Flux coating device and method for solar cell panel, and apparatus for attaching interconnector of solar cell panel

1. A flux coating device for a solar cell panel, comprising:

a flux bath configured to receive flux and having an inlet and an outlet; and

a coating-amount control portion positioned on a movement path of an interconnector in the flux bath, the coating-amount control portion being configured to control a coating amount of the flux onto the interconnector,

wherein the inlet and the outlet of the flux bath are configured to pass an interconnector below a surface of the flux,

wherein the coating-amount control portion comprises a lower control member positioned at a lower portion of the movement path of the interconnector and an upper fixing member positioned at an upper portion of the movement path of the interconnector,

wherein the lower control member is positioned in a fixed state within the flux bath, and

wherein the upper fixing member is positioned in a floating state on the flux.

2. The flux coating device of claim 1 , wherein the inlet is formed at a first surface of the flux bath,

wherein the outlet is formed at a second surface of the flux bath opposite the first surface of the flux bath, and

wherein at least a part of the inlet and at least a part of the outlet are positioned below the surface of the flux in the flux bath.

3. The flux coating device of claim 2 , wherein the flux bath is further configured to coat the flux onto the interconnector by a dipping process of moving the interconnector through the flux from the inlet to the outlet without a change in a route of the interconnector by moving the interconnector in an approximately straight or linear path from the inlet to the outlet.

4. The flux coating device of claim 2 , wherein at least one of the inlet and the outlet has an open upper portion extending from an upper portion of the flux bath positioned above a surface of the flux to a portion of the flux bath positioned below the surface of the flux, or

wherein at least one of the inlet and the outlet is a hole formed at the first surface or at the second surface of the flux bath at a position located below the surface of the flux.

5. The flux coating device of claim 2 , wherein the inlet comprises a plurality of inlets positioned side by side with a uniform pitch between the plurality of inlets and at a same height at the first surface of the flux bath, and

wherein the outlet comprises a plurality of outlets positioned side by side with a uniform pitch between the plurality of outlets and at a same height at the second surface of the flux bath.

6. The flux coating device of claim 5 , wherein the plurality of inlets and the plurality of outlets are positioned at a same height relative to each other.

7. The flux coating device of claim 1 , wherein a width or diameter of the inlet and a width or diameter of the outlet are larger than a width or diameter of the interconnector.

8. The flux coating device of claim 1 , wherein the flux coating device or the flux bath is configured to move the interconnector therethrough in a non-contact state with the flux coating device or the flux bath.

9. The flux coating device of claim 1 , further comprising:

a supplying member or a spouting member formed at a lower portion of the flux bath to supply, jet, spray, eject, or spout the flux in an upward direction.

10. The flux coating device of claim 1 , further comprising:

an outer flux bath surrounding at least a portion of the flux bath, the outer flux bath being configured to flow the flux in and out of the flux bath.

11. The flux coating device of claim 10 , wherein the outer flux bath is configured to recirculate flux held in the outer flux bath between the flux bath and the outer flux bath for reuse.

12. The flux coating device of claim 1 , wherein the interconnector comprises a wiring material or a ribbon.

13. The flux coating device of claim 12 , wherein the interconnector comprises the wiring material, and

wherein the wiring material includes:

a rounded portion or a circular cross-section,

a core layer, and

a solder layer formed on a surface of the core layer.

14. An apparatus for attaching an interconnector of a solar cell panel, comprising:

a flux portion configured to coat a flux onto an interconnector; and

an attaching portion configured to attach the interconnector to a solar cell by soldering through providing pressure and heat to the interconnector and the solar cell,

wherein the flux portion includes:

a flux bath for receiving the flux and having an inlet and an outlet configured to pass the interconnector below a surface of the flux in the flux bath; and

a coating-amount control portion positioned on a movement path of an interconnector in the flux bath, the coating-amount control portion being configured to control a coating amount of the flux onto the interconnector,

wherein the coating-amount control portion comprises a lower control member positioned at a lower portion of the movement path of the interconnector and an upper fixing member positioned at an upper portion of the movement path of the interconnector,

wherein the lower control member is positioned in a fixed state within the flux bath, and

wherein the upper fixing member is positioned in a floating state on the flux.

15. The apparatus of claim 14 , wherein the interconnector comprises:

a wiring material including:

a rounded portion or a circular cross-section,

a core layer, and

a solder layer formed on a surface of the core layer; and

wherein the apparatus further comprises:

an interconnector supply portion configured to supply the interconnector to the flux portion along a process direction;

a drying portion positioned after the flux portion in the process direction, the drying portion being configured to dry the flux coated on the interconnector by the flux portion to form a flux layer on the solder layer of the wiring material;

a cutting portion configured to cut the interconnector on which the flux layer is formed; and

an interconnector transfer portion positioned after the cutting portion in the process direction, the interconnector transfer portion being configured to hold the interconnector and move the interconnector to the attaching portion.