Polycarbonate-based thermal conductivity and ductility enhanced polymer compositions and uses thereof
Thermally conductive compositions include from about 20 wt. % to about 80 wt. % of a polycarbonate polymer, from about 0.5 wt. % to about 30 wt. % of an impact modifier, and a thermal conductivity modifier. The thermal conductivity modifier includes from about 0.5 wt. % to about 10 wt. % of a high density polyethylene polymer, from about 0.5 wt. % to about 10 wt. % of a maleic anhydride type copolymer, or from about 0.01 wt. % to about 10 wt. % of an acid component. In some aspects the thermally conductive compositions have a notched Izod impact strength of at least about 30 J/m, a through-plane thermal conductivity of at least about 0.4 W/mK and/or an in-plane thermal conductivity of at least about 1.0 W/mK. Methods for making the compositions and articles formed according to the methods are also described.
1. A thermally conductive composition comprising:
a. from about 20 wt. % to about 80 wt. % of a polycarbonate polymer;
b. from about 0.5 wt. % to about 30 wt. % of an impact modifier comprising a polycarbonate/siloxane copolymer, chain branched molecular-structured polycarbonate, ethylene propylene rubber, acrylic rubber, styrene butadiene styrene, or a combination thereof; and
c. a thermal conductivity modifier comprising:
from about 0.5 wt. % to about 10 wt. % of a high density polyethylene polymer and one or more of
(a) from about 0.5 wt. % to about 10 wt. % of a maleic anhydride type copolymer comprising MAH-g-EPDM, MAH-g-EPM, MAH-g-POE, MAH-g-EBR, or MAH-g-SEBS or a combination thereof, or
(b) from about 0.01 wt. % to about 10 wt. % of an acid component comprising mono zinc phosphate, bisphenol-A diphenyl phosphate (BPADP), a phenoxyphosphazene oligomer, resorcinol diphosphate (RDP), phosphorous acid, boric acid, a phosphate ester, ethylene-acrylic acid zinc ionomer, zinc borate, or a combination thereof,
wherein the thermally conductive composition comprises a notched Izod impact strength of at least about 30 J/m, a through-plane thermal conductivity of at least about 0.4 W/mK and an in-plane thermal conductivity of at least about 1.0 W/mK.
2. The thermally conductive composition according to claim 1 , further comprising:
d. from greater than 0 wt. % to about 50 wt. % of a filler component, the filler component including one or more of a thermally insulative filler and a thermally conductive filler;
e. from greater than 0 wt. % to about 20 wt. % of an additional polymer component; or
f. from greater than 0 wt. % to about 50 wt. % of one or more additional additives.
3. The thermally conductive composition according to claim 2 , wherein the filler component comprises a thermally insulative filler, a thermally conductive filler, or a combination thereof.
4. The thermally conductive composition according to claim 3 , wherein:
the thermally insulative filler comprises H 2 Mg 3 (SiO 3 ) 4 (talc), CaCO 3 (calcium carbonate), Mg(OH) 2 (magnesium hydroxide), mica, BaO (barium oxide), γ-AlO(OH) (boehmite), α-AlO(OH) (diaspore), Al(OH) 3 (gibbsite), BaSO 4 (barium sulfate), CaSiO 3 (wollastonite), ZrO 2 (zirconium oxide), SiO 2 (silicon oxide), glass beads, glass fibers, MgO.xAl 2 O 3 (magnesium aluminate), CaMg(CO 3 ) 2 (dolomite), clay, or a combination thereof; and
the thermally conductive filler comprises AlN (aluminum nitride), BN (boron nitride), MgSiN 2 (magnesium silicon nitride), SiC (Silicon carbide), Al 4 C 3 (aluminum carbide), Al 2 Oy (aluminum oxides), AlON (aluminum oxynitride), Si 3 N 4 (silicon nitride), graphite, ceramic-coated graphite, expanded graphite, graphene, carbon fiber, carbon nanotube (CNT), graphitized carbon black, ZnS (zinc sulfide), CaO (calcium oxide), MgO (magnesium oxide), ZnO (zinc oxide), TiO 2 (titanium dioxide), or a combination thereof.
5. The thermally conductive composition according to claim 2 , wherein the thermally insulative filler comprises titanium dioxide, talc, boron nitride, graphite, or a combination thereof.
6. The thermally conductive composition according to claim 2 , wherein the filler component is in particulate form, fibrous form, or a combination of particulate form and fibrous form.
7. The thermally conductive composition according to claim 2 , wherein the filler component comprises glass fiber.
8. The thermally conductive composition according to claim 2 , wherein the filler component comprises a circular or non-circular cross section.
9. The thermally conductive composition according to claim 1 , wherein the polycarbonate polymer comprises a Bisphenol-A polycarbonate, a high molecular weight (Mw) high flow/ductile polycarbonate, a low Mw high flow/ductile polycarbonate, or a combination thereof.
10. The thermally conductive composition according to claim 9 , wherein the Bisphenol-A polycarbonate comprises: a polycarbonate copolymer including repeating units derived from Bisphenol-A and repeating units derived from sebacic acid; a Bisphenol-A polycarbonate homopolymer; or a combination thereof.
11. The thermally conductive composition according to claim 1 , wherein the composition comprises an additional polymer component comprising acrylonitrile butadiene styrene (ABS), polybutylene terephthalate (PBT), or a combination thereof.
12. An article formed from the thermally conductive composition according to claim 1 .
13. A method for forming a thermally conductive composition, the method comprising:
a. forming a mixture comprising
i. from about 20 wt. % to about 80 wt. % of a polycarbonate polymer,
ii. from about 0.5 wt. % to about 30 wt. % of an impact modifier comprising a polycarbonate/siloxane copolymer, chain branched molecular-structured polycarbonate, ethylene propylene rubber, acrylic rubber, styrene butadiene styrene, or a combination thereof, and
iii. a thermal conductivity modifier comprising
from about 0.5 wt. % to about 10 wt. % of a high density polyethylene polymer and one or more of
(a) from about 0.5 wt. % to about 10 wt. % of a maleic anhydride type copolymer comprising MAH-g-EPDM, MAH-g-EPM, MAH-g-POE, MAH-g-EBR, or MAH-g-SEBS or a combination thereof, or
(b) from about 0.01 wt. % to about 10 wt. % of an acid component comprising mono zinc phosphate, bisphenol-A diphenyl phosphate (BPADP), a phenoxyphosphazene oligomer, resorcinol diphosphate (RDP), phosphorous acid, boric acid, a phosphate ester, ethylene-acrylic acid zinc ionomer, zinc borate, or a combination thereof; and
b. injection molding or extruding the mixture to form the thermally conductive composition,
wherein the thermally conductive composition comprises a notched Izod impact strength of at least about 30 J/m, a through-plane thermal conductivity of at least about 0.4 W/mK and an in-plane thermal conductivity of at least about 1.0 W/mK.
14. The method according to claim 13 , wherein the mixture further comprises:
iv. from greater than 0 wt. % to about 50 wt. % of a filler component, the filler component including one or more of a thermally insulative filler and a thermally conductive filler;
v. from greater than 0 wt. % to about 20 wt. % of an additional polymer component; or
vi. from greater than 0 wt. % to about 50 wt. % of one or more additional additives.
15. The method according to claim 13 , wherein the polycarbonate polymer comprises: a high Mw high flow/ductile polycarbonate; a low Mw high flow/ductile polycarbonate; a polycarbonate copolymer including repeating units derived from Bisphenol-A and repeating units derived from sebacic acid; a Bisphenol-A polycarbonate homopolymer; or a combination thereof.
16. An article formed from the method of claim 13 .