covering an upper surface of the semiconductor substrate; and
a lower electrode covering a lower surface of the semiconductor substrate,
wherein
the semiconductor substrate comprises:
an IGBT range in which a p-type collector region is provided at a position being in direct contact with the lower electrode; and
a diode range in which an n-type cathode region is provided at a position being in direct contact with the lower electrode,
a plurality of trenches is provided in the upper surface of the semiconductor substrate in the IGBT range,
gate insulating films and gate electrodes insulated from the semiconductor substrate by the gate insulating films are provided in the respective trenches,
the semiconductor substrate further comprises:
n-type emitter regions provided in the IGBT range, being in direct contact with the upper electrode, and being in direct contact with the gate insulating films;
a p-type body region provided in the IGBT range, being in direct contact with the upper electrode, and being in direct contact with the gate insulating films below the emitter regions;
a p-type anode region provided in the diode range and being in direct contact with the upper electrode; and
an n-type drift region provided across the IGBT range and the diode range, provided below the body region and above the collector region in the IGBT range, provided below the anode region and above the cathode region in the diode range, being in direct contact with the gate insulating films below the body region, and including an n-type impurity concentration lower than an n-type impurity concentration in the cathode region,
each of semiconductor regions located above lower ends of the trenches and interposed between respective pairs of the trenches is defined as an inter-trench semiconductor region,
one of the inter-trench semiconductor regions located at a position closest to the diode range is defined as a border inter-trench semiconductor region,
the drift region in the border inter-trench semiconductor region comprises a high concentration layer, and
an n-type impurity concentration in the high concentration layer is higher than the n-type impurity concentration in the drift region under the high concentration layer.
2 . The semiconductor device of claim I, wherein the high concentration layer is in direct contact with each of the gate insulating films that are located on both sides of the border inter-trench semiconductor region.
3 . The semiconductor device of claim 1 , wherein the drift region comprises an upper layer provided between the high concentration layer and the body region, and including an n-type impurity concentration lower than the n-type impurity concentration in the high concentration layer.