Power mesh-on-die trace bumping

1. A method of assembling a power mesh-on-die apparatus comprising:

patterning a power trace with at least two bond pads on a substrate;

forming a trace infarction on the power trace;

patterning a ground trace with at least two bond pads on the substrate;

patterning a signal trace with bond pads on the substrate;

patterning a mask to expose the bond pads;

patterning the mask to open a channel to expose the power trace;

depositing a solder trace in the channel and on the exposed power trace;

depositing solder-bump precursors on the several bond pads; and

reflowing the solder trace in the channel and the solder-bump precursors to form an integral structure to the two solder bumps and the solder trace.

2. The method of claim 1 , further including:

patterning the mask to open a channel to expose the ground trace;

depositing solder trace in the channel and on the exposed ground trace; and

wherein patterning the mask leaves the signal trace covered by the mask.

3. The method of claim 1 , further including:

coupling the power mesh-on-die apparatus to a semiconductive device; and

assembling the semiconductive device to a computing system.

4. The method of claim 1 wherein depositing a solder trace is achieved by wicking solder onto the power trace from adjacent solder bumps disposed on the at least two bond pads.

5. The method of claim 1 , further including coupling the power mesh-on-die apparatus to a semiconductive device.

6. A method of assembling a power mesh-on-die apparatus comprising:

patterning a power trace with at least two bond pads on a substrate;

patterning a ground trace with at least two bond pads on the substrate; patterning a signal trace with bond pads on the substrate;

patterning a mask to expose the bond pads;

patterning the mask to open a channel to expose the power trace;

depositing a solder trace in the channel and on the exposed power trace;

depositing solder-bump precursors on the several bond pads;

reflowing the solder trace in the channel and the solder-bump precursors to form a structure integral to the two solder bumps and the solder trace; and

reflowing the solder trace in the channel exposing the ground trace and two solder-bump precursors to form a structure integral to the two solder bumps and the ground solder trace.

7. The method of claim 6 wherein the power trace is a first power trace; further including:

patterning a subsequent power trace between two bond pads;

patterning the mask to open a channel to expose the subsequent power trace; and

depositing a subsequent solder trace in the channel and on the exposed subsequent power trace.

8. The method of claim 6 , further including:

patterning the mask to open a channel to expose the ground trace;

depositing solder trace in the channel and on the exposed ground trace; and

wherein patterning the mask leaves the signal trace covered by the mask.

9. The method of claim 6 , further including depositing solder-bump precursors on the several bond pads; and

reflowing the solder trace in the channel and the solder-bump precursors to form an integral structure to the two solder bumps and the solder trace.

10. The method of claim 6 , wherein the signal trace is a signal-1 trace, further including:

patterning a signal-2 trace on the substrate; and

wherein patterning the mask leaves the signal-2 trace covered by the mask.

11. The method of claim 6 wherein depositing a solder trace is achieved by wicking solder onto the power trace from adjacent solder bumps disposed on the at least two bond pads.

12. The method of claim 6 further including forming a trace infarction on the power trace.

13. A method of assembling a power mesh-on-die apparatus comprising:

patterning a first power trace with at least two bond pads on a substrate;

patterning a subsequent power trace between two bond pads on the substrate;

patterning a ground trace with at least two bond pads on the substrate;

patterning a signal trace with bond pads on the substrate;

patterning a mask to expose the bond pads;

patterning the mask to open a channel to expose the first power trace;

depositing a first solder trace in the channel and on the exposed first power trace;

depositing a subsequent solder trace in the channel and on the exposed subsequent power trace;

depositing solder-bump precursors on the several bond pads;

reflowing the first solder trace in the channel and the solder-bump precursors to form an integral structure to the two solder bumps and the first solder trace;

reflowing the subsequent solder trace in the channel and the solder-bump precursors to form an integral structure to the two solder bumps and the subsequent solder trace.

14. The method of claim 13 wherein depositing a solder trace is achieved by wicking solder onto the first power trace and onto the subsequent solder trace from respective adjacent solder bumps disposed on respective at least two bond pads.

15. The method of claim 13 , wherein the signal trace is a signal-1 trace, further including:

patterning a signal-2 trace on the substrate; and

wherein patterning the mask leaves the signal-2 trace covered by the mask.

16. The method of claim 13 , further including:

coupling the power mesh-on-die apparatus to a semiconductive device; and

assembling the semiconductive device to a computing system.

17. The method of claim 13 further including:

forming a first trace infarction on the first power trace; and

forming a subsequent trace infarction on the subsequent power trace.

18. The method of claim 13 , further including coupling the power mesh-on-die apparatus to a semiconductive device.

19. The method of claim 13 further including forming a first trace infarction on the first power trace.