Semiconductor device and method of manufacturing the same
In one embodiment, a semiconductor device includes a substrate, and a plurality of insulating layers provided on the substrate. The device further includes a plurality of electrode layers provided on the substrate alternately with the plurality of insulating layers and including metal atoms and impurity atoms different from the metal atoms, lattice spacing between the metal atoms in the electrode layers being greater than lattice spacing between the metal atoms in an elemental substance of the metal atoms.
1. A semiconductor device comprising:
a substrate;
a plurality of insulating layers provided on the substrate;
a plurality of electrode layers provided on the substrate alternately with the plurality of insulating layers and including metal atoms and impurity atoms different from the metal atoms, lattice spacing between the metal atoms in the electrode layers being greater than lattice spacing between the metal atoms in an elemental substance of the metal atoms;
first and second columnar portions, each of which including a first insulator, a charge storage layer, a second insulator and a semiconductor layer that are provided in sequence in the insulating layers and the electrode layers; and
an isolation region provided apart from the first and second columnar portions in the insulating layers and the electrode layers,
wherein
a distance between the second portion and the isolation region is greater than a distance between the first portion and the isolation region, and
a concentration of the impurity atoms in the electrode layers between the second columnar portion and the first columnar portion is smaller than a concentration of the impurity atoms in the electrode layers between the first columnar portion and the isolation region.
2. The device of claim 1 , wherein the metal atoms include tungsten atoms, and the impurity atoms include silicon atoms, boron atoms or nitrogen atoms.
3. The device of claim 1 , wherein the electrode layers include the impurity atoms such that the electrode layers have a concentration gradient of the impurity atoms.
4. The device of claim 1 , wherein a concentration of the impurity atoms in the electrode layers decreases as a distance from the isolation region increases.