Antenna module formed of an antenna package and a connection member
An antenna module includes a ground layer including a through-hole; a feed via disposed to pass through the through-hole; a patch antenna pattern spaced apart from the ground layer and electrically connected to one end of the feed via; a coupling patch pattern spaced apart from the patch antenna pattern; a first dielectric layer to accommodate the patch antenna pattern and the coupling patch pattern; a second dielectric layer to accommodate at least a portion of the feed via and the ground layer; and electrical connection structures disposed between the first dielectric layer and the second dielectric layer to separate the first dielectric layer from the second dielectric layer.
1. An antenna module comprising:
a ground layer comprising a through-hole;
a feed via disposed to pass through the through-hole;
a patch antenna pattern spaced apart from the ground layer and electrically connected to one end of the feed via;
a coupling patch pattern spaced apart from the patch antenna pattern;
a first dielectric layer accommodating the patch antenna pattern and the coupling patch pattern;
a second dielectric layer accommodating at least a portion of the feed via and the ground layer;
electrical connection structures disposed between the first dielectric layer and the second dielectric layer to separate the first dielectric layer from the second dielectric layer;
a low dielectric region having smaller dielectric constant than the first dielectric layer and the second dielectric layer and disposed between the patch antenna pattern and the ground layer;
a patch antenna feed line spaced apart from the ground layer and electrically connected to the feed via;
an integrated circuit (IC) spaced apart from the patch antenna feed line; and
a wiring via configured to electrically connect the patch antenna feed line to the IC.
2. The antenna module of claim 1 , wherein a dielectric constant of the first dielectric layer is greater than a dielectric constant of the second dielectric layer.
3. The antenna module of claim 1 , wherein the first dielectric layer comprises a cavity facing the second dielectric layer.
4. The antenna module of claim 1 , wherein the second dielectric layer comprises a cavity facing the first dielectric layer.
5. The antenna module of claim 1 , wherein the electrical connection structures surround the coupling patch pattern when viewed in a vertical direction.
6. The antenna module of claim 1 , further comprising an encapsulant disposed between the first dielectric layer and the second dielectric layer.
7. An antenna module comprising:
a ground layer comprising a through-hole;
a feed via disposed to pass through the through-hole;
a patch antenna pattern spaced apart from the ground layer and electrically connected to one end of the feed via;
a coupling patch pattern spaced apart from the patch antenna pattern;
a first dielectric layer accommodating the patch antenna pattern and the coupling patch pattern;
a second dielectric layer accommodating at least a portion of the feed via and the ground layer;
electrical connection structures disposed between the first dielectric layer and the second dielectric layer to separate the first dielectric layer from the second dielectric layer;
a low dielectric region having smaller dielectric constant than the first dielectric layer and the second dielectric layer and disposed between the patch antenna pattern and the ground layer; and
an end-fire antenna at least partially disposed in the second dielectric layer and spaced apart from the ground layer,
wherein a length of a surface of the second dielectric layer is greater than a length of a surface of the first dielectric layer.
8. The antenna module of claim 7 , wherein a width of a portion of the feed via corresponding to a level between the first dielectric layer and the second dielectric layer is greater than a width of other portions of the feed via.
9. The antenna module of claim 7 , further comprising a sub-substrate disposed between the first dielectric layer and the second dielectric layer and connected to the electrical connection structures,
wherein the sub-substrate includes core vias connected to the electrical connection structures.
10. An antenna module comprising:
a ground layer comprising a through-hole;
a feed via disposed to pass through the through-hole;
a patch antenna pattern spaced apart from the ground layer and electrically connected to one end of the feed via;
a coupling patch pattern spaced apart from the patch antenna pattern;
a first dielectric layer accommodating the coupling patch pattern;
a second dielectric layer accommodating the patch antenna pattern and the ground layer;
electrical connection structures disposed between the first dielectric layer and the second dielectric layer configured to electrically connect the first dielectric layer and the second dielectric layer;
an end-fire antenna at least partially disposed in the second dielectric layer and spaced apart from the ground layer;
a feed line spaced apart from the ground layer and electrically connected to the feed via or the end-fire antenna;
an integrated circuit (IC) spaced apart from the feed line; and
a wiring via configured to electrically connect the feed line to the IC.
11. The antenna module of claim 10 , wherein one or both of the first dielectric layer and the second dielectric layer comprises a cavity overlapping the patch antenna pattern when viewed in a vertical direction.
12. The antenna module of claim 11 , wherein the electrical connection structures are arranged to surround each of the cavities when viewed in the vertical direction.
13. The antenna module of claim 10 , wherein a dielectric constant of the second dielectric layer is greater than a dielectric constant of at least a portion of a space between the patch antenna pattern and the coupling patch pattern, and is smaller than a dielectric constant of the first dielectric layer.
14. An electronic device comprising:
the antenna module of claim 10 ; and
a communications module electrically connected to the antenna module.
15. An antenna module comprising:
a feed via;
a patch antenna pattern disposed on or in a first dielectric layer and electrically connected to the feed via;
a coupling patch pattern disposed on or in a second dielectric layer spaced apart from the first dielectric layer; and
electrical connection structures configured to electrically connect the first dielectric layer and the second dielectric layer,
wherein the electrical connection structures have a melting point that is lower than a melting point of the patch antenna pattern and lower than a melting point of the coupling patch pattern.
16. An electronic device comprising:
the antenna module of claim 15 ; and
a communications module electrically connected to the antenna module.