Multilayer substrate
A multilayer substrate includes a differential line including first and second line conductors provided on or in a laminated body including base material layers. The differential line includes line portions and a connecting portion that connects the line portions. The connecting portion includes first parallel conductors extending in parallel or substantially in parallel with each other, first interlayer connecting conductors that connect the first parallel conductors in parallel, and connect the first line conductor to the first parallel conductors, second parallel conductors extending in parallel or substantially in parallel with each other, and second interlayer connecting conductors that connect the second parallel conductors in parallel, and connect the second line conductor to the second parallel conductors. The first parallel conductors cross the second parallel conductors as viewed in a laminating direction of the base material layers.
1. A multilayer substrate comprising:
a laminated body including a plurality of base material layers laminated to each other; and
a differential line provided on or in the laminated body and including a first line conductor and a second line conductor; wherein
the differential line includes a plurality of line portions provided in different layers and extending in a plane direction of the plurality of base material layers, and a connecting portion that connects the plurality of line portions to each other;
the connecting portion includes:
a plurality of first parallel conductors extending in parallel or substantially in parallel with each other;
a plurality of first interlayer connecting conductors that connect the plurality of first parallel conductors in parallel, and connect the first line conductor to the plurality of first parallel conductors;
a plurality of second parallel conductors extending in parallel or substantially in parallel with each other; and
a plurality of second interlayer connecting conductors that connect the plurality of second parallel conductors in parallel, and connect the second line conductor to the plurality of second parallel conductors; and
the plurality of first parallel conductors cross the plurality of second parallel conductors, as viewed in a laminating direction of the plurality of base material layers.
2. The multilayer substrate according to claim 1 , wherein the plurality of first interlayer connecting conductors and the plurality of second interlayer connecting conductors are line symmetrical with respect to an axis in an extending direction of the first line conductor and the second line conductor, as viewed in the laminating direction of the plurality of base material layers.
3. The multilayer substrate according to claim 1 , wherein the plurality of first parallel conductors and the plurality of second parallel conductors are disposed such that a first layer including one of the plurality of first parallel conductors, a second layer including one of the plurality of second parallel conductors, a third layer including another one of the plurality of first parallel conductors, and a fourth layer including another one of the plurality of second parallel conductors are disposed sequentially in the laminating direction; and
an interlayer distance between the first layer and the second layer or an interlayer distance between the third layer and the fourth layer is shorter than an interlayer distance between the second layer and the third layer.
4. The multilayer substrate according to claim 1 , wherein the plurality of first interlayer connecting conductors and the plurality of second interlayer connecting conductors each have a horizontal cross-sectional shape in which the plurality of first interlayer connecting conductors face the plurality of second interlayer connecting conductors along linear sides thereof.
5. The multilayer substrate according to claim 4 , wherein each of the plurality of first interlayer connecting conductors and each of the plurality of second interlayer connecting conductors has a quadrangular or substantially quadrangular cross-sectional shape.
6. The multilayer substrate according to claim 4 , wherein each of the plurality of first interlayer connecting conductors and each of the plurality of second interlayer connecting conductors has a cross-sectional shape in which a cutout is provided on an outer periphery except for the linear sides at which the plurality of first interlayer connecting conductors face the plurality of second interlayer connecting conductors.
7. The multilayer substrate according to claim 4 , wherein each of the plurality of first interlayer connecting conductors and each of the plurality of second interlayer connecting conductors has a square or substantially square cross-sectional shape.
8. The multilayer substrate according to claim 1 , wherein the plurality of line portions include a first line portion including a first pair of the first line conductor and the second line conductor, and a second line portion including a second pair of the first line conductor and the second line conductor.
9. The multilayer substrate according to claim 8 , wherein positions of the first line conductor and the second line conductor in the first pair are reversed with respect to positions of the first line conductor and the second line conductor in the second pair.
10. The multilayer substrate according to claim 1 , wherein the plurality of first parallel conductors and the plurality of second parallel conductors are rotationally symmetrical by about 90° around a position at which the plurality of first parallel conductors cross the plurality of second parallel conductors.
11. The multilayer substrate according to claim 1 , wherein at least two of the plurality of first parallel conductors are provided on a first one of the plurality of base material layers, and at least two of the plurality of second parallel conductors are provided on a second one of the plurality of base material layers.